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the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities
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ELECTRICITY
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Current Industry
H01L21/18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities
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last 30 patents
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Patent Grant
Method of manufacturing a bonded substrate stack by surface activation
Patent number
11,948,912
Issue date
Apr 2, 2024
Infineon Technologies AG
Alfred Sigl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Discontinuous patterned bonds for semiconductor devices and associa...
Patent number
11,901,342
Issue date
Feb 13, 2024
Micron Technology, Inc.
Scott D. Schellhammer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Carrier-assisted method for parting crystalline material along lase...
Patent number
11,901,181
Issue date
Feb 13, 2024
Wolfspeed, Inc.
Matthew Donofrio
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Methods for forming lateral heterojunctions in two-dimensional mate...
Patent number
11,894,449
Issue date
Feb 6, 2024
The Government of the United States of America, as represented by the Secreta...
Berend T. Jonker
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for processing a wide band gap semiconductor wafer using a...
Patent number
11,887,894
Issue date
Jan 30, 2024
Infineon Technologies AG
Francisco Javier Santos Rodriguez
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor memory device including integrated control circuit an...
Patent number
11,871,576
Issue date
Jan 9, 2024
Kioxia Corporation
Yoshiaki Fukuzumi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device and method for bonding of two substrates
Patent number
11,862,487
Issue date
Jan 2, 2024
EV Group E. Thallner GmbH
Markus Wimplinger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light-emitting devices having lateral heterojunctions in two-dimens...
Patent number
11,862,716
Issue date
Jan 2, 2024
The Government of the United States of America, as represented by the Secreta...
Berend T. Jonker
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Patterning a transparent wafer to form an alignment mark in the tra...
Patent number
11,854,999
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Xin-Hua Huang
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Techniques for processing devices
Patent number
11,855,064
Issue date
Dec 26, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming lateral pn junctions in III-nitrides using p-type...
Patent number
11,848,359
Issue date
Dec 19, 2023
OHIO STATE INNOVATION FOUNDATION
Siddharth Rajan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer scale bonded active photonics interposer
Patent number
11,841,531
Issue date
Dec 12, 2023
The Research Foundation for the State University of New York
Douglas Coolbaugh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit devices with an engineered substrate
Patent number
11,735,460
Issue date
Aug 22, 2023
QROMIS, Inc.
Vladimir Odnoblyudov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices
Patent number
11,728,343
Issue date
Aug 15, 2023
Samsung Electronics Co., Ltd.
Sungmin Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Patterning a transparent wafer to form an alignment mark in the tra...
Patent number
11,721,637
Issue date
Aug 8, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Xin-Hua Huang
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Three-dimensionally stretchable single crystalline semiconductor me...
Patent number
11,697,889
Issue date
Jul 11, 2023
International Business Machines Corporation
Alexander Reznicek
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Device and method for bonding substrates
Patent number
11,697,281
Issue date
Jul 11, 2023
EV Group E. Thallner GmbH
Thomas Wagenleitner
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Semiconductor device with two-dimensional materials
Patent number
11,688,605
Issue date
Jun 27, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Tse-An Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Vacuumizing device and vacuumizing method for bonding substrate
Patent number
11,664,228
Issue date
May 30, 2023
SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
Yuangen Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding structure and method of forming same
Patent number
11,664,336
Issue date
May 30, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device, method of manufacturing semiconductor device,...
Patent number
11,652,000
Issue date
May 16, 2023
Kioxia Corporation
Hidekazu Hayashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding method for cleaning non-bonding surface of substrate
Patent number
11,626,302
Issue date
Apr 11, 2023
Tokyo Electron Limited
Yuji Mimura
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Simultaneous bonding approach for high quality wafer stacking appli...
Patent number
11,621,186
Issue date
Apr 4, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Xin-Hua Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing a bonded substrate stack
Patent number
11,594,515
Issue date
Feb 28, 2023
Infineon Technologies AG
Alfred Sigl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having a pad proximate to a step structure sec...
Patent number
11,594,547
Issue date
Feb 28, 2023
Kioxia Corporation
Yoshiaki Fukuzumi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Vertical-cavity surface-emitting laser fabrication on large wafer
Patent number
11,588,299
Issue date
Feb 21, 2023
Mellanox Technologies, Ltd.
Vladimir Iakovlev
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate bonding apparatus
Patent number
11,581,188
Issue date
Feb 14, 2023
Samsung Electronics Co., Ltd.
Junhyung Kim
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Device and method for bonding of two substrates
Patent number
11,562,912
Issue date
Jan 24, 2023
EV Group E. Thallner GmbH
Markus Wimplinger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer separating method
Patent number
11,551,934
Issue date
Jan 10, 2023
Kioxia Corporation
Sho Kawadahara
B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information
Patent Grant
Device and method for bonding of substrates
Patent number
11,527,410
Issue date
Dec 13, 2022
EV Group E. Thallner GmbH
Florian Kurz
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Carrier-Assisted Method for Parting Crystalline Material Along Lase...
Publication number
20240128085
Publication date
Apr 18, 2024
Wolfspeed, Inc.
Matthew Donofrio
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR MEMORY DEVICE
Publication number
20240099013
Publication date
Mar 21, 2024
KIOXIA Corporation
Yoshiaki FUKUZUMI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PLASMA SURFACE TREATMENT FOR WAFER BONDING METHODS
Publication number
20240071746
Publication date
Feb 29, 2024
TOKYO ELECTRON LIMITED
Yu-Hao Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER BONDING PROCESS WITH REDUCED OVERLAY DISTORTION
Publication number
20240063022
Publication date
Feb 22, 2024
TOKYO ELECTRON LIMITED
Christopher Michael Netzband
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PRODUCING A PRETREATED COMPOSITE SUBSTRATE, AND PRETREAT...
Publication number
20240055251
Publication date
Feb 15, 2024
mi2-factory GmbH
Constantin CSATO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PLASMA PROCESSING APPARATUS, WAFER TO WAFER BONDING SYSTEM AND WAFE...
Publication number
20240038536
Publication date
Feb 1, 2024
Samsung Electronics Co., Ltd.
YONGIN LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PRODUCING A SEMICONDUCTOR STRUCTURE COMPRISING AN INTERF...
Publication number
20240030033
Publication date
Jan 25, 2024
Gweltaz Gaudin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING APPARATUS AND BONDING METHOD
Publication number
20240006207
Publication date
Jan 4, 2024
TOKYO ELECTRON LIMITED
Takashi Nakamitsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DE...
Publication number
20230402415
Publication date
Dec 14, 2023
WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
Tian ZENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE HOLDER AND METHOD FOR PRODUCING A SUBSTRATE HOLDER FOR B...
Publication number
20230369095
Publication date
Nov 16, 2023
EV GROUP E. THALLNER GMBH
Dominik Zinner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER BONDING STRUCTURE, WAFER BONDING METHOD AND CHIP BONDING STRU...
Publication number
20230343733
Publication date
Oct 26, 2023
WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
Guoliang YE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES
Publication number
20230343786
Publication date
Oct 26, 2023
Samsung Electronics Co., Ltd.
Sungmin KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
Publication number
20230326757
Publication date
Oct 12, 2023
EBARA CORPORATION
Masayuki SATAKE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH TWO-DIMENSIONAL MATERIALS
Publication number
20230307234
Publication date
Sep 28, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Tse-An CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE AND METHOD FOR BONDING SUBSTRATES
Publication number
20230294390
Publication date
Sep 21, 2023
EV GROUP E. THALLNER GMBH
Thomas Wagenleitner
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Bonding Structure and Method of Forming Same
Publication number
20230253354
Publication date
Aug 10, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...
Publication number
20230245927
Publication date
Aug 3, 2023
Kioxia Corporation
Hidekazu HAYASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SIMULTANEOUS BONDING APPROACH FOR HIGH QUALITY WAFER STACKING APPLI...
Publication number
20230238268
Publication date
Jul 27, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Xin-Hua Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DETACHABLE TEMPORARY SUBSTRATE COMPATIBLE WITH VERY HIGH TEMPERATUR...
Publication number
20230230868
Publication date
Jul 20, 2023
SOITEC
Hugo Biard
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR...
Publication number
20230223264
Publication date
Jul 13, 2023
CHANGXIN MEMORY TECHNOLOGIES, INC
Ling-Yi CHUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD AND APPARATUS FOR BONDING SEMICONDUCTOR SUBSTRATE
Publication number
20230215837
Publication date
Jul 6, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Ying-Jui Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE WITH CONDUCTIVE FEATURE FOR DIRECT BONDING AND METHOD OF...
Publication number
20230197453
Publication date
Jun 22, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Gaius Gillman Fountain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING A BONDED SUBSTRATE STACK BY SURFACE ACTIVATION
Publication number
20230178512
Publication date
Jun 8, 2023
Alfred Sigl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING APPARATUS AND BONDING METHOD
Publication number
20230162982
Publication date
May 25, 2023
TOKYO ELECTRON LIMITED
Hideyuki Fukushima
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME
Publication number
20230165009
Publication date
May 25, 2023
Kioxia Corporation
Yoshiaki FUKUZUMI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLUID COOLING FOR DIE STACKS
Publication number
20230154828
Publication date
May 18, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REMOVABLE STRUCTURE USED FOR THE TRANSFER OR MANIPULATION OF LAYERS...
Publication number
20230154755
Publication date
May 18, 2023
Commissariat A L'Energie Atomique et Aux Energies Alternatives
François-Xavier Darras
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT
Publication number
20230134255
Publication date
May 4, 2023
Mitsubishi Electric Corporation
Masahiro FUJIKAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PRODUCING A STACKED STRUCTURE
Publication number
20230120346
Publication date
Apr 20, 2023
SOITEC
Bruno Ghyselen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE AND METHOD FOR BONDING OF TWO SUBSTRATES
Publication number
20230117625
Publication date
Apr 20, 2023
EV GROUP E. THALLNER GMBH
Markus Wimplinger
H01 - BASIC ELECTRIC ELEMENTS