the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device

Industry

CPC
H03H9/1014

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Parent Industries

HELECTRICITY H03Electronic circuits H03HIMPEDANCE NETWORKS H03H9/00Networks comprising electromechanical or electro-acoustic devices Electromechanical resonators

Current Industry

H03H9/1014the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device

Industries

Patents Grantslast 30 patents

Information Patent Grant
Wafer level package and method of manufacture
- Patent number 11,929,729
- Issue date Mar 12, 2024
- RF360 Singapore Pte. Ltd.
- Markus Schieber
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Vibration element, physical quantity sensor, inertial measurement u...
- Patent number 11,888,464
- Issue date Jan 30, 2024
- Seiko Epson Corporation
- Seiichiro Ogura
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Systems and methods for packaging an acoustic device in an integrat...
- Patent number 11,855,608
- Issue date Dec 26, 2023
- RF360 SINGAPORE PTE. LTD.
- Huan En Ku
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Device on ceramic substrate
- Patent number 11,791,226
- Issue date Oct 17, 2023
- QUALCOMM Incorporated
- Je-Hsiung Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vibrator device, manufacturing method of vibrator device, electroni...
- Patent number 11,784,632
- Issue date Oct 10, 2023
- Seiko Epson Corporation
- Takashi Yamazaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Oscillator
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- Issue date Sep 19, 2023
- Seiko Epson Corporation
- Manabu Shiraki
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Oscillator
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- Issue date Sep 12, 2023
- Seiko Epson Corporation
- Manabu Shiraki
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Bulk acoustic wave/film bulk acoustic wave resonator and filter for...
- Patent number 11,601,113
- Issue date Mar 7, 2023
- Skyworks Global Pte. Ltd.
- Yiliu Wang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Vibration element, manufacturing method of vibration element, physi...
- Patent number 11,595,026
- Issue date Feb 28, 2023
- Seiko Epson Corporation
- Seiichiro Ogura
- G01 - MEASURING TESTING
Information Patent Grant
Monolithic single chip integrated radio frequency front end module...
- Patent number 11,581,306
- Issue date Feb 14, 2023
- AKOUSTIS, INC.
- Shawn R. Gibb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF front end module including hybrid filter and active circuits in...
- Patent number 11,456,721
- Issue date Sep 27, 2022
- Intel Corporation
- Feras Eid
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Acoustic wave device and method of manufacturing the same
- Patent number 11,437,563
- Issue date Sep 6, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Wook Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quartz crystal resonator, quartz crystal resonator unit, and method...
- Patent number 11,342,900
- Issue date May 24, 2022
- Murata Manufacturing Co., Ltd.
- Toru Kizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packaging for semiconductor devices
- Patent number 11,336,257
- Issue date May 17, 2022
- Semiconductor Manufacturing International (Shanghai) Corporation
- Liang Liang Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated acoustic filter on complementary metal oxide semiconduct...
- Patent number 11,309,352
- Issue date Apr 19, 2022
- QUALCOMM Incorporated
- Sinan Goktepeli
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Vibrator device, electronic apparatus, and vehicle
- Patent number 11,277,111
- Issue date Mar 15, 2022
- Seiko Epson Corporation
- Atsushi Matsuo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Frequency adjustment method of vibrator element
- Patent number 11,239,407
- Issue date Feb 1, 2022
- Seiko Epson Corporation
- Keiichi Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid filter architecture with integrated passives, acoustic wave...
- Patent number 11,206,008
- Issue date Dec 21, 2021
- Intel Corporation
- Georgios C. Dogiamis
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor package and semiconductor process
- Patent number 11,201,125
- Issue date Dec 14, 2021
