the first connecting process involving a layer connector

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/92242the first connecting process involving a layer connector

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with a semiconductor die embedded between an e...
- Patent number 12,107,035
- Issue date Oct 1, 2024
- Amkor Technology Singapore Holdings Pte. Ltd.
- Jae Yun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Close butted collocated variable technology imaging arrays on a sin...
- Patent number 12,051,712
- Issue date Jul 30, 2024
- Raytheon Company
- Sean P. Kilcoyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level stack chip package and method of manufacturing the same
- Patent number 12,033,910
- Issue date Jul 9, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine pitch BVA using reconstituted wafer with area array accessible...
- Patent number 11,990,382
- Issue date May 21, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Close butted collocated variable technology imaging arrays on a sin...
- Patent number 11,705,471
- Issue date Jul 18, 2023
- Raytheon Company
- Sean P. Kilcoyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor packaging device and heat di...
- Patent number 11,658,091
- Issue date May 23, 2023
- Global Unichip Corporation
- Jia-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package with bridge layer
- Patent number 11,476,125
- Issue date Oct 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) packages employing split, double-sided meta...
- Patent number 11,456,291
- Issue date Sep 27, 2022
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation structure, semiconductor packaging device, and man...
- Patent number 11,450,586
- Issue date Sep 20, 2022
- Global Unichip Corporation
- Jia-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a semiconductor die embedded between an e...
- Patent number 11,430,723
- Issue date Aug 30, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Jae Yun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine pitch bva using reconstituted wafer with area array accessible...
- Patent number 11,404,338
- Issue date Aug 2, 2022
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module, DIMM module, manufacturing method of semicond...
- Patent number 11,183,484
- Issue date Nov 23, 2021
- ULTRAMEMORY INC.
- Fumitake Okutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including offset stack of semiconductor dies...
- Patent number 11,158,608
- Issue date Oct 26, 2021
- Powertech Technology Inc.
- Kuang-Jen Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with embedded stacked through-silicon via die
- Patent number 11,107,766
- Issue date Aug 31, 2021
- Intel Corporation
- Javier Soto Gonzalez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Locking dual leadframe for flip chip on leadframe packages
- Patent number 11,056,462
- Issue date Jul 6, 2021
- Texas Instruments Incorporated
- Lee Han Meng @ Eugene Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,011,431
- Issue date May 18, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 10,903,200
- Issue date Jan 26, 2021
- TOSHIBA MEMORY CORPORATION
- Yuji Karakane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack assembly using an edge separation structure for connectiv...
- Patent number 10,854,581
- Issue date Dec 1, 2020
- Littelfuse, Inc.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic device having a chip size packa...
- Patent number 10,804,312
- Issue date Oct 13, 2020
- Sony Corporation
- Masaya Nagata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level stack chip package and method of manufacturing the same
- Patent number 10,784,178
- Issue date Sep 22, 2020
- Amkor Technology, Inc.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,777,467
- Issue date Sep 15, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with heat transfer structure formed f...
- Patent number 10,748,878
- Issue date Aug 18, 2020
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack assembly using an edge separation structure for connectiv...
- Patent number 10,734,362
- Issue date Aug 4, 2020
- Littelfuse, Inc.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip wire bondless power device
- Patent number 10,720,380
- Issue date Jul 21, 2020
- Sayan Seal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for making multi-die package with bridge layer
- Patent number 10,643,861
- Issue date May 5, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit module and method of forming same
- Patent number 10,636,768
- Issue date Apr 28, 2020
- Starkey Laboratories, Inc.
- Sayed Kaysarbin Rahim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 10,600,773
- Issue date Mar 24, 2020
- TOSHIBA MEMORY CORPORATION
- Yuji Karakane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device modules including a die electrically connected...
- Patent number 10,586,780
- Issue date Mar 10, 2020
- Micron Technology, Inc.
- Ashok Pachamuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with heat transfer structure formed f...
- Patent number 10,559,551
- Issue date Feb 11, 2020
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of assembling a flip chip on a locking dual leadframe
- Patent number 10,541,225
- Issue date Jan 21, 2020
- Texas Instruments Incorporated
- Lee Han Meng @ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER-LEVEL STACK CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240363470
