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the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities
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ELECTRICITY
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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H01L21/18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities
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last 30 patents
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Patent Grant
Semiconductor device, method of manufacturing semiconductor device,...
Patent number
12,148,666
Issue date
Nov 19, 2024
Kioxia Corporation
Hidekazu Hayashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding structure and method of forming same
Patent number
12,119,318
Issue date
Oct 15, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pseudo-substrate with improved efficiency of usage of single crysta...
Patent number
12,112,976
Issue date
Oct 8, 2024
Soitec
Fabrice Letertre
C30 - CRYSTAL GROWTH
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Patent Grant
Method of bonding substrates, microchip and method of manufacturing...
Patent number
12,103,246
Issue date
Oct 1, 2024
Ushio Denki Kabushiki Kaisha
Motohiro Sakai
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Method for producing a composite structure comprising a thin monocr...
Patent number
12,087,631
Issue date
Sep 10, 2024
Soitec
Gweltaz Gaudin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding method, bonding device, and holding member
Patent number
12,080,554
Issue date
Sep 3, 2024
Nikon Corporation
Hajime Mitsuishi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor devices
Patent number
12,068,321
Issue date
Aug 20, 2024
Samsung Electronics Co., Ltd.
Sungmin Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming a semiconductor device and a semiconductor device
Patent number
12,027,591
Issue date
Jul 2, 2024
Infineon Technologies AG
Hans-Joachim Schulze
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing a bonded substrate stack by surface activation
Patent number
11,948,912
Issue date
Apr 2, 2024
Infineon Technologies AG
Alfred Sigl
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Discontinuous patterned bonds for semiconductor devices and associa...
Patent number
11,901,342
Issue date
Feb 13, 2024
Micron Technology, Inc.
Scott D. Schellhammer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Carrier-assisted method for parting crystalline material along lase...
Patent number
11,901,181
Issue date
Feb 13, 2024
Wolfspeed, Inc.
Matthew Donofrio
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Methods for forming lateral heterojunctions in two-dimensional mate...
Patent number
11,894,449
Issue date
Feb 6, 2024
The Government of the United States of America, as represented by the Secreta...
Berend T. Jonker
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for processing a wide band gap semiconductor wafer using a...
Patent number
11,887,894
Issue date
Jan 30, 2024
Infineon Technologies AG
Francisco Javier Santos Rodriguez
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor memory device including integrated control circuit an...
Patent number
11,871,576
Issue date
Jan 9, 2024
Kioxia Corporation
Yoshiaki Fukuzumi
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Device and method for bonding of two substrates
Patent number
11,862,487
Issue date
Jan 2, 2024
EV Group E. Thallner GmbH
Markus Wimplinger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light-emitting devices having lateral heterojunctions in two-dimens...
Patent number
11,862,716
Issue date
Jan 2, 2024
The Government of the United States of America, as represented by the Secreta...
Berend T. Jonker
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Patterning a transparent wafer to form an alignment mark in the tra...
Patent number
11,854,999
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Xin-Hua Huang
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Techniques for processing devices
Patent number
11,855,064
Issue date
Dec 26, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming lateral pn junctions in III-nitrides using p-type...
Patent number
11,848,359
Issue date
Dec 19, 2023
OHIO STATE INNOVATION FOUNDATION
Siddharth Rajan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer scale bonded active photonics interposer
Patent number
11,841,531
Issue date
Dec 12, 2023
The Research Foundation for the State University of New York
Douglas Coolbaugh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit devices with an engineered substrate
Patent number
11,735,460
Issue date
Aug 22, 2023
QROMIS, Inc.
Vladimir Odnoblyudov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices
Patent number
11,728,343
Issue date
Aug 15, 2023
Samsung Electronics Co., Ltd.
Sungmin Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Patterning a transparent wafer to form an alignment mark in the tra...
Patent number
11,721,637
Issue date
Aug 8, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Xin-Hua Huang
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Three-dimensionally stretchable single crystalline semiconductor me...
Patent number
11,697,889
Issue date
Jul 11, 2023
International Business Machines Corporation
Alexander Reznicek
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Device and method for bonding substrates
Patent number
11,697,281
Issue date
Jul 11, 2023
EV Group E. Thallner GmbH
Thomas Wagenleitner
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Semiconductor device with two-dimensional materials
Patent number
11,688,605
Issue date
Jun 27, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Tse-An Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Vacuumizing device and vacuumizing method for bonding substrate
Patent number
11,664,228
Issue date
May 30, 2023
SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
Yuangen Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding structure and method of forming same
Patent number
11,664,336
Issue date
May 30, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device, method of manufacturing semiconductor device,...
Patent number
11,652,000
Issue date
May 16, 2023
Kioxia Corporation
Hidekazu Hayashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding method for cleaning non-bonding surface of substrate
Patent number
11,626,302
Issue date
Apr 11, 2023
Tokyo Electron Limited
Yuji Mimura
G06 - COMPUTING CALCULATING COUNTING
Patents Applications
last 30 patents
Information
Patent Application
SUBSTRATE CORRECTION DEVICE, SUBSTRATE LAMINATION DEVICE, SUBSTRATE...
Publication number
20240404859
Publication date
Dec 5, 2024
Nikon Corporation
Mikio USHIJIMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING STRUCTURE AND METHOD OF FORMING SAME
Publication number
20240395752
Publication date
Nov 28, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
III-N SILICON SEMICONDUCTOR WAFER
Publication number
20240395873
Publication date
Nov 28, 2024
AZUR SPACE SOLAR POWER GMBH
Atsushi NISHIKAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED SUBSTRATE FOR LASER LIFT-OFF, SUBSTRATE PROCESSING METHOD,...
Publication number
20240387176
Publication date
Nov 21, 2024
TOKYO ELECTRON LIMITED
Noboru OOIKE
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER
Publication number
20240387177
Publication date
Nov 21, 2024
Nikon Corporation
Hajime MITSUISHI
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Bond Films for Reduced Thermal Resistance and Methods Forming the Same
Publication number
20240379505
Publication date
Nov 14, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Ming-Tsu Chung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING COMPOUND SEMICONDUCTOR BONDED SUBSTRATE AND...
Publication number
20240371641
Publication date
Nov 7, 2024
Shin-Etsu Handotai Co., Ltd.
Junya ISHIZAKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TECHNIQUES FOR PROCESSING DEVICES
Publication number
20240371850
Publication date
Nov 7, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPOSITE SUBSTRATE FOR FABRICATION OF BETA GALLIUM OXIDE DEVICES
Publication number
20240347339
Publication date
Oct 17, 2024
Syrnatec, Inc.
Yash Suresh Mirchandani
B24 - GRINDING POLISHING
Information
Patent Application
HETEROGENEOUS HETEROJUNCTION BIPOLAR TRANSISTOR DEVICES AND METHODS...
Publication number
20240322002
Publication date
Sep 26, 2024
North Carolina State University
Spyridon Pavlidis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR SEPARATING...
Publication number
20240304494
Publication date
Sep 12, 2024
KIOXIA Corporation
Mariko SUMIYA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF MANUFACTURING A BONDED SUBSTRATE STACK BY SURFACE ACTIVATION
Publication number
20240274573
Publication date
Aug 15, 2024
INFINEON TECHNOLOGIES AG
Alfred Sigl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE COMPRISING AN ELECTRICALLY CONDUCTIVE BONDI...
Publication number
20240266172
Publication date
Aug 8, 2024
Commissariat A L'Energie Atomique et Aux Energies Alternatives
Frédéric Allibert
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TRENCH GATE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20240250166
Publication date
Jul 25, 2024
DENSO CORPORATION
Hidemoto TOMITA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TRANSISTOR WITH A BODY AND BACK GATE STRUCTURE IN DIFFERENT MATERIA...
Publication number
20240222440
Publication date
Jul 4, 2024
Intel Corporation
Samuel James BADER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ENGINEERED SEMICONDUCTOR SUBSTRATE
Publication number
20240203804
Publication date
Jun 20, 2024
Micron Technology, Inc.
Darwin A. Clampitt
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS AND METHODS FOR PROCESSING BONDING SEMICONDUCTOR WAFERS
Publication number
20240194478
Publication date
Jun 13, 2024
TOKYO ELECTRON LIMITED
Satohiko Hoshino
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIA...
Publication number
20240186298
Publication date
Jun 6, 2024
Micron Technology, Inc.
Scott D. Schellhammer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR TRANSFERRING A LAYER OF A HETEROSTRUCTURE
Publication number
20240178056
Publication date
May 30, 2024
SOITEC
Thierry Barge
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING DEVICE, BONDING SYSTEM, AND BONDING METHOD
Publication number
20240162063
Publication date
May 16, 2024
BONDTECH CO., LTD.
Akira YAMAUCHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Carrier-Assisted Method for Parting Crystalline Material Along Lase...
Publication number
20240128085
Publication date
Apr 18, 2024
Wolfspeed, Inc.
Matthew Donofrio
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR MEMORY DEVICE
Publication number
20240099013
Publication date
Mar 21, 2024
KIOXIA Corporation
Yoshiaki FUKUZUMI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PLASMA SURFACE TREATMENT FOR WAFER BONDING METHODS
Publication number
20240071746
Publication date
Feb 29, 2024
TOKYO ELECTRON LIMITED
Yu-Hao Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER BONDING PROCESS WITH REDUCED OVERLAY DISTORTION
Publication number
20240063022
Publication date
Feb 22, 2024
TOKYO ELECTRON LIMITED
Christopher Michael Netzband
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PRODUCING A PRETREATED COMPOSITE SUBSTRATE, AND PRETREAT...
Publication number
20240055251
Publication date
Feb 15, 2024
mi2-factory GmbH
Constantin CSATO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PLASMA PROCESSING APPARATUS, WAFER TO WAFER BONDING SYSTEM AND WAFE...
Publication number
20240038536
Publication date
Feb 1, 2024
Samsung Electronics Co., Ltd.
YONGIN LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PRODUCING A SEMICONDUCTOR STRUCTURE COMPRISING AN INTERF...
Publication number
20240030033
Publication date
Jan 25, 2024
Gweltaz Gaudin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING APPARATUS AND BONDING METHOD
Publication number
20240006207
Publication date
Jan 4, 2024
TOKYO ELECTRON LIMITED
Takashi Nakamitsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DE...
Publication number
20230402415
Publication date
Dec 14, 2023
WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
Tian ZENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE HOLDER AND METHOD FOR PRODUCING A SUBSTRATE HOLDER FOR B...
Publication number
20230369095
Publication date
Nov 16, 2023
EV GROUP E. THALLNER GMBH
Dominik Zinner
H01 - BASIC ELECTRIC ELEMENTS