- Advanced Semiconductor Engineering, Inc.
- Sheng-Chi Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Acoustic wave device and method of manufacturing the same
- Patent number 11,177,789
- Issue date Nov 16, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Wook Park
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Piezoelectric component
- Patent number 11,114,995
- Issue date Sep 7, 2021
- Kyocera Corporation
- Jiro Kohyama
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Resonator and resonance device
- Patent number 11,108,373
- Issue date Aug 31, 2021
- Murata Manufacturing Co., Ltd.
- Toshio Nishimura
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device packaging using a recyclable carrier substrate
- Patent number 11,101,160
- Issue date Aug 24, 2021
- Skyworks Solutions, Inc.
- Jiro Yota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front end module for 5.6 GHz Wi-Fi acoustic wave resonator RF filte...
- Patent number 11,063,576
- Issue date Jul 13, 2021
- AKOUSTIS, INC.
- Jeffrey B. Shealy
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Resonance device manufacturing method
- Patent number 11,063,568
- Issue date Jul 13, 2021
- Murata Manufacturing Co., Ltd.
- Shungo Morinaga
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Vibration element, manufacturing method of vibration element, physi...
- Patent number 11,025,222
- Issue date Jun 1, 2021
- Seiko Epson Corporation
- Seiichiro Ogura
- G01 - MEASURING TESTING
Information Patent Grant
5.6 GHz Wi-Fi acoustic wave resonator RF filter circuit
- Patent number 10,985,732
- Issue date Apr 20, 2021
- AKOUSTIS, INC.
- Jeffrey B. Shealy
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
5.2 GHz Wi-Fi acoustic wave resonator RF filter circuit
- Patent number 10,979,022
- Issue date Apr 13, 2021
- AKOUSTIS, INC.
- Jeffrey B. Shealy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
5.5 GHz Wi-fi 5G coexistence acoustic wave resonator RF filter circuit
- Patent number 10,979,026
- Issue date Apr 13, 2021
- AKOUSTIS, INC.
- Rohan W. Houlden
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Monolithic single chip integrated radio frequency front end module...
- Patent number 10,957,688
- Issue date Mar 23, 2021
- AKOUSTIS, INC.
- Shawn R. Gibb
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE COMPRISING AN ACOUSTIC DEVICE AND A POLYMER CAP LAYER
- Publication number 20240097648
- Publication date Mar 21, 2024
- QUALCOMM Incorporated
- Sebastian BRUNNER
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Vibration Element, Manufacturing Method of Vibration Element, Physi...
- Publication number 20230387885
- Publication date Nov 30, 2023
- SEIKO EPSON CORPORATION
- Seiichiro OGURA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Assemblies Including an Acoustic Resonator Device and Methods of Fo...
- Publication number 20230378928
- Publication date Nov 23, 2023
- Qorvo Biotechnologies LLC
- Chuck Edward Carpenter
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
OSCILLATOR
- Publication number 20230170846
- Publication date Jun 1, 2023
- SEIKO EPSON CORPORATION
- Manabu Shiraki
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Oscillator
- Publication number 20230170847
- Publication date Jun 1, 2023
- SEIKO EPSON CORPORATION
- Manabu SHIRAKI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Vibration Element, Physical Quantity Sensor, Inertial Measurement U...
- Publication number 20230109944
- Publication date Apr 13, 2023
- SEIKO EPSON CORPORATION
- Seiichiro OGURA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
FILM BULK ACOUSTIC WAVE RESONATORS AND FILTERS WITH TRANSVERSE MODE...
- Publication number 20230112677
- Publication date Apr 13, 2023
- Skyworks Solutions, Inc.
- Gong Bin Tang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SUSPENDED FRAME BULK ACOUSTIC WAVE DEVICES
- Publication number 20230105560
- Publication date Apr 6, 2023
- SKYWORKS GLOBAL PTE. LTD.
- Kwang Jae Shin
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
BULK ACOUSTIC WAVE DEVICES WITH GAP FOR IMPROVED PERFORMANCE
- Publication number 20230106034
- Publication date Apr 6, 2023
- SKYWORKS GLOBAL PTE. LTD.
- Kwang Jae Shin
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PIEZOELECTRIC VIBRATOR
- Publication number 20220173709
