the enclosure being defined by a non-uniform sealing mass covering the non-active sides of the BAW device

Industry

CPC
H03H9/1085

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Parent Industries

HELECTRICITY H03Electronic circuits H03HIMPEDANCE NETWORKS H03H9/00Networks comprising electromechanical or electro-acoustic devices Electromechanical resonators

Current Industry

H03H9/1085the enclosure being defined by a non-uniform sealing mass covering the non-active sides of the BAW device

Industries

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of mounting structure, and sheet therefor
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- Issue date Dec 19, 2023
- Nagase Chemtex Corporation
- Takayuki Hashimoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electronic component
- Patent number 11,817,846
- Issue date Nov 14, 2023
- Murata Manufacturing Co., Ltd.
- Yasuaki Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elastic wave device
- Patent number 11,764,752
- Issue date Sep 19, 2023
- Murata Manufacturing Co., Ltd.
- Masatoshi Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elastic wave device and electronic component
- Patent number 11,764,753
- Issue date Sep 19, 2023
- Murata Manufacturing Co., Ltd.
- Takashi Iwamoto
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Composite component and mounting structure therefor
- Patent number 11,509,289
- Issue date Nov 22, 2022
- Murata Manufacturing Co., Ltd.
- Katsuya Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Acoustic wave filter, multiplexer, and communication apparatus
- Patent number 11,309,867
- Issue date Apr 19, 2022
- Kyocera Corporation
- Tomonori Urata
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electronic component device
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- Issue date Feb 1, 2022
- Murata Manufacturing Co., Ltd.
- Masato Nomiya
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Elastic wave device
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- Issue date Jan 18, 2022
- Murata Manufacturing Co., Ltd.
- Kenichi Uesaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package including cavity defined by resin and method of...
- Patent number 10,999,932
- Issue date May 4, 2021
- SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.
- Atsushi Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface acoustic wave (SAW) device with antireflective structure
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- Issue date Feb 16, 2021
- Qorvo US, Inc.
- Marc Solal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
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- Issue date Feb 9, 2021
- Murata Manufacturing Co., Ltd.
- Takashi Iwamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elastic wave device
- Patent number 10,862,450
- Issue date Dec 8, 2020
- Murata Manufacturing Co., Ltd.
- Masaharu Fujiya
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Transversely-excited film bulk acoustic resonator package and method
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- Issue date Oct 27, 2020
- RESONANT INC.
- Patrick Turner
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electronic component-containing module
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- Issue date Jul 7, 2020
- Murata Manufacturing Co., Ltd.
- Yoshiharu Suemori
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electronic component with two substrates enclosing functional eleme...
- Patent number 10,659,003
- Issue date May 19, 2020
- Taiyo Yuden Co., Ltd.
- Hidetaro Nakazawa
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Elastic wave device, radio-frequency front-end circuit, and communi...
- Patent number 10,637,433
- Issue date Apr 28, 2020
- Murata Manufacturing Co., Ltd.
- Yuji Fukuda
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electronic component and manufacturing method therefor
- Patent number 10,637,431
- Issue date Apr 28, 2020
- Murata Manufacturing Co., Ltd.
- Mitsuyoshi Hira
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Piezoelectric device and manufacturing method therefor
- Patent number 10,594,297
- Issue date Mar 17, 2020
- Murata Manufacturing Co., Ltd.
- Takashi Iwamoto
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electronic component having a reinforced hollowed structure
- Patent number 10,593,861
- Issue date Mar 17, 2020
- Murata Manufacturing Co., Ltd.
- Masaaki Kanae
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Elastic wave element and elastic wave apparatus
- Patent number 10,586,778
- Issue date Mar 10, 2020
- Murata Manufacturing Co., Ltd.
- Kenichi Uesaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Acoustic wave device and manufacturing method for same
- Patent number 10,530,333
- Issue date Jan 7, 2020
- Murata Manufacturing Co., Ltd.
- Yutaka Kishimoto
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Acoustic wave device and method of manufacturing the same
- Patent number 10,447,411
- Issue date Oct 15, 2019
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Wook Park
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
High-frequency module
- Patent number 10,340,883
- Issue date Jul 2, 2019
- Murata Manufacturing Co., Ltd.
- Yukiteru Sugaya
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Embedded RF filter package structure and method of manufacturing th...
- Patent number 10,333,493
- Issue date Jun 25, 2019
- General Electric Company
- Kaustubh Ravindra Nagarkar
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electronic component device, method of mounting electronic componen...
- Patent number 10,319,682
- Issue date Jun 11, 2019
- Murata Manufacturing Co., Ltd.
- Kazushi Watanabe
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electronic package including cavity defined by resin and method of...
- Patent number 10,321,572
- Issue date Jun 11, 2019
- SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.
- Atsushi Takano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electronic component module
- Patent number 10,305,444
- Issue date May 28, 2019
- Murata Manufacturing Co., Ltd.
- Takashi Iwamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin sheet for sealing electronic device and method for manufactur...
- Patent number 10,297,470
- Issue date May 21, 2019
- Nitto Denko Corporation
- Yusaku Shimizu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Wave separator
- Patent number 9,998,096
- Issue date Jun 12, 2018
- Murata Manufacturing Co., Ltd.
- Soichi Nakamura
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electronic component and method for manufacturing the same
- Patent number 9,978,929
- Issue date May 22, 2018
- Murata Manufacturing Co., Ltd.
- Mitsuyoshi Hira
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
ACOUSTIC WAVE DEVICE
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- Publication date Mar 21, 2024
- Murata Manufacturing Co., Ltd.
- Toshiki TABEI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PACKAGED ACOUSTIC WAVE DEVICES WITH MULTILAYER PIEZOELECTRIC SUBSTRATE
- Publication number 20240007079
- Publication date Jan 4, 2024
- Skyworks Solutions, Inc.
- Rei Goto
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
RADIO FREQUENCY MODULE AND COMMUNICATION DEVICE
- Publication number 20230380120
- Publication date Nov 23, 2023
- MURATA MANUFACTURING CO., LTD.
- Kunitoshi HANAOKA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20230188113
- Publication date Jun 15, 2023
- Murata Manufacturing Co., Ltd.
- Yoshiharu SUEMORI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATOR PACKAGE AND METHOD
- Publication number 20230170867
- Publication date Jun 1, 2023
- Murata Manufacturing Co., Ltd.
- Patrick Turner
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
INTEGRATION OF CARBON NANOTUBES IN PACKAGE FILLER AND GEL OVERCOAT
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- Publication date Mar 16, 2023
- Skyworks Solutions, Inc.
- Akio Mitsuhashi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ACOUSTIC WAVE FILTER AND COMMUNICATION APPARATUS
- Publication number 20220345112
- Publication date Oct 27, 2022
- KYOCERA CORPORATION
- Motoki ITO
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220190805
- Publication date Jun 16, 2022
- KYOCERA CORPORATION
- Akira OIKAWA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD OF FABRICATING TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESON...
- Publication number 20220029606
- Publication date Jan 27, 2022
- Resonant inc.
- Patrick Turner
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATOR PACKAGE AND METHOD
- Publication number 20220029607
- Publication date Jan 27, 2022
- Resonant inc.
- Patrick Turner
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATOR PACKAGE
- Publication number 20220029608
- Publication date Jan 27, 2022
- Resonant inc.
- Patrick Turner
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATOR PACKAGE AND METHOD
- Publication number 20220029609
- Publication date Jan 27, 2022
- Resonant inc.
- Patrick Turner
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PACKAGE COMPRISING STACKED FILTERS
- Publication number 20210376816
- Publication date Dec 2, 2021
- RF360 EUROPE GMBH
- Robert Felix Bywalez
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ACOUSTIC WAVE ELEMENT AND ACOUSTIC WAVE DEVICE
- Publication number 20210297058
- Publication date Sep 23, 2021
- Murata Manufacturing Co., Ltd.
- Sunao YAMAZAKI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATOR PACKAGE
- Publication number 20210050843
- Publication date Feb 18, 2021
- RESONANT INC.
- Patrick Turner
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATOR PACKAGE
- Publication number 20210044275
- Publication date Feb 11, 2021
- RESONANT INC.
- Patrick Turner
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATOR PACKAGE
- Publication number 20210044277
- Publication date Feb 11, 2021
- RESONANT INC.
- Patrick Turner
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATOR PACKAGE AND METHOD
- Publication number 20210044274
- Publication date Feb 11, 2021
- RESONANT INC.
- Patrick Turner
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATOR PACKAGE
- Publication number 20210044276
- Publication date Feb 11, 2021
- RESONANT INC.
- Patrick Turner
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATOR
- Publication number 20200382101
- Publication date Dec 3, 2020
- RESONANT INC.
- Patrick Turner
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATOR PACKAGE AND METHOD
- Publication number 20200321939
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- RESONANT INC.
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- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MANUFACTURING METHOD OF MOUNTING STRUCTURE, AND SHEET THEREFOR
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- Nagase Chemtex Corporation
- Takayuki HASHIMOTO
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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ELECTRONIC COMPONENT DEVICE
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- Publication date Apr 9, 2020
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Information Patent Application
SURFACE ACOUSTIC WAVE ELEMENT PACKAGE AND MANUFACTURING METHOD THEREOF
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Information Patent Application
ELECTRONIC PACKAGE INCLUDING CAVITY DEFINED BY RESIN AND METHOD OF...
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ELASTIC WAVE DEVICE
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- Publication date Jul 18, 2019
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Information Patent Application
ELECTRONIC COMPONENT
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- Publication date Jul 11, 2019
- Murata Manufacturing Co., Ltd.
- Yasuaki SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELASTIC WAVE DEVICE
- Publication number 20180102758
- Publication date Apr 12, 2018
- Murata Manufacturing Co., Ltd.
- Kenichi UESAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELASTIC WAVE DEVICE
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- Murata Manufacturing Co., Ltd.
- Hiroyuki NISHI
- H01 - BASIC ELECTRIC ELEMENTS

the enclosure being defined by a non-uniform sealing mass covering the non-active sides of the BAW device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Manufacturing method of mounting structure, and sheet therefor

Electronic component

Elastic wave device

Elastic wave device and electronic component

Composite component and mounting structure therefor

Acoustic wave filter, multiplexer, and communication apparatus

Electronic component device

Elastic wave device

Electronic package including cavity defined by resin and method of...

Surface acoustic wave (SAW) device with antireflective structure

Electronic component

Elastic wave device

Transversely-excited film bulk acoustic resonator package and method

Electronic component-containing module

Electronic component with two substrates enclosing functional eleme...

Elastic wave device, radio-frequency front-end circuit, and communi...

Electronic component and manufacturing method therefor

Piezoelectric device and manufacturing method therefor

Electronic component having a reinforced hollowed structure

Elastic wave element and elastic wave apparatus

Acoustic wave device and manufacturing method for same

Acoustic wave device and method of manufacturing the same

High-frequency module

Embedded RF filter package structure and method of manufacturing th...

Electronic component device, method of mounting electronic componen...

Electronic package including cavity defined by resin and method of...

Electronic component module

Resin sheet for sealing electronic device and method for manufactur...

Wave separator

Electronic component and method for manufacturing the same

Patents Applicationslast 30 patents

ACOUSTIC WAVE DEVICE

PACKAGED ACOUSTIC WAVE DEVICES WITH MULTILAYER PIEZOELECTRIC SUBSTRATE

RADIO FREQUENCY MODULE AND COMMUNICATION DEVICE

ELECTRONIC DEVICE

TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATOR PACKAGE AND METHOD

INTEGRATION OF CARBON NANOTUBES IN PACKAGE FILLER AND GEL OVERCOAT

ACOUSTIC WAVE FILTER AND COMMUNICATION APPARATUS

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

METHOD OF FABRICATING TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESON...

TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATOR PACKAGE AND METHOD

TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATOR PACKAGE

TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATOR PACKAGE AND METHOD

PACKAGE COMPRISING STACKED FILTERS

ACOUSTIC WAVE ELEMENT AND ACOUSTIC WAVE DEVICE

TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATOR PACKAGE

TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATOR PACKAGE

TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATOR PACKAGE

TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATOR PACKAGE AND METHOD

TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATOR PACKAGE

TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATOR

TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATOR PACKAGE AND METHOD

MANUFACTURING METHOD OF MOUNTING STRUCTURE, AND SHEET THEREFOR

ELECTRONIC COMPONENT DEVICE

SURFACE ACOUSTIC WAVE ELEMENT PACKAGE AND MANUFACTURING METHOD THEREOF

COMPOSITE COMPONENT AND MOUNTING STRUCTURE THEREFOR

ELECTRONIC PACKAGE INCLUDING CAVITY DEFINED BY RESIN AND METHOD OF...

ELASTIC WAVE DEVICE

ELECTRONIC COMPONENT

ELASTIC WAVE DEVICE

ELASTIC WAVE DEVICE