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the die mounting substrate being other than a cuboid

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  • CPC
  • H01L2924/15158
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/15158the die mounting substrate being other than a cuboid
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    NON-RECTANGULAR ELECTRONIC DEVICE COMPONENTS
    • Publication number 20190304931
    • Publication date Oct 3, 2019
    • Intel Corporation
    • Pramod Malatkar
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FINGERPRINT SENSING UNIT
    • Publication number 20180336393
    • Publication date Nov 22, 2018
    • J-METRICS TECHNOLOGY Co., Ltd.
    • Wei-Ting Lin
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    Non-Rectangular Electronic Device Components
    • Publication number 20170186705
    • Publication date Jun 29, 2017
    • Intel Corporation
    • Pramod Malatkar
    • H01 - BASIC ELECTRIC ELEMENTS