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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

Current Industry

H01L25/04the devices not having separate containers

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic device with micro-photoelectric units
- Patent number 12,218,174
- Issue date Feb 4, 2025
- LG Display Co., Ltd.
- Hsien-Te Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,199,002
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Taehwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic laminated substrate, module, and method of manufacturing ce...
- Patent number 12,183,666
- Issue date Dec 31, 2024
- Murata Manufacturing Co., Ltd.
- Takuya Goitsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic device with at least one light channel and method fo...
- Patent number 12,176,330
- Issue date Dec 24, 2024
- Osram Opto Semiconductors GmbH
- Claus Jaeger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,159,821
- Issue date Dec 3, 2024
- Siliconware Precision Industries Co., Ltd.
- Ting-Yang Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked staggered electrode foil capacitor structures in semiconduc...
- Patent number 12,154,940
- Issue date Nov 26, 2024
- SARAS MICRO DEVICES, INC.
- Richard P. Sheridan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical systems fabricated by printing-based assembly
- Patent number 12,136,620
- Issue date Nov 5, 2024
- The Board of Trustees of the University of Illinois
- John A. Rogers
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package structure having packaged light detecting components within...
- Patent number 12,113,081
- Issue date Oct 8, 2024
- Taiwan RedEye Biomedical Inc.
- Shuo-Ting Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable quantum processor design
- Patent number 12,086,689
- Issue date Sep 10, 2024
- Google LLC
- Julian Shaw Kelly
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Dynamic concentrator system and method therefor
- Patent number 12,066,612
- Issue date Aug 20, 2024
- PLX, Inc.
- Malcolm Humphrey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Autonomous electrical power sources
- Patent number 12,048,850
- Issue date Jul 30, 2024
- Face International Corporation
- Clark D Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 12,040,312
- Issue date Jul 16, 2024
- Advanced Semiconductor Engineering, Inc.
- Chien-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phosphor substrate, light emitting substrate, and lighting device
- Patent number 12,040,436
- Issue date Jul 16, 2024
- DENKA COMPANY LIMITED
- Masahiro Konishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including semiconductor chips and method for producing such...
- Patent number 12,027,481
- Issue date Jul 2, 2024
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided integrated circuit module having an exposed semiconduc...
- Patent number 12,021,065
- Issue date Jun 25, 2024
- Qorvo US, Inc.
- John Robert Siomkos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoelectric conversion apparatus, photoelectric conversion system...
- Patent number 12,021,108
- Issue date Jun 25, 2024
- Canon Kabushiki Kaisha
- Junji Iwata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic semiconductor component
- Patent number 12,002,901
- Issue date Jun 4, 2024
- Osram Opto Semiconductors GmbH
- Karl Weidner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superlattice photo detector
- Patent number 11,978,814
- Issue date May 7, 2024
- Texas Instruments Incorporated
- He Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ASIC package with photonics and vertical power delivery
- Patent number 11,978,721
- Issue date May 7, 2024
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soft motherboard-rigid plugin module architecture
- Patent number 11,974,502
- Issue date Apr 30, 2024
- The Regents of the University of Colorado
- Jianliang Xiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copackaging photodetector and readout circuit for improved LiDAR de...
- Patent number 11,965,989
- Issue date Apr 23, 2024
- BEIJING VOYAGER TECHNOLOGY CO., LTD.
- Yue Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structurally embedded and inhospitable environment systems having a...
- Patent number 11,957,922
- Issue date Apr 16, 2024
- Face International Corporation
- Clark D Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra small molded module integrated with die by module-on-wafer as...
- Patent number 11,955,434
- Issue date Apr 9, 2024
- Intel Corporation
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoelectric conversion unit
- Patent number 11,957,056
- Issue date Apr 9, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hiromasa Tamaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photovoltaic cell form ultra-small IOT device with multi-level volt...
- Patent number 11,955,574
- Issue date Apr 9, 2024
- International Business Machines Corporation
- Ning Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,955,453
- Issue date Apr 9, 2024
- Ultra Display Technology Corp.
- Hsien-Te Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical device with micro-photoelectric units
- Patent number 11,935,909
- Issue date Mar 19, 2024
- LG Display Co., Ltd.
- Hsien-Te Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device having a carrier, semiconductor chip packages...
- Patent number 11,915,999
- Issue date Feb 27, 2024
- Infineon Technologies AG
- Tomasz Naeve
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,908,759
- Issue date Feb 20, 2024
- Mediatek Inc.
- Nan-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency module
- Patent number 11,903,120
- Issue date Feb 13, 2024