- Publication date Jun 2, 2022
- Murata Manufacturing Co., Ltd.
- Toru KIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED STRUCTURE OF CRYSTAL RESONATOR AND CONTROL CIRCUIT AND I...
- Publication number 20210391382
- Publication date Dec 16, 2021
- Ningbo Semiconductor International Corporation (Shanghai Branch)
- Xiaoshan QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vibration Element, Manufacturing Method Of Vibration Element, Physi...
- Publication number 20210313959
- Publication date Oct 7, 2021
- SEIKO EPSON CORPORATION
- Seiichiro OGURA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURE
- Publication number 20210226605
- Publication date Jul 22, 2021
- RF360 Europe GmbH
- Markus SCHIEBER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE ON CERAMIC SUBSTRATE
- Publication number 20210098319
- Publication date Apr 1, 2021
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BULK ACOUSTIC WAVE/FILM BULK ACOUSTIC WAVE RESONATOR AND FILTER FOR...
- Publication number 20200373911
- Publication date Nov 26, 2020
- SKYWORKS GLOBAL PTE. LTD.
- Yiliu Wang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PIEZOELECTRIC COMPONENT
- Publication number 20200274516
- Publication date Aug 27, 2020
- KYOCERA CORPORATION
- Jiro KOHYAMA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
DEVICE PACKAGING USING A RECYCLABLE CARRIER SUBSTRATE
- Publication number 20200243369
- Publication date Jul 30, 2020
- SKYWORKS SOLUTIONS, INC.
- Jiro Yota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF FRONT END MODULE INCLUDING HYBRID FILTER AND ACTIVE CIRCUITS IN...
- Publication number 20200235716
- Publication date Jul 23, 2020
- Intel Corporation
- Feras EID
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
WAFER LEVEL PACKAGING FOR SEMICONDUCTOR DEVICES
- Publication number 20200169243
- Publication date May 28, 2020
- Semiconductor Manufacturing International (Shanghai) Corporation
- LIANG LIANG GUO
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
VIBRATOR DEVICE, MANUFACTURING METHOD OF VIBRATOR DEVICE, ELECTRONI...
- Publication number 20200067484
- Publication date Feb 27, 2020
- SEIKO EPSON CORPORATION
- Takashi YAMAZAKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
5.5 GHz WI-FI 5G COEXISTENCE ACOUSTIC WAVE RESONATOR RF FILTER CIRCUIT
- Publication number 20190199316
- Publication date Jun 27, 2019
- Akoustis, Inc.
- Rohan W. HOULDEN
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
RESONATOR AND RESONANCE DEVICE
- Publication number 20190097600
- Publication date Mar 28, 2019
- Murata Manufacturing Co., Ltd.
- Kentaro Yoshii
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
RESONANCE DEVICE MANUFACTURING METHOD
- Publication number 20190089321
- Publication date Mar 21, 2019
- Murata Manufacturing Co., Ltd.
- Shungo MORINAGA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
RESONATOR AND RESONANCE DEVICE
- Publication number 20190074811
- Publication date Mar 7, 2019
- Murata Manufacturing Co., Ltd.
- Toshio Nishimura
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
RESONATOR AND RESONANCE DEVICE
- Publication number 20190074812
- Publication date Mar 7, 2019
- Murata Manufacturing Co., Ltd.
- Yoshihisa Inoue
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
OSCILLATOR AND ELECTRONIC DEVICE
- Publication number 20190006988
- Publication date Jan 3, 2019
- SEIKO EPSON CORPORATION
- Manabu KONDO
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
BULK ACOUSTIC WAVE RESONATOR
- Publication number 20180309427
- Publication date Oct 25, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Tae Yoon KIM
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
5.2 GHz Wi-Fi ACOUSTIC WAVE RESONATOR RF FILTER CIRCUIT
- Publication number 20180309422
- Publication date Oct 25, 2018
- Akoustis, Inc.
- Jeffrey B. SHEALY
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
BULK ACOUSTIC WAVE RESONATOR DEVICE
- Publication number 20180019726
- Publication date Jan 18, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Sung HAN
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Protective Cover for an Acoustic Wave Device and Fabrication Method...
- Publication number 20170272052
- Publication date Sep 21, 2017
- WIN Semiconductors Corp.
- Cheng-Kuo Lin
- G01 - MEASURING TESTING