- Publication date Oct 31, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE PITCH BVA USING RECONSTITUTED WAFER WITH AREA ARRAY ACCESSIBLE...
- Publication number 20240347404
- Publication date Oct 17, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...
- Publication number 20240304603
- Publication date Sep 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jinchang ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...
- Publication number 20240072008
- Publication date Feb 29, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jinchang ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240014166
- Publication date Jan 11, 2024
- Samsung Electronics Co., Ltd.
- Youngdeuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLOSE BUTTED COLLOCATED VARIABLE TECHNOLOGY IMAGING ARRAYS ON A SIN...
- Publication number 20230282665
- Publication date Sep 7, 2023
- Raytheon Company
- Sean P. Kilcoyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH THROUGH DIE ATTACH FILM CONNECTIONS
- Publication number 20230087367
- Publication date Mar 23, 2023
- Intel Corporation
- Xiaoxuan Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fine Pitch BVA Using Reconstituted Wafer With Area Array Accessible...
- Publication number 20230005804
- Publication date Jan 5, 2023
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR DIE EMBEDDED BETWEEN AN E...
- Publication number 20220415769
- Publication date Dec 29, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Yun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGING DEVICE AND HEAT DI...
- Publication number 20220367313
- Publication date Nov 17, 2022
- Global Unichip Corporation
- Jia-Liang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION STRUCTURE, SEMICONDUCTOR PACKAGING DEVICE, AND MAN...
- Publication number 20220262701
- Publication date Aug 18, 2022
- Global Unichip Corporation
- Jia-Liang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLOSE BUTTED COLLOCATED VARIABLE TECHNOLOGY IMAGING ARRAYS ON A SIN...
- Publication number 20220130883
- Publication date Apr 28, 2022
- Raytheon Company
- Sean P. Kilcoyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING SPLIT, DOUBLE-SIDED META...
- Publication number 20210407979
- Publication date Dec 30, 2021
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, DIMM MODULE, MANUFACTURING METHOD OF SEMICOND...
- Publication number 20210143129
- Publication date May 13, 2021
- UltraMemory Inc.
- Fumitake OKUTSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210091043
- Publication date Mar 25, 2021
- Powertech Technology Inc.
- Kuang-Jen Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL STACK CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210020535
- Publication date Jan 21, 2021
- Amkor Technology, Inc.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200411385
- Publication date Dec 31, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- CHI-YANG YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Stack Assembly Using An Edge Separation Structure For Connectiv...
- Publication number 20200266174
- Publication date Aug 20, 2020
- LITTELFUSE, INC.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Making Multi-Die Package With Bridge Layer
- Publication number 20200266074
- Publication date Aug 20, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20200185373
- Publication date Jun 11, 2020
- Toshiba Memory Corporation
- Yuji KARAKANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fine Pitch Bva Using Reconstituted Wafer With Area Array Accessible...
- Publication number 20200144144
- Publication date May 7, 2020
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200066598
- Publication date Feb 27, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- CHI-YANG YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MODULES AND RELATED METHODS
- Publication number 20190252342
- Publication date Aug 15, 2019
- Micron Technology, Inc.
- Ashok Pachamuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR DIE EMBEDDED BETWEEN AN E...
- Publication number 20190043793
- Publication date Feb 7, 2019
- Amkor Technology, Inc.
- Jae Yun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20180247891
- Publication date Aug 30, 2018
- Siliconware Precision Industries Co., Ltd.
- Shih-Chao Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING AN INTERPOSER-CHIP-ARRANGEMENT FOR DENSE PACKAG...
- Publication number 20180096969
- Publication date Apr 5, 2018
- ams AG
- Jochen KRAFT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH HEAT TRANSFER STRUCTURE FORMED F...
- Publication number 20170365584
- Publication date Dec 21, 2017
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCKING DUAL LEADFRAME FOR FLIP CHIP ON LEADFRAME PACKAGES
- Publication number 20170345790
- Publication date Nov 30, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng @ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCKING DUAL LEADFRAME FOR FLIP CHIP ON LEADFRAME PACKAGES
- Publication number 20170309595
- Publication date Oct 26, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng @ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20140361445
- Publication date Dec 11, 2014
- Norihiro NASHIDA
- H01 - BASIC ELECTRIC ELEMENTS

the first connecting process involving a layer connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with a semiconductor die embedded between an e...

