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the guiding structures being at least partially left in the finished device
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CPC
H01L2224/80138
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/80138
the guiding structures being at least partially left in the finished device
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Patent Application
DIE-TO-DIE BONDING AND ASSOCIATED PACKAGE CONFIGURATIONS
Publication number
20150255411
Publication date
Sep 10, 2015
Omkar G. Karhade
G06 - COMPUTING CALCULATING COUNTING