the dielectric comprising air gaps

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CPC
H01L21/7682

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/7682the dielectric comprising air gaps

Industries

Patents Grantslast 30 patents

Information Patent Grant
Multi process air gap formation
- Patent number 12,183,627
- Issue date Dec 31, 2024
- Applied Materials, Inc.
- John Hautala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective recessing to form a fully aligned via
- Patent number 12,183,634
- Issue date Dec 31, 2024
- Adeia Semiconductor Solutions LLC
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and method for manufacturing the same
- Patent number 12,183,628
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuan-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure with etch stop layer
- Patent number 12,183,674
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ping-En Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom lateral expansion of contact plugs through implantation
- Patent number 12,183,632
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal interconnect structure having cap layer with different thickn...
- Patent number 12,183,626
- Issue date Dec 31, 2024
- United Microelectronics Corp.
- Yi-How Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric capping structure overlying a conductive structure to in...
- Patent number 12,176,246
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal oxide composite as etch stop layer
- Patent number 12,176,247
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cyclic spin-on coating process for forming dielectric material
- Patent number 12,170,199
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Je-Ming Kuo
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Selective passivation and selective deposition
- Patent number 12,170,197
- Issue date Dec 17, 2024
- ASM IP Holding B.V.
- Eva E. Tois
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming bottom dielectric isolation layers
- Patent number 12,170,230
- Issue date Dec 17, 2024
- Applied Materials, Inc.
- SanKuei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detection device and detection method
- Patent number 12,163,914
- Issue date Dec 10, 2024
- Shanghai Tianma Micro-Electronics Co., Ltd.
- Kaidi Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of forming the same
- Patent number 12,166,076
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jen-Hong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air spacer surrounding conductive features and method forming same
- Patent number 12,165,914
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-stacking carrier structure and method for fabricating the same
- Patent number 12,165,968
- Issue date Dec 10, 2024
- NANYA TECHNOLOGY CORPORATION
- Wei-Zhong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interconnect structure for thermal management of electrical...
- Patent number 12,165,945
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for preparing semiconductor stru...
- Patent number 12,166,028
- Issue date Dec 10, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Xiao Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate structure and semiconductor device having the same
- Patent number 12,166,126
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Chieh Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite word line structure and method...
- Patent number 12,160,988
- Issue date Dec 3, 2024
- NANYA TECHNOLOGY CORPORATION
- Chun-Chi Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an interconnect structure having an air gap and s...
- Patent number 12,159,838
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device
- Patent number 12,159,922
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jia-Chuan You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitrogen plasma treatment for improving interface between etch stop...
- Patent number 12,159,830
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hui Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method
- Patent number 12,154,824
- Issue date Nov 26, 2024
- ASM IP Holding B.V.
- Hyunchul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method and plasma processing apparatus
- Patent number 12,154,790
- Issue date Nov 26, 2024
- Tokyo Electron Limited
- Seiichi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices having air gap structures integrated with i...
- Patent number 12,148,690
- Issue date Nov 19, 2024
- Tahoe Research, LTD.
- Han Wui Then
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,148,701
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Hongsik Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Middle-of-line interconnect structure having air gap and method of...
- Patent number 12,142,520
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with damascene structur...
- Patent number 12,142,518
- Issue date Nov 12, 2024
- NANYA TECHNOLOGY CORPORATION
- Wei-Chen Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractive metal etch with improved isolation for BEOL interconnec...
- Patent number 12,142,562
- Issue date Nov 12, 2024
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,142,558
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Naoya Inoue
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH PROTECTION LINERS AND AIR GAPS AND METHOD...
- Publication number 20240429171
- Publication date Dec 26, 2024
- NANYA TECHNOLOGY CORPORATION
- Te-Yin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE WITH CAVITY AROUND THROUGH SEMICONDUCTOR VIA
- Publication number 20240429127
- Publication date Dec 26, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Dewei Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSCALE RESOLUTION, SPATIALLY-CONTROLLED CONDUCTIVITY MODULATION...
- Publication number 20240429092
- Publication date Dec 26, 2024
- Northwestern University
- Hooman Mohseni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO CREATE AIR GAPS
- Publication number 20240429091
- Publication date Dec 26, 2024
- LAM RESEARCH CORPORATION
- Patrick A. Van Cleemput
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240429319
- Publication date Dec 26, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT LAYER AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240420994
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Ling SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH AIR GAP AND METHOD FOR FABRICATING THE SAME
- Publication number 20240413007
- Publication date Dec 12, 2024
- NANYA TECHNOLOGY CORPORATION
- CHIH-WEI HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240413010
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen Ju Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY WITH BOTTOM HAVING DIELECTRIC LAYER PORTION OVER GATE BODY W...
- Publication number 20240413162
- Publication date Dec 12, 2024
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Kah Wee Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE HAVING HEAT DISSIPATION CAPABILITY AND METHO...
- Publication number 20240413075
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH AIR GAP AND METHOD FOR FABRICATING THE SAME
- Publication number 20240413008
- Publication date Dec 12, 2024
- NANYA TECHNOLOGY CORPORATION
- CHIH-WEI HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240413074
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...
- Publication number 20240413076
- Publication date Dec 12, 2024
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND ELE...
- Publication number 20240405091
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Junhyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR GAPS IN MEMORY ARRAY STRUCTURES
- Publication number 20240404875
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Chen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240404881
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240404876
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kan-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240395874
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR MEMORY DEVICE
- Publication number 20240395605
- Publication date Nov 28, 2024
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Janbo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240395699
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240395556
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CONNECTING STRUCTURE HAVING A DOPED LAYER...
- Publication number 20240395606
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH PROFILE CONTROL OF GATE CONTACT OPENING
- Publication number 20240395607
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chih HSIUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240387328
- Publication date Nov 21, 2024
- STMicroelectronics International N.V.
- Pascal Fornara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Spacers for Semiconductor Devices Including Backside Power Rails
- Publication number 20240387249
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387252
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Kai Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT PLUG
- Publication number 20240387267
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hsuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MANUFACTURING AN INTERCONNECT STRUCTURE
- Publication number 20240387358
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- KHADERBAD MRUNAL ABHIJITH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING DIELECTRIC FILM WITH HIGH RESISTANCE TO TILTING
- Publication number 20240387384
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Tsung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCALABLE PATTERNING THROUGH LAYER EXPANSION PROCESS AND RESULTING S...
- Publication number 20240387246
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS

the dielectric comprising air gaps

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multi process air gap formation

Selective recessing to form a fully aligned via

Integrated circuit and method for manufacturing the same

Chip structure with etch stop layer

Bottom lateral expansion of contact plugs through implantation

Metal interconnect structure having cap layer with different thickn...

Dielectric capping structure overlying a conductive structure to in...

Metal oxide composite as etch stop layer

Cyclic spin-on coating process for forming dielectric material

Selective passivation and selective deposition

Methods of forming bottom dielectric isolation layers

Detection device and detection method

Semiconductor device and methods of forming the same

Air spacer surrounding conductive features and method forming same

Multi-stacking carrier structure and method for fabricating the same

Thermal interconnect structure for thermal management of electrical...

Semiconductor structure and method for preparing semiconductor stru...

Gate structure and semiconductor device having the same

Semiconductor device with composite word line structure and method...

Method of forming an interconnect structure having an air gap and s...

Method of fabricating semiconductor device

Nitrogen plasma treatment for improving interface between etch stop...

Substrate processing method

Etching method and plasma processing apparatus

Microelectronic devices having air gap structures integrated with i...

Semiconductor device

Middle-of-line interconnect structure having air gap and method of...

Method for fabricating semiconductor device with damascene structur...

Subtractive metal etch with improved isolation for BEOL interconnec...

Semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH PROTECTION LINERS AND AIR GAPS AND METHOD...

STRUCTURE WITH CAVITY AROUND THROUGH SEMICONDUCTOR VIA

NANOSCALE RESOLUTION, SPATIALLY-CONTROLLED CONDUCTIVITY MODULATION...

METHOD TO CREATE AIR GAPS

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

INTERCONNECT LAYER AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE WITH AIR GAP AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

CAVITY WITH BOTTOM HAVING DIELECTRIC LAYER PORTION OVER GATE BODY W...

INTERCONNECT STRUCTURE HAVING HEAT DISSIPATION CAPABILITY AND METHO...

SEMICONDUCTOR DEVICE WITH AIR GAP AND METHOD FOR FABRICATING THE SAME

INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND ELE...

AIR GAPS IN MEMORY ARRAY STRUCTURES

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

METHOD OF MANUFACTURING SEMICONDUCTOR MEMORY DEVICE

INTEGRATED CIRCUIT STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD

SEMICONDUCTOR DEVICE WITH CONNECTING STRUCTURE HAVING A DOPED LAYER...

ETCH PROFILE CONTROL OF GATE CONTACT OPENING

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

Spacers for Semiconductor Devices Including Backside Power Rails

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

CONTACT PLUG

METHODS FOR MANUFACTURING AN INTERCONNECT STRUCTURE

FORMING DIELECTRIC FILM WITH HIGH RESISTANCE TO TILTING

SCALABLE PATTERNING THROUGH LAYER EXPANSION PROCESS AND RESULTING S...