the first connecting process involving a bump connector

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H01L2224/92122

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/92122the first connecting process involving a bump connector

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packaging structure and process
- Patent number 10,867,835
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and process
- Patent number 10,157,772
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive for semiconductor, fluxing agent, manufacturing method for...
- Patent number 9,803,111
- Issue date Oct 31, 2017
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor packaging structure and process
- Patent number 9,735,043
- Issue date Aug 15, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembling a semiconductor chip package
- Patent number 6,821,815
- Issue date Nov 23, 2004
- Tessera, Inc.
- John W. Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembling a semiconductor chip package
- Patent number 6,518,662
- Issue date Feb 11, 2003
- Tessera, Inc.
- John W. Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembling a semiconductor chip package
- Patent number 6,204,091
- Issue date Mar 20, 2001
- Tessera, Inc.
- John W. Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of encapsulating a microelectronic assembly utilizing a barrier
- Patent number 6,130,116
- Issue date Oct 10, 2000
- Tessera, Inc.
- John W. Smith
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240071952
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chiang Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packaging Structure and Process
- Publication number 20170345708
- Publication date Nov 30, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of assembling a semiconductor chip package
- Publication number 20030129789
- Publication date Jul 10, 2003
- John W. Smith
- H01 - BASIC ELECTRIC ELEMENTS

the first connecting process involving a bump connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor packaging structure and process

Semiconductor packaging structure and process

Adhesive for semiconductor, fluxing agent, manufacturing method for...

Semiconductor packaging structure and process

Method of assembling a semiconductor chip package

Method of assembling a semiconductor chip package

Method of assembling a semiconductor chip package

Method of encapsulating a microelectronic assembly utilizing a barrier

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT DEVICE AND METHOD OF FORMING THE SAME

Semiconductor Packaging Structure and Process

Method of assembling a semiconductor chip package