-
Semiconductor device
-
Patent number 11,978,778
-
Issue date May 7, 2024
-
Rohm Co., Ltd.
-
Yuki Nakano
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
-
-
-
Semiconductor wafer
-
Patent number 11,929,229
-
Issue date Mar 12, 2024
-
MI2-FACTORY GMBH
-
Florian Krippendorf
-
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
-
-
-
-
-
-
-
Separation method of wafer
-
Patent number 11,901,231
-
Issue date Feb 13, 2024
-
Disco Corporation
-
Asahi Nomoto
-
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
-
-
-
-
-
Electronic device
-
Patent number 11,901,618
-
Issue date Feb 13, 2024
-
Innolux Corporation
-
Chia-Ping Tseng
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
-
-
-
-
-
-
-
-