the dielectric comprising air gaps

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H01L21/7682

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/7682the dielectric comprising air gaps

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices devices including crystallized layer having m...
- Patent number 12,322,595
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Yen Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interlayer dielectric layer
- Patent number 12,322,648
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Joung-Wei Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure and a semiconductor
- Patent number 12,324,148
- Issue date Jun 3, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chih-Cheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods
- Patent number 12,322,647
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Kai Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching to reduce line wiggling
- Patent number 12,322,651
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,315,792
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Jongmin Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 12,315,734
- Issue date May 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Li-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure and manufacturing method thereof
- Patent number 12,315,761
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chung-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for removing etch stop layers
- Patent number 12,315,735
- Issue date May 27, 2025
- Applied Materials, Inc.
- Suketu Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin field-effect transistor device having contact plugs with re-ent...
- Patent number 12,310,051
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure with backside dielectric layer having...
- Patent number 12,308,287
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Che-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite conductive features and method...
- Patent number 12,308,288
- Issue date May 20, 2025
- NANYA TECHNOLOGY CORPORATION
- Tzu-Ching Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with integrated metal-insulator-metal capacitors
- Patent number 12,308,309
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Zhong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method for manufacturing the interconnec...
- Patent number 12,308,312
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Khaderbad Mrunal Abhijith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with fluorine-catching layer
- Patent number 12,308,319
- Issue date May 20, 2025
- NANYA TECHNOLOGY CORPORATION
- Kuo-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures including air gaps
- Patent number 12,308,286
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Chin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with etched landing pad surface
- Patent number 12,309,996
- Issue date May 20, 2025
- NANYA TECHNOLOGY CORPORATION
- Yen-Ho Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method of forming a porous low-k structure
- Patent number 12,300,486
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Jiun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal low temperature hermetic dielectric diffusion barriers
- Patent number 12,300,537
- Issue date May 13, 2025
- Intel Corporation
- Sean King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure
- Patent number 12,300,599
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Meng-Pei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect conductive structure comprising two conductive materials
- Patent number 12,300,611
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Teng Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure including SiOCN layer and method of forming same
- Patent number 12,293,911
- Issue date May 6, 2025
- ASM IP Holding B.V.
- YoungChol Byun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device structure and method for preparing the same
- Patent number 12,293,914
- Issue date May 6, 2025
- NANYA TECHNOLOGY CORPORATION
- Cheng-Hsiang Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reworking process of a failed hard mask for fabricating a semicondu...
- Patent number 12,293,922
- Issue date May 6, 2025
- NANYA TECHNOLOGY CORPORATION
- Wei-Chen Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,288,715
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Hua Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phase control in contact formation
- Patent number 12,288,716
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition method to form air gaps
- Patent number 12,283,520
- Issue date Apr 22, 2025
- ASM IP Holding B.V.
- Chiyu Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming method for semiconductor structure and semiconductor structure
- Patent number 12,283,519
- Issue date Apr 22, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chuxian Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming spacers for semiconductor devices including back...
- Patent number 12,283,521
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 12,283,481
- Issue date Apr 22, 2025
- United Microelectronics Corp.
- Yu Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PREPARING AIR GAP BETWEEN BIT LINE STRICTURE AND CAPACIT...
- Publication number 20250176157
- Publication date May 29, 2025
- NANYA TECHNOLOGY CORPORATION
- Cheng-Hsiang FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE HAVING AIR GAP
- Publication number 20250174492
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Yun KU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERLAYER DIELECTRIC LAYER
- Publication number 20250174493
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Joung-Wei Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING LOW DIELECTRIC CAPACITANCE, AND METHOD...
- Publication number 20250167042
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ya LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE, METHOD OF MANUFACTURING SAME, AND ELECTRONI...
- Publication number 20250167043
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Keun Wook SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE INCLUDING FUSE STRUCTURE AND METHODS FOR FORMING...
- Publication number 20250167078
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS WITH CAPACITORS
- Publication number 20250169163
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiao-Han Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES COMPRISING CARBON-DOPED SILICON NITRIDE
- Publication number 20250159877
- Publication date May 15, 2025
- Micron Technology, Inc.
- Jun Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR DEVICES COMPRISING CARBON-DOPED SI...
- Publication number 20250159878
- Publication date May 15, 2025
- Micron Technology, Inc.
- Jun Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250149438
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ren WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH LOW RC DELAY AND METHOD FOR MANUFACTURI...
- Publication number 20250149436
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Gary LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOTE PLASMA BASED DEPOSITION OF SILICON CARBIDE FILMS USING SILIC...
- Publication number 20250149328
- Publication date May 8, 2025
- LAM RESEARCH CORPORATION
- Bhadri N. VARADARAJAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HEAT DISSIPATION BY NANO PIPES
- Publication number 20250140644
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hsien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH LOW CAPACITANCE AND HIGH THERMAL CONDUC...
- Publication number 20250140698
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE RECESSING TO FORM A FULLY ALIGNED VIA
- Publication number 20250140611
- Publication date May 1, 2025
- Adeia Semiconductor Solutions LLC
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH HIGH THERMAL CONDUCTIVITY AND LOW PARAS...
- Publication number 20250140605
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ya Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250140683
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuan-Pu CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Dielectric Material Treated with Microw...
- Publication number 20250140553
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE ILD DEPOSITION FOR FULLY ALIGNED VIA WITH AIRGAP
- Publication number 20250140606
- Publication date May 1, 2025
- Adeia Semiconductor Solutions LLC
- Christopher J. Penny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTODETECTOR WITH DISTRIBUTED BRAGG REFLECTOR AND METHODS OF FORMI...
- Publication number 20250143011
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chen-Hao Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250133790
- Publication date Apr 24, 2025
- United Semiconductor (Xiamen) Co., Ltd.
- Yong XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL OXIDE COMPOSITE AS ETCH STOP LAYER
- Publication number 20250132197
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Feng Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250132198
- Publication date Apr 24, 2025
- Samsung Electronics Co., LTD
- Yunho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20250132210
- Publication date Apr 24, 2025
- UNITED MICROELECTRONICS CORP.
- Yao-Hsien Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE WITH ETCH STOP LAYER
- Publication number 20250132252
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-En CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL LINES LOCATED BETWEEN ETCH STOP LAYERS AND SEPARATED BY AIR G...
- Publication number 20250132301
- Publication date Apr 24, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Fumitaka AMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH LINER LAYER HAVING TAPERED SIDE...
- Publication number 20250132194
- Publication date Apr 24, 2025
- NANYA TECHNOLOGY CORPORATION
- JAR-MING HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING METHOD
- Publication number 20250132192
- Publication date Apr 24, 2025
- ASM IP HOLDING B.V.
- HeeSung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH LINER LAYER HAVING TAPERED SIDE...
- Publication number 20250132193
- Publication date Apr 24, 2025
- NANYA TECHNOLOGY CORPORATION
- JAR-MING HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250132237
- Publication date Apr 24, 2025
- Sony Semiconductor Solutions Corporation
- NOBUTOSHI FUJII
- H01 - BASIC ELECTRIC ELEMENTS

the dielectric comprising air gaps

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor devices devices including crystallized layer having m...

Interlayer dielectric layer

Method for forming semiconductor structure and a semiconductor

Semiconductor devices and methods

Etching to reduce line wiggling

Semiconductor device

Method for manufacturing semiconductor device

Interconnection structure and manufacturing method thereof

Methods for removing etch stop layers

Fin field-effect transistor device having contact plugs with re-ent...

Integrated circuit structure with backside dielectric layer having...

Semiconductor device with composite conductive features and method...

Semiconductor device with integrated metal-insulator-metal capacitors

Interconnect structure and method for manufacturing the interconnec...

Semiconductor device structure with fluorine-catching layer

Interconnect structures including air gaps

Semiconductor device with etched landing pad surface

System and method of forming a porous low-k structure

Conformal low temperature hermetic dielectric diffusion barriers

Method for forming semiconductor structure

Interconnect conductive structure comprising two conductive materials

Structure including SiOCN layer and method of forming same

Semiconductor device structure and method for preparing the same

Reworking process of a failed hard mask for fabricating a semicondu...

Semiconductor device and manufacturing method thereof

Phase control in contact formation

Selective deposition method to form air gaps

Forming method for semiconductor structure and semiconductor structure

Methods of forming spacers for semiconductor devices including back...

Method for manufacturing semiconductor device

Patents Applicationslast 30 patents

METHOD FOR PREPARING AIR GAP BETWEEN BIT LINE STRICTURE AND CAPACIT...

INTERCONNECTION STRUCTURE HAVING AIR GAP

INTERLAYER DIELECTRIC LAYER

SEMICONDUCTOR DEVICE HAVING LOW DIELECTRIC CAPACITANCE, AND METHOD...

INTERCONNECT STRUCTURE, METHOD OF MANUFACTURING SAME, AND ELECTRONI...

SEMICONDUCTOR DIE INCLUDING FUSE STRUCTURE AND METHODS FOR FORMING...

INTEGRATED CIRCUITS WITH CAPACITORS

SEMICONDUCTOR DEVICES COMPRISING CARBON-DOPED SILICON NITRIDE

METHODS OF FORMING SEMICONDUCTOR DEVICES COMPRISING CARBON-DOPED SI...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

INTERCONNECT STRUCTURE WITH LOW RC DELAY AND METHOD FOR MANUFACTURI...

REMOTE PLASMA BASED DEPOSITION OF SILICON CARBIDE FILMS USING SILIC...

HEAT DISSIPATION BY NANO PIPES

INTERCONNECT STRUCTURE WITH LOW CAPACITANCE AND HIGH THERMAL CONDUC...

SELECTIVE RECESSING TO FORM A FULLY ALIGNED VIA

INTERCONNECT STRUCTURE WITH HIGH THERMAL CONDUCTIVITY AND LOW PARAS...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Semiconductor Device Having Dielectric Material Treated with Microw...

SELECTIVE ILD DEPOSITION FOR FULLY ALIGNED VIA WITH AIRGAP

PHOTODETECTOR WITH DISTRIBUTED BRAGG REFLECTOR AND METHODS OF FORMI...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

METAL OXIDE COMPOSITE AS ETCH STOP LAYER

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

CHIP STRUCTURE WITH ETCH STOP LAYER

METAL LINES LOCATED BETWEEN ETCH STOP LAYERS AND SEPARATED BY AIR G...

SEMICONDUCTOR DEVICE STRUCTURE WITH LINER LAYER HAVING TAPERED SIDE...

SEMICONDUCTOR PROCESSING METHOD

SEMICONDUCTOR DEVICE STRUCTURE WITH LINER LAYER HAVING TAPERED SIDE...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE