the dielectric comprising air gaps

Industry

CPC
H01L2221/1042

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00

Current Industry

H01L2221/1042the dielectric comprising air gaps

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Air gap seal for interconnect air gap and method of fabricating the...
- Patent number 11,996,353
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air gap seal for interconnect air gap and method of fabricating the...
- Patent number 11,328,982
- Issue date May 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,282,781
- Issue date Mar 22, 2022
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC structure with air gaps and protective layer and method for manu...
- Patent number 11,094,581
- Issue date Aug 17, 2021
- The Hong Kong University of Science and Technology
- Salahuddin Raju
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-barrier deposition for air gap formation
- Patent number 11,011,414
- Issue date May 18, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,957,777
- Issue date Mar 23, 2021
- Taiwan Seminconductor Manufacturing Company Limite
- Che-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,879,364
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Che-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,867,923
- Issue date Dec 15, 2020
- Samsung Electronics Co., Ltd.
- Sang Hoon Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,854,506
- Issue date Dec 1, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Sheng Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with airgaps and dielectric-capped intercon...
- Patent number 10,707,119
- Issue date Jul 7, 2020
- GLOBALFOUNDRIES Inc.
- Nicholas V. LiCausi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with airgaps to control capacitance
- Patent number 10,665,499
- Issue date May 26, 2020
- Intel Corporation
- Miriam R. Reshotko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doric pillar supported maskless airgap structure for capacitance be...
- Patent number 10,593,627
- Issue date Mar 17, 2020
- Intel Corporation
- Kanwal Jit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure and method of forming the same
- Patent number 10,541,204
- Issue date Jan 21, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Che-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming interconnection structure
- Patent number 10,535,603
- Issue date Jan 14, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Che-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure
- Patent number 10,497,793
- Issue date Dec 3, 2019
- Taiwan Seminconductor Manufacturing Company Limited
- Che-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,483,364
- Issue date Nov 19, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Che-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-barrier deposition for air gap formation
- Patent number 10,483,161
- Issue date Nov 19, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure
- Patent number 10,164,046
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company Limited
- Che-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-barrier deposition for air gap formation
- Patent number 10,157,779
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 10,002,880
- Issue date Jun 19, 2018
- TOSHIBA MEMORY CORPORATION
- Satoshi Nagashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-barrier deposition for air gap formation
- Patent number 9,728,447
- Issue date Aug 8, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising epitaxially grown semiconductor mat...
- Patent number 9,269,724
- Issue date Feb 23, 2016
- STC.UNM
- Sang M. Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective epitaxial overgrowth comprising air gaps
- Patent number 8,937,366
- Issue date Jan 20, 2015
- STC.UNM
- Sang M. Han
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
Air Gap Seal for Interconnect Air Gap and Method of Fabricating The...
- Publication number 20240312876
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Air Gap Seal for Interconnect Air Gap and Method of Fabricating The...
- Publication number 20220262708
- Publication date Aug 18, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure and Manufacturing Method Thereof
- Publication number 20200066853
- Publication date Feb 27, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure and Manufacturing Method Thereof
- Publication number 20200058755
- Publication date Feb 20, 2020
- Taiwan Semiconductor Manufacturing Company Limited
- Che-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Barrier Deposition for Air Gap Formation
- Publication number 20200020568
- Publication date Jan 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Wei LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Barrier Deposition for Air Gap Formation
- Publication number 20190139812
- Publication date May 9, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Wei LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20190109203
- Publication date Apr 11, 2019
- Taiwan Semiconductor Manufacturing Company Limited
- Che-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Barrier Deposition for Air Gap Formation
- Publication number 20170358481
- Publication date Dec 14, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Hole Last Boxim
- Publication number 20160343718
- Publication date Nov 24, 2016
- SANDISK TECHNOLOGIES INC.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED INTERCONNECT WITH AIR GAP
- Publication number 20150162277
- Publication date Jun 11, 2015
- International Business Machines Corporation
- John H. Zhang
- H01 - BASIC ELECTRIC ELEMENTS

the dielectric comprising air gaps

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Air gap seal for interconnect air gap and method of fabricating the...

Air gap seal for interconnect air gap and method of fabricating the...

Semiconductor device and method for fabricating the same

IC structure with air gaps and protective layer and method for manu...

Multi-barrier deposition for air gap formation

Semiconductor structure and manufacturing method thereof

Semiconductor structure and manufacturing method thereof

Semiconductor device

Semiconductor device and manufacturing method thereof

Interconnect structures with airgaps and dielectric-capped intercon...

Integrated circuit with airgaps to control capacitance

Doric pillar supported maskless airgap structure for capacitance be...

Interconnection structure and method of forming the same

Method of forming interconnection structure

Method for manufacturing semiconductor structure

Semiconductor structure and manufacturing method thereof

Multi-barrier deposition for air gap formation

Method for manufacturing semiconductor structure

Multi-barrier deposition for air gap formation

Semiconductor device and method for manufacturing same

Multi-barrier deposition for air gap formation

Semiconductor device comprising epitaxially grown semiconductor mat...

Selective epitaxial overgrowth comprising air gaps

Patents Applicationslast 30 patents

Air Gap Seal for Interconnect Air Gap and Method of Fabricating The...

Air Gap Seal for Interconnect Air Gap and Method of Fabricating The...

Semiconductor Structure and Manufacturing Method Thereof

Semiconductor Structure and Manufacturing Method Thereof

Multi-Barrier Deposition for Air Gap Formation

Multi-Barrier Deposition for Air Gap Formation

METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE

Multi-Barrier Deposition for Air Gap Formation

Memory Hole Last Boxim

ADVANCED INTERCONNECT WITH AIR GAP