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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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H01L21/7682
the dielectric comprising air gaps
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last 30 patents
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Structure and method for interlevel dielectric layer with regions o...
Patent number
11,955,421
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Anhao Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including a porous dielectric layer, and metho...
Patent number
11,955,424
Issue date
Apr 9, 2024
Adeia Semiconductor Solutions LLC
Benjamin David Briggs
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Methods for forming air spacers in semiconductor devices
Patent number
11,955,535
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Chia-Hao Chang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Etch damage and ESL free dual damascene metal interconnect
Patent number
11,955,376
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Sunil Kumar Singh
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Source/drain structure
Patent number
11,955,553
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Su-Hao Liu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and method for preparing semiconductor device
Patent number
11,955,371
Issue date
Apr 9, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC.
Jingwen Lu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Reverse selective etch stop layer
Patent number
11,955,382
Issue date
Apr 9, 2024
Applied Materials, Inc.
Kevin Kashefi
H01 - BASIC ELECTRIC ELEMENTS
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Method of manufacturing semiconductor device and semiconductor devices
Patent number
11,955,430
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Hsuan Lin
H01 - BASIC ELECTRIC ELEMENTS
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Differential hardmasks for modulation of electrobucket sensitivity
Patent number
11,955,377
Issue date
Apr 9, 2024
Intel Corporation
Kevin L. Lin
H01 - BASIC ELECTRIC ELEMENTS
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Bonding method of package components and bonding apparatus
Patent number
11,955,378
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Yi-Li Hsiao
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device structure and methods of forming the same
Patent number
11,948,879
Issue date
Apr 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Lin-Yu Huang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device
Patent number
11,948,888
Issue date
Apr 2, 2024
Samsung Electronics Co., Ltd.
Hongsik Shin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Etch barrier for microelectronic packaging conductive structures
Patent number
11,948,898
Issue date
Apr 2, 2024
Intel Corporation
Kristof Darmawikarta
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device and method of fabricating the same
Patent number
11,948,882
Issue date
Apr 2, 2024
Samsung Electronics Co., Ltd.
Jihoon Chang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Via patterning for integrated circuits
Patent number
11,942,424
Issue date
Mar 26, 2024
International Business Machines Corporation
Tao Li
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device cavity formation using directional deposition
Patent number
11,942,361
Issue date
Mar 26, 2024
Applied Materials, Inc.
Armin Saeedi Vahdat
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Surface modification layer for conductive feature formation
Patent number
11,942,362
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Jian-Jou Lian
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Three-dimensional memory devices and fabrication methods thereof
Patent number
11,943,923
Issue date
Mar 26, 2024
Yangtze Memory Technologies Co., Ltd.
Li Hong Xiao
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Etch stop layer in integrated circuits
Patent number
11,942,419
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Shiu-Ko JangJian
H01 - BASIC ELECTRIC ELEMENTS
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Methods of manufacturing semiconductor devices
Patent number
11,935,835
Issue date
Mar 19, 2024
Samsung Electronics Co., Ltd.
Hyo-Jin Kim
H01 - BASIC ELECTRIC ELEMENTS
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Selective deposition for integrated circuit interconnect structures
Patent number
11,935,783
Issue date
Mar 19, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Hsin-Yen Huang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Integrated circuit structure with backside dielectric layer having...
Patent number
11,935,781
Issue date
Mar 19, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Che-Lun Chang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and a method for fabricating the same
Patent number
11,935,787
Issue date
Mar 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Hui-Chi Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Silyl pseudohalides for silicon containing films
Patent number
11,932,940
Issue date
Mar 19, 2024
Applied Materials, Inc.
Keenan N. Woods
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Patent Grant
Reducing oxidation by etching sacrificial and protection layer sepa...
Patent number
11,929,281
Issue date
Mar 12, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Chia Cheng Chou
H01 - BASIC ELECTRIC ELEMENTS
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Method of manufacturing semiconductor device
Patent number
11,923,242
Issue date
Mar 5, 2024
Tokyo Electron Limited
Tatsuya Yamaguchi
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Methods of cutting metal gates and structures formed thereof
Patent number
11,923,251
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Tsu-Hsiu Perng
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Capacitor array structure and method for forming the same
Patent number
11,925,012
Issue date
Mar 5, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC.
Chaojun Sheng
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor structure having air gaps and method for manufacturin...
Patent number
11,923,306
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chia-Wei Su
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor structure having air gaps and method for manufacturin...
Patent number
11,923,243
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Hsin-Yen Huang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METAL WIRING OF SEMICONDUCTOR DEVICE
Publication number
20240120275
Publication date
Apr 11, 2024
SK HYNIX INC.
Seong Ho CHOI
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
CONTACT AIR GAP FORMATION AND STRUCTURES THEREOF
Publication number
20240112958
Publication date
Apr 4, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Sai-Hooi YEONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLID-STATE IMAGING DEVICE HAVING THROUGH ELECTRODE PROVIDED THEREI...
Publication number
20240096922
Publication date
Mar 21, 2024
SONY GROUP CORPORATION
Hideaki TOGASHI
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
Publication number
20240096797
Publication date
Mar 21, 2024
Samsung Electronics Co., Ltd.
MINJAE KANG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR STRUCTURE, STACKED STRUCTURE, AND MANUFACTURING METHO...
Publication number
20240096849
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Wei-Chung Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELECTIVE ILD DEPOSITION FOR FULLY ALIGNED VIA WITH AIRGAP
Publication number
20240096693
Publication date
Mar 21, 2024
TESSERA LLC
Christopher J. Penny
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
MULTI-METAL FILL WITH SELF-ALIGNED PATTERNING AND DIELECTRIC WITH V...
Publication number
20240085803
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Tai-I YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE WITH MATERIAL MODIFICATION AND LOW RESISTAN...
Publication number
20240087952
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Co. Ltd.
Mrunal A. Khaderbad
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240087956
Publication date
Mar 14, 2024
Samsung Electronics Co., Ltd.
Woojin LEE
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
WET ETCH PROCESS AND METHODS TO FORM AIR GAPS BETWEEN METAL INTERCO...
Publication number
20240087950
Publication date
Mar 14, 2024
TOKYO ELECTRON LIMITED
Shan Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SIDEWALL SPACER STRUCTURE ENCLOSING CONDUCTIVE WIRE SIDEWALLS TO IN...
Publication number
20240088022
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Teng Dai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR PREPARING THE SAME
Publication number
20240087895
Publication date
Mar 14, 2024
NANYA TECHNOLOGY CORPORATION
Cheng-Hsiang FAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-WAFER CAPPING LAYER FOR METAL ARCING PROTECTION
Publication number
20240079268
Publication date
Mar 7, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Hui Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
AIR GAP SPACER FORMATION FOR NANO-SCALE SEMICONDUCTOR DEVICES
Publication number
20240079266
Publication date
Mar 7, 2024
TESSERA LLC
Kangguo Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH METAL SPACERS AND METHOD FOR FABRICATING...
Publication number
20240079321
Publication date
Mar 7, 2024
NANYA TECHNOLOGY CORPORATION
KUO-HUI SU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Conductive Via With Improved Gap Filling Performance
Publication number
20240071813
Publication date
Feb 29, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Tzu-Yu Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...
Publication number
20240071919
Publication date
Feb 29, 2024
Micron Technology, Inc.
Mohad Baboli
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
Publication number
20240071818
Publication date
Feb 29, 2024
UNITED MICROELECTRONICS CORP.
I-Wei Chi
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Method for Reducing Loss of Dielectric Layer in IO Silicon Oxide Re...
Publication number
20240071760
Publication date
Feb 29, 2024
Shanghai Huali Integrated Circuit Corporation
Zhenquan Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADHESION IMPROVEMENT BETWEEN LOW-K MATERIALS AND CAP LAYERS
Publication number
20240071817
Publication date
Feb 29, 2024
Applied Materials, Inc.
Ruitong Xiong
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
SEMICONDUCTOR DEVICE AND AN ELECTRONIC SYSTEM INCLUDING THE SAME
Publication number
20240063113
Publication date
Feb 22, 2024
Samsung Electronics Co., Ltd.
Sanghun CHUN
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
Publication number
20240063126
Publication date
Feb 22, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Lin-Chen Lu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
INTEGRATED DIPOLE REGION FOR TRANSISTOR
Publication number
20240063064
Publication date
Feb 22, 2024
Applied Materials, Inc.
Srinivas Gandikota
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
VERTICAL MEMORY STRUCTURE WITH AIR GAPS AND METHOD FOR PREPARING TH...
Publication number
20240057334
Publication date
Feb 15, 2024
NANYA TECHNOLOGY CORPORATION
YUAN-YUAN LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE WITH AIR GAP IN PATTERN-DENSE REGION AND ME...
Publication number
20240055261
Publication date
Feb 15, 2024
NANYA TECHNOLOGY CORPORATION
JAR-MING HO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE HAVING AIR GAP DIELECTRIC AND METHOD OF PRE...
Publication number
20240055296
Publication date
Feb 15, 2024
NANYA TECHNOLOGY CORPORATION
Chun-Chi LAI
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
INTERCONNECTION STRUCTURE WITH COMPOSITE ISOLATION FEATURE AND METH...
Publication number
20240047361
Publication date
Feb 8, 2024
NANYA TECHNOLOGY CORPORATION
TSE-YAO HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TUNGSTEN GAP FILL WITH HYDROGEN PLASMA TREATMENT
Publication number
20240047267
Publication date
Feb 8, 2024
Tsung-Han YANG
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
INTERCONNECTION STRUCTURE WITH COMPOSITE ISOLATION FEATURE AND METH...
Publication number
20240047360
Publication date
Feb 8, 2024
NANYA TECHNOLOGY CORPORATION
TSE-YAO HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20240047270
Publication date
Feb 8, 2024
Taiwan Semiconductor Manufacturing company Ltd.
PEI-YU CHOU
H01 - BASIC ELECTRIC ELEMENTS