- Murata Manufacturing Co., Ltd.
- Tadashi Nomura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250038088
- Publication date Jan 30, 2025
- Siliconware Precision Industries Co., Ltd.
- Ting-Yang Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Making Single-Photon Detector, Single-Photon Detector Th...
- Publication number 20250015222
- Publication date Jan 9, 2025
- QUANZHOU SANAN OPTICAL COMMUNICATION TECHNOLOGY CO., LTD.
- Weizhong SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUANTUM DEVICE FOR FORMING AN ARRAY OF QUANTUM DOTS AND ASSOCIATED...
- Publication number 20250015212
- Publication date Jan 9, 2025
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Benoit BERTRAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOELECTRIC CONVERSION APPARATUS AND PHOTOELECTRIC CONVERSION SYSTEM
- Publication number 20240387453
- Publication date Nov 21, 2024
- Canon Kabushiki Kaisha
- TATSUYA MURAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED INTEGRATED CIRCUIT MODULE HAVING AN EXPOSED SEMICONDUC...
- Publication number 20240387464
- Publication date Nov 21, 2024
- Qorvo US, Inc.
- John Robert Siomkos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTONOMOUS ELECTRICAL POWER SOURCES
- Publication number 20240382774
- Publication date Nov 21, 2024
- FACE INTERNATIONAL CORPORATION
- Clark D. Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOELECTRIC CONVERSION APPARATUS, PHOTOELECTRIC CONVERSION SYSTEM...
- Publication number 20240379723
- Publication date Nov 14, 2024
- Canon Kabushiki Kaisha
- Junji Iwata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR STRUCTURE
- Publication number 20240363668
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...
- Publication number 20240355767
- Publication date Oct 24, 2024
- INFINEON TECHNOLOGIES AG
- Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTODIODE ARRAY AND METHOD FOR MANUFACTURING PHOTODIODE ARRAY
- Publication number 20240347504
- Publication date Oct 17, 2024
- KYOCERA CORPORATION
- Genshitaro KAWAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSOR AND DISPLAY APPARATUS
- Publication number 20240304597
- Publication date Sep 12, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Xiaoquan HAI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
QUANTUM PROCESSING ARCHITECTURE
- Publication number 20240260485
- Publication date Aug 1, 2024
- Samsung Electronics Co., Ltd.
- Hyeokshin KWON
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
AVALANCHE PHOTODIODE ARRAY
- Publication number 20240234616
- Publication date Jul 11, 2024
- Hamamatsu Photonics K.K.
- Hironori SONOBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SEMICONDUCTOR ELEMENT
- Publication number 20240222529
- Publication date Jul 4, 2024
- HAMAMATSU PHOTONICS K. K.
- Takahide YANAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...
- Publication number 20240213171
- Publication date Jun 27, 2024
- Intel Corporation
- Tomita YOSHIHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Asic Package With Photonics And Vertical Power Delivery
- Publication number 20240213215
- Publication date Jun 27, 2024
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20240203930
- Publication date Jun 20, 2024
- Adeia Semiconductor Solutions LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING AN OPTOELECTRONIC DEVICE
- Publication number 20240203937
- Publication date Jun 20, 2024
- FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.
- Mingjun ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH MICRO-PHOTOELECTRIC UNITS
- Publication number 20240194721
- Publication date Jun 13, 2024
- LG Display Co., Ltd.
- Hsien-Te CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DEVICE FOR ACQUIRING A 2D IMAGE AND A DEPTH IMAGE OF A SCENE
- Publication number 20240186286
- Publication date Jun 6, 2024
- Commissariat a I'Energie Atomique et aux Energies Alternatives
- Jérôme Vaillant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROXIMITY SENSOR
- Publication number 20240178184
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan Kalyani KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING AND RECEIVING DEVICE
- Publication number 20240145614
- Publication date May 2, 2024
- Commissariat a I'Energie Atomique et aux Energies Alternatives
- Florian Dupont
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD THEREOF, AND ELECT...
- Publication number 20240145522
- Publication date May 2, 2024
- Sony Semiconductor Solutions Corporation
- SHINYA YAMAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND PROCESS FOR IMPLEMENTING SILICON CARBIDE (SIC) SURFACE M...
- Publication number 20240105390
- Publication date Mar 28, 2024
- Wolfspeed, Inc.
- Kok Meng KAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH AN ARRAY OF SINGLE-PHOTON AVALANCHE DIO...
- Publication number 20240105748
- Publication date Mar 28, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Brian Patrick McGARVEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240105697
- Publication date Mar 28, 2024
- Innolux Corporation
- Yeong-E Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND HEAD WITH ELASTIC MATERIAL AROUND PERIMETER TO IMPROVE BONDING...
- Publication number 20240096825
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240057349
- Publication date Feb 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- LING-YI CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-VOLATILE FIELD PROGRAMMABLE MULTICHIP PACKAGE
- Publication number 20240056082
- Publication date Feb 15, 2024
- iCometrue Company Ltd.
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF SOLAR CELL AND IMAGE SENSOR
- Publication number 20230402482
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS

the devices not having separate containers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device with micro-photoelectric units

Semiconductor package and method of manufacturing the same

Ceramic laminated substrate, module, and method of manufacturing ce...

Optoelectronic device with at least one light channel and method fo...

Electronic package and manufacturing method thereof

Stacked staggered electrode foil capacitor structures in semiconduc...

Optical systems fabricated by printing-based assembly

Package structure having packaged light detecting components within...

Scalable quantum processor design

Dynamic concentrator system and method therefor

Autonomous electrical power sources

Semiconductor package structure and method for manufacturing the same

Phosphor substrate, light emitting substrate, and lighting device

Device including semiconductor chips and method for producing such...

Double-sided integrated circuit module having an exposed semiconduc...

Photoelectric conversion apparatus, photoelectric conversion system...

Optoelectronic semiconductor component

Superlattice photo detector

ASIC package with photonics and vertical power delivery

Soft motherboard-rigid plugin module architecture

Copackaging photodetector and readout circuit for improved LiDAR de...

Structurally embedded and inhospitable environment systems having a...

Ultra small molded module integrated with die by module-on-wafer as...

Thermoelectric conversion unit

Photovoltaic cell form ultra-small IOT device with multi-level volt...

Electronic device

Electrical device with micro-photoelectric units

Semiconductor device having a carrier, semiconductor chip packages...

Semiconductor device

Radio frequency module

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

Method for Making Single-Photon Detector, Single-Photon Detector Th...

QUANTUM DEVICE FOR FORMING AN ARRAY OF QUANTUM DOTS AND ASSOCIATED...

PHOTOELECTRIC CONVERSION APPARATUS AND PHOTOELECTRIC CONVERSION SYSTEM

DOUBLE-SIDED INTEGRATED CIRCUIT MODULE HAVING AN EXPOSED SEMICONDUC...

AUTONOMOUS ELECTRICAL POWER SOURCES

PHOTOELECTRIC CONVERSION APPARATUS, PHOTOELECTRIC CONVERSION SYSTEM...

STACKED SEMICONDUCTOR STRUCTURE

DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...

PHOTODIODE ARRAY AND METHOD FOR MANUFACTURING PHOTODIODE ARRAY

OPTICAL SENSOR AND DISPLAY APPARATUS

QUANTUM PROCESSING ARCHITECTURE

AVALANCHE PHOTODIODE ARRAY

OPTICAL SEMICONDUCTOR ELEMENT

ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...

Asic Package With Photonics And Vertical Power Delivery

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

METHOD FOR MANUFACTURING AN OPTOELECTRONIC DEVICE

ELECTRONIC DEVICE WITH MICRO-PHOTOELECTRIC UNITS

DEVICE FOR ACQUIRING A 2D IMAGE AND A DEPTH IMAGE OF A SCENE

PROXIMITY SENSOR

LIGHT EMITTING AND RECEIVING DEVICE

SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD THEREOF, AND ELECT...

DEVICE AND PROCESS FOR IMPLEMENTING SILICON CARBIDE (SIC) SURFACE M...

SEMICONDUCTOR PACKAGES WITH AN ARRAY OF SINGLE-PHOTON AVALANCHE DIO...

ELECTRONIC DEVICE

BOND HEAD WITH ELASTIC MATERIAL AROUND PERIMETER TO IMPROVE BONDING...

SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

NON-VOLATILE FIELD PROGRAMMABLE MULTICHIP PACKAGE

INTEGRATION OF SOLAR CELL AND IMAGE SENSOR