Close butted collocated variable technology imaging arrays on a sin...

Wafer-level stack chip package and method of manufacturing the same

Fine pitch BVA using reconstituted wafer with area array accessible...

Close butted collocated variable technology imaging arrays on a sin...

Methods of manufacturing semiconductor packaging device and heat di...

Multi-die package with bridge layer

Integrated circuit (IC) packages employing split, double-sided meta...

Heat dissipation structure, semiconductor packaging device, and man...

Semiconductor device with a semiconductor die embedded between an e...

Fine pitch bva using reconstituted wafer with area array accessible...

Semiconductor module, DIMM module, manufacturing method of semicond...

Semiconductor package including offset stack of semiconductor dies...

Substrate with embedded stacked through-silicon via die

Locking dual leadframe for flip chip on leadframe packages

Semiconductor structure and manufacturing method thereof

Semiconductor device manufacturing method

Die stack assembly using an edge separation structure for connectiv...

Semiconductor device and electronic device having a chip size packa...

Wafer-level stack chip package and method of manufacturing the same

Semiconductor structure and manufacturing method thereof

Semiconductor device assembly with heat transfer structure formed f...

Die stack assembly using an edge separation structure for connectiv...

Flip-chip wire bondless power device

Methods for making multi-die package with bridge layer

Integrated circuit module and method of forming same

Semiconductor device manufacturing method

Semiconductor device modules including a die electrically connected...

Semiconductor device assembly with heat transfer structure formed f...

Methods of assembling a flip chip on a locking dual leadframe

Patents Applicationslast 30 patents

WAFER-LEVEL STACK CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

FINE PITCH BVA USING RECONSTITUTED WAFER WITH AREA ARRAY ACCESSIBLE...

SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...

SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...

SEMICONDUCTOR PACKAGE

CLOSE BUTTED COLLOCATED VARIABLE TECHNOLOGY IMAGING ARRAYS ON A SIN...

MICROELECTRONIC ASSEMBLIES WITH THROUGH DIE ATTACH FILM CONNECTIONS

Fine Pitch BVA Using Reconstituted Wafer With Area Array Accessible...

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR DIE EMBEDDED BETWEEN AN E...

METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGING DEVICE AND HEAT DI...

HEAT DISSIPATION STRUCTURE, SEMICONDUCTOR PACKAGING DEVICE, AND MAN...

CLOSE BUTTED COLLOCATED VARIABLE TECHNOLOGY IMAGING ARRAYS ON A SIN...

INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING SPLIT, DOUBLE-SIDED META...

SEMICONDUCTOR MODULE, DIMM MODULE, MANUFACTURING METHOD OF SEMICOND...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

WAFER-LEVEL STACK CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Die Stack Assembly Using An Edge Separation Structure For Connectiv...

Methods for Making Multi-Die Package With Bridge Layer

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Fine Pitch Bva Using Reconstituted Wafer With Area Array Accessible...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE MODULES AND RELATED METHODS

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR DIE EMBEDDED BETWEEN AN E...

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

METHOD OF PRODUCING AN INTERPOSER-CHIP-ARRANGEMENT FOR DENSE PACKAG...

SEMICONDUCTOR DEVICE ASSEMBLY WITH HEAT TRANSFER STRUCTURE FORMED F...

LOCKING DUAL LEADFRAME FOR FLIP CHIP ON LEADFRAME PACKAGES

LOCKING DUAL LEADFRAME FOR FLIP CHIP ON LEADFRAME PACKAGES

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME