the guiding structures being at least partially left in the finished device

Industry

CPC
H01L2224/85138

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/85138the guiding structures being at least partially left in the finished device

Industries

Patents Grantslast 30 patents

Information Patent Grant
Apparatus, system, and method for wireless connection in integrated...
- Patent number 9,837,340
- Issue date Dec 5, 2017
- Intel Corporation
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Brace for long wire bond
- Patent number 8,692,134
- Issue date Apr 8, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Jie Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for assembling at least one chip with a wire element, electr...
- Patent number 8,654,540
- Issue date Feb 18, 2014
- Commisariat A l'Energie Atomique et Aux Energies Alternatives
- Jean Brun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-chip package and method of manufacturing thereof
- Patent number 8,362,624
- Issue date Jan 29, 2013
- Samsung Electronics Co., Ltd.
- Tae-Ho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,169,087
- Issue date May 1, 2012
- Toyota Jidosha Kabushiki Kaisha
- Masaru Senoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit package having electrically discon...
- Patent number 7,851,907
- Issue date Dec 14, 2010
- Micron Technology, Inc.
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit package having electrically discon...
- Patent number 7,468,559
- Issue date Dec 23, 2008
- Micron Technology, Inc.
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit package having electrically discon...
- Patent number 7,342,319
- Issue date Mar 11, 2008
- Micron Technology, Inc.
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit package having electrically discon...
- Patent number 7,276,802
- Issue date Oct 2, 2007
- Micron Technology, Inc.
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit package having electrically discon...
- Patent number 7,268,067
- Issue date Sep 11, 2007
- Micron Technology, Inc.
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BRACE FOR LONG WIRE BOND
- Publication number 20120145446
- Publication date Jun 14, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Jie YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20120139125
- Publication date Jun 7, 2012
- Tae-Ho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Led lead frame structure
- Publication number 20110199749
- Publication date Aug 18, 2011
- Forward Electronics Co., Ltd.
- Pei-Hsuan Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ASSEMBLING AT LEAST ONE CHIP WITH A WIRE ELEMENT, ELECTR...
- Publication number 20110149540
- Publication date Jun 23, 2011
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Jean BRUN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100276817
- Publication date Nov 4, 2010
- Toyota Jidosha Kabushiki Kaisha
- Masaru Senoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit, Semiconductor Module and Method for Manufacturi...
- Publication number 20090189292
- Publication date Jul 30, 2009
- Martin Reiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE HAVING ELECTRICALLY DISCON...
- Publication number 20080142950
- Publication date Jun 19, 2008
- Micron Technology, Inc.
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE HAVING ELECTRICALLY DISCON...
- Publication number 20060237845
- Publication date Oct 26, 2006
- Micron Technology, Inc.
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE HAVING ELECTRICALLY DISCON...
- Publication number 20060237844
- Publication date Oct 26, 2006
- Micron Technology, Inc.
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor integrated circuit package having electrically discon...
- Publication number 20050026327
- Publication date Feb 3, 2005
- Micron Technology, Inc.
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor integrated circuit package having electrically discon...
- Publication number 20030193088
- Publication date Oct 16, 2003
- Micron Technology, Inc.
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS

the guiding structures being at least partially left in the finished device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Apparatus, system, and method for wireless connection in integrated...

Brace for long wire bond

Method for assembling at least one chip with a wire element, electr...

Multi-chip package and method of manufacturing thereof

Semiconductor device

Semiconductor integrated circuit package having electrically discon...

Semiconductor integrated circuit package having electrically discon...

Semiconductor integrated circuit package having electrically discon...

Semiconductor integrated circuit package having electrically discon...

Semiconductor integrated circuit package having electrically discon...

Patents Applicationslast 30 patents

BRACE FOR LONG WIRE BOND

MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THEREOF

Led lead frame structure

METHOD FOR ASSEMBLING AT LEAST ONE CHIP WITH A WIRE ELEMENT, ELECTR...

SEMICONDUCTOR DEVICE

Integrated Circuit, Semiconductor Module and Method for Manufacturi...

SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE HAVING ELECTRICALLY DISCON...

SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE HAVING ELECTRICALLY DISCON...

SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE HAVING ELECTRICALLY DISCON...

Semiconductor integrated circuit package having electrically discon...

Semiconductor integrated circuit package having electrically discon...