the dielectric comprising air gaps

Industry

CPC
H01L21/7682

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/7682the dielectric comprising air gaps

Industries

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of semiconductor structure comprising a gap an...
- Patent number 12,368,074
- Issue date Jul 22, 2025
- CHANGXI MEMORY TECHNOLOGIES, INC.
- Ting Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor device
- Patent number 12,368,098
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film transfer using substrate with etch stop layer and diffusi...
- Patent number 12,369,352
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Eugene I-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having air gap and method for manufacturing th...
- Patent number 12,368,073
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Yu Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with etched landing pad surface and manufactur...
- Patent number 12,369,298
- Issue date Jul 22, 2025
- NANYA TECHNOLOGY CORPORATION
- Yen-Ho Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structures
- Patent number 12,362,229
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Che Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal gate process and related structure
- Patent number 12,362,238
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Lun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal deposition of silicon carbide films using heterogeneous p...
- Patent number 12,359,311
- Issue date Jul 15, 2025
- Lam Research Corporation
- Matthew Scott Weimer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of performing chemical-mechanical polishing process in semi...
- Patent number 12,362,233
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Kang Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 12,354,882
- Issue date Jul 8, 2025
- Mediatek Inc.
- Po-Chao Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electron migration control in interconnect structures
- Patent number 12,354,907
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air spacer formation for semiconductor devices
- Patent number 12,356,703
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Lun Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Amorphous layers for reducing copper diffusion and method forming same
- Patent number 12,354,908
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jyh-Nan Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device with porous spacer made of low-K material and...
- Patent number 12,354,909
- Issue date Jul 8, 2025
- NANYA TECHNOLOGY CORPORATION
- Chao-Wen Lay
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 12,349,344
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Josh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface modification layer for conductive feature formation
- Patent number 12,347,724
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jian-Jou Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip with graphene based interconnect
- Patent number 12,347,776
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,349,392
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kun-Mu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with material modification and low resistan...
- Patent number 12,347,725
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mrunal A. Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and method for preparing the same
- Patent number 12,347,686
- Issue date Jul 1, 2025
- NANYA TECHNOLOGY CORPORATION
- Cheng-Hsiang Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect line for semiconductor device
- Patent number 12,341,057
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air gap through at least two metal layers
- Patent number 12,341,058
- Issue date Jun 24, 2025
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Wei-Hui Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar slab vias for integrated circuit interconnects
- Patent number 12,341,092
- Issue date Jun 24, 2025
- Intel Corporation
- Elijah Karpov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing through vias using amorphization to adjust...
- Patent number 12,341,060
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ching Kang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having air cavity
- Patent number 12,341,059
- Issue date Jun 24, 2025
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,334,438
- Issue date Jun 17, 2025
- Samsung Electronics Co., Ltd.
- Minsung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for fabricating staircase regions of a three...
- Patent number 12,334,399
- Issue date Jun 17, 2025
- Yangtze Memory Technologies Co., Ltd.
- Xiongyu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnection structures and methods of forming the...
- Patent number 12,334,431
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Remote plasma based deposition of silicon carbide films using silic...
- Patent number 12,334,332
- Issue date Jun 17, 2025
- Lam Research Corporation
- Bhadri N. Varadarajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device with adjustment layers and method for fabricat...
- Patent number 12,327,793
- Issue date Jun 10, 2025
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250239449
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kun-Yen Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE INCLUDING SiOCN LAYER AND METHOD OF FORMING SAME
- Publication number 20250239444
- Publication date Jul 24, 2025
- ASM IP HOLDING B.V.
- YoungChol Byun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF FABRICATING SAME
- Publication number 20250233014
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jheng-Hong Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING AT LEAST ONE AIR GAP AND METHOD FOR MAN...
- Publication number 20250218864
- Publication date Jul 3, 2025
- NANYA TECHNOLOGY CORPORATION
- YUAN-YUAN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250218865
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Hua CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED OXIDE AND SEAM-FIRST ETCH FOR AIR-GAPPED ISOLATION WALLS
- Publication number 20250210412
- Publication date Jun 26, 2025
- Intel Corporation
- Umang Desai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT LAYERS WITH AIR GAPS
- Publication number 20250210411
- Publication date Jun 26, 2025
- Intel Corporation
- Ananya Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES, RELATED SYSTEMS, AND METHODS OF FORMING
- Publication number 20250212413
- Publication date Jun 26, 2025
- Micron Technology, Inc.
- Yun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY FORMING COMPOSITION
- Publication number 20250206862
- Publication date Jun 26, 2025
- NISSAN CHEMICAL CORPORATION
- Kazuhiko KINOSHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES COMPRISING MULTILEVEL BITLINES, AND RELATED METH...
- Publication number 20250210511
- Publication date Jun 26, 2025
- Micron Technology, Inc.
- Yoshiaki Fukuzumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20250210415
- Publication date Jun 26, 2025
- WINBOND ELECTRONICS CORP.
- Shih-Han Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250210413
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ya Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20250210414
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TREATING METHOD AND SUBSTRATE TREATING APPARATUS
- Publication number 20250201598
- Publication date Jun 19, 2025
- SCREEN Holdings Co., Ltd.
- Yukifumi YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-FILLED CONTACT HOLE IN MICRO-FABRICATED DEVICE
- Publication number 20250201671
- Publication date Jun 19, 2025
- INFINEON TECHNOLOGIES AG
- Matthias German Dietl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECOND AIR GAP TYPE FOR SUBTRACTIVE INTERCONNECTS
- Publication number 20250192054
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING...
- Publication number 20250192056
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- KUO-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING...
- Publication number 20250192055
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- KUO-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP WITH CAVITY STRUCTURE
- Publication number 20250191971
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING AIR GAP BETWEEN BIT LINE STRICTURE AND CAPACIT...
- Publication number 20250176157
- Publication date May 29, 2025
- NANYA TECHNOLOGY CORPORATION
- Cheng-Hsiang FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE HAVING AIR GAP
- Publication number 20250174492
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Yun KU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERLAYER DIELECTRIC LAYER
- Publication number 20250174493
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Joung-Wei Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING LOW DIELECTRIC CAPACITANCE, AND METHOD...
- Publication number 20250167042
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ya LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE, METHOD OF MANUFACTURING SAME, AND ELECTRONI...
- Publication number 20250167043
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Keun Wook SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE INCLUDING FUSE STRUCTURE AND METHODS FOR FORMING...
- Publication number 20250167078
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS WITH CAPACITORS
- Publication number 20250169163
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiao-Han Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES COMPRISING CARBON-DOPED SILICON NITRIDE
- Publication number 20250159877
- Publication date May 15, 2025
- Micron Technology, Inc.
- Jun Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR DEVICES COMPRISING CARBON-DOPED SI...
- Publication number 20250159878
- Publication date May 15, 2025
- Micron Technology, Inc.
- Jun Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250149438
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ren WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH LOW RC DELAY AND METHOD FOR MANUFACTURI...
- Publication number 20250149436
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Gary LIU
- H01 - BASIC ELECTRIC ELEMENTS

the dielectric comprising air gaps

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Manufacturing method of semiconductor structure comprising a gap an...

Methods of forming semiconductor device

Thin film transfer using substrate with etch stop layer and diffusi...

Semiconductor device having air gap and method for manufacturing th...

Semiconductor device with etched landing pad surface and manufactur...

Semiconductor device structures

Metal gate process and related structure

Conformal deposition of silicon carbide films using heterogeneous p...

Methods of performing chemical-mechanical polishing process in semi...

Semiconductor structure and method for forming the same

Electron migration control in interconnect structures

Air spacer formation for semiconductor devices

Amorphous layers for reducing copper diffusion and method forming same

Semiconductor device with porous spacer made of low-K material and...

Semiconductor device and method of manufacturing

Surface modification layer for conductive feature formation

Integrated chip with graphene based interconnect

Semiconductor device and manufacturing method thereof

Semiconductor structure with material modification and low resistan...

Semiconductor device structure and method for preparing the same

Interconnect line for semiconductor device

Air gap through at least two metal layers

Planar slab vias for integrated circuit interconnects

Method for manufacturing through vias using amorphization to adjust...

Semiconductor device having air cavity

Semiconductor device

Structures and methods for fabricating staircase regions of a three...

Semiconductor interconnection structures and methods of forming the...

Remote plasma based deposition of silicon carbide films using silic...

Semiconductor device with adjustment layers and method for fabricat...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE STRUCTURE AND MANUFACTURING METHOD THEREOF

STRUCTURE INCLUDING SiOCN LAYER AND METHOD OF FORMING SAME

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF FABRICATING SAME

SEMICONDUCTOR DEVICE HAVING AT LEAST ONE AIR GAP AND METHOD FOR MAN...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

RECESSED OXIDE AND SEAM-FIRST ETCH FOR AIR-GAPPED ISOLATION WALLS

INTERCONNECT LAYERS WITH AIR GAPS

ELECTRONIC DEVICES, RELATED SYSTEMS, AND METHODS OF FORMING

CAVITY FORMING COMPOSITION

ELECTRONIC DEVICES COMPRISING MULTILEVEL BITLINES, AND RELATED METH...

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

SUBSTRATE TREATING METHOD AND SUBSTRATE TREATING APPARATUS

METAL-FILLED CONTACT HOLE IN MICRO-FABRICATED DEVICE

SECOND AIR GAP TYPE FOR SUBTRACTIVE INTERCONNECTS

SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING...

SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING...

INTEGRATED CHIP WITH CAVITY STRUCTURE

METHOD FOR PREPARING AIR GAP BETWEEN BIT LINE STRICTURE AND CAPACIT...

INTERCONNECTION STRUCTURE HAVING AIR GAP

INTERLAYER DIELECTRIC LAYER

SEMICONDUCTOR DEVICE HAVING LOW DIELECTRIC CAPACITANCE, AND METHOD...

INTERCONNECT STRUCTURE, METHOD OF MANUFACTURING SAME, AND ELECTRONI...

SEMICONDUCTOR DIE INCLUDING FUSE STRUCTURE AND METHODS FOR FORMING...

INTEGRATED CIRCUITS WITH CAPACITORS

SEMICONDUCTOR DEVICES COMPRISING CARBON-DOPED SILICON NITRIDE

METHODS OF FORMING SEMICONDUCTOR DEVICES COMPRISING CARBON-DOPED SI...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

INTERCONNECT STRUCTURE WITH LOW RC DELAY AND METHOD FOR MANUFACTURI...