the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wafer level package and method of manufacture

Vibration element, physical quantity sensor, inertial measurement u...

Systems and methods for packaging an acoustic device in an integrat...

Device on ceramic substrate

Vibrator device, manufacturing method of vibrator device, electroni...

Oscillator

Oscillator

Bulk acoustic wave/film bulk acoustic wave resonator and filter for...

Vibration element, manufacturing method of vibration element, physi...

Monolithic single chip integrated radio frequency front end module...

RF front end module including hybrid filter and active circuits in...

Acoustic wave device and method of manufacturing the same

Quartz crystal resonator, quartz crystal resonator unit, and method...

Wafer level packaging for semiconductor devices

Integrated acoustic filter on complementary metal oxide semiconduct...

Vibrator device, electronic apparatus, and vehicle

Frequency adjustment method of vibrator element

Hybrid filter architecture with integrated passives, acoustic wave...

Semiconductor package and semiconductor process

Acoustic wave device and method of manufacturing the same

Piezoelectric component

Resonator and resonance device

Device packaging using a recyclable carrier substrate

Front end module for 5.6 GHz Wi-Fi acoustic wave resonator RF filte...

Resonance device manufacturing method

Vibration element, manufacturing method of vibration element, physi...

5.6 GHz Wi-Fi acoustic wave resonator RF filter circuit

5.2 GHz Wi-Fi acoustic wave resonator RF filter circuit

5.5 GHz Wi-fi 5G coexistence acoustic wave resonator RF filter circuit

Monolithic single chip integrated radio frequency front end module...

Patents Applicationslast 30 patents

PACKAGE COMPRISING AN ACOUSTIC DEVICE AND A POLYMER CAP LAYER

Vibration Element, Manufacturing Method of Vibration Element, Physi...

Assemblies Including an Acoustic Resonator Device and Methods of Fo...

OSCILLATOR

Oscillator

Vibration Element, Physical Quantity Sensor, Inertial Measurement U...

FILM BULK ACOUSTIC WAVE RESONATORS AND FILTERS WITH TRANSVERSE MODE...

SUSPENDED FRAME BULK ACOUSTIC WAVE DEVICES

BULK ACOUSTIC WAVE DEVICES WITH GAP FOR IMPROVED PERFORMANCE

PIEZOELECTRIC VIBRATOR

INTEGRATED STRUCTURE OF CRYSTAL RESONATOR AND CONTROL CIRCUIT AND I...

Vibration Element, Manufacturing Method Of Vibration Element, Physi...

WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURE

DEVICE ON CERAMIC SUBSTRATE

BULK ACOUSTIC WAVE/FILM BULK ACOUSTIC WAVE RESONATOR AND FILTER FOR...

PIEZOELECTRIC COMPONENT

DEVICE PACKAGING USING A RECYCLABLE CARRIER SUBSTRATE

RF FRONT END MODULE INCLUDING HYBRID FILTER AND ACTIVE CIRCUITS IN...

WAFER LEVEL PACKAGING FOR SEMICONDUCTOR DEVICES

VIBRATOR DEVICE, MANUFACTURING METHOD OF VIBRATOR DEVICE, ELECTRONI...

5.5 GHz WI-FI 5G COEXISTENCE ACOUSTIC WAVE RESONATOR RF FILTER CIRCUIT

RESONATOR AND RESONANCE DEVICE

RESONANCE DEVICE MANUFACTURING METHOD

RESONATOR AND RESONANCE DEVICE

RESONATOR AND RESONANCE DEVICE

OSCILLATOR AND ELECTRONIC DEVICE

BULK ACOUSTIC WAVE RESONATOR

5.2 GHz Wi-Fi ACOUSTIC WAVE RESONATOR RF FILTER CIRCUIT

BULK ACOUSTIC WAVE RESONATOR DEVICE

Protective Cover for an Acoustic Wave Device and Fabrication Method...