the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted

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CPC
H01L2224/24247

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/24247the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of additively manufacturing an integrated circuit of an inte...
- Patent number 12,027,477
- Issue date Jul 2, 2024
- Board of Trustees of Michigan State University
- Ioannis Papapolymerou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and power converter
- Patent number 11,784,105
- Issue date Oct 10, 2023
- Mitsubishi Electric Corporation
- Hodaka Rokubuichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 11,728,252
- Issue date Aug 15, 2023
- Advanced Semiconductor Engineering, Inc.
- Hui Hua Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating package structure having encapsulate sensing...
- Patent number 11,404,361
- Issue date Aug 2, 2022
- Siliconware Precision Industries Co., Ltd.
- Shao-Tzu Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack frame for electrical connections and the method to fabricate...
- Patent number 11,031,255
- Issue date Jun 8, 2021
- Cyntec Co., Ltd.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for fabricating the same
- Patent number 10,872,847
- Issue date Dec 22, 2020
- Siliconware Precision Industries Co., Ltd.
- Shao-Tzu Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging method, semiconductor package and stacked s...
- Patent number 10,854,531
- Issue date Dec 1, 2020
- Pep Innovation PTE Ltd.
- Yi Xin Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 10,707,157
- Issue date Jul 7, 2020
- Advanced Semiconductor Engineering, Inc.
- Hui Hua Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack frame for electrical connections and the method to fabricate...
- Patent number 10,593,561
- Issue date Mar 17, 2020
- Cyntec Co., Ltd.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic elements with post-assembly planarization
- Patent number 10,559,494
- Issue date Feb 11, 2020
- Tessera, Inc.
- Vage Oganesian
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Chip packaging and composite system board
- Patent number 10,490,478
- Issue date Nov 26, 2019
- Industrial Technology Research Institute
- Yu-Min Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fan-out wafer level chip package structure
- Patent number 10,381,268
- Issue date Aug 13, 2019
- Niko Semiconductor Co., Ltd.
- Chih-Cheng Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC packaging method and a packaged IC device
- Patent number 10,211,071
- Issue date Feb 19, 2019
- NXP B.V.
- Chung Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 10,083,888
- Issue date Sep 25, 2018
- Advanced Semiconductor Engineering, Inc.
- Chi-Tsung Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for sensor applications
- Patent number 10,055,631
- Issue date Aug 21, 2018
- Synaptics Incorporated
- Shengmin Wen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stack frame for electrical connections and the method to fabricate...
- Patent number 9,978,611
- Issue date May 22, 2018
- Cyntec Co., Ltd.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic elements with post-assembly planarization
- Patent number 9,966,303
- Issue date May 8, 2018
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile reinforced package-on-package semiconductor device
- Patent number 9,875,997
- Issue date Jan 23, 2018
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out wafer level chip package structure and manufacturing method...
- Patent number 9,799,563
- Issue date Oct 24, 2017
- Niko Semiconductor Co., Ltd.
- Chih-Cheng Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack frame for electrical connections and the method to fabricate...
- Patent number 9,741,590
- Issue date Aug 22, 2017
- Cyntec Co., Ltd.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic elements with post-assembly planarization
- Patent number 9,659,812
- Issue date May 23, 2017
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out wafer level packages containing embedded ground plane inter...
- Patent number 9,607,918
- Issue date Mar 28, 2017
- NXP USA, INC.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack frame for electrical connections and the method to fabricate...
- Patent number 9,514,964
- Issue date Dec 6, 2016
- Cyntec Co., Ltd.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coreless package structure and method for manufacturing same
- Patent number 9,362,248
- Issue date Jun 7, 2016
- Zhen Ding Technology Co., Ltd.
- Yong Ha Woo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of making an embedded wafer level b...
- Patent number 9,269,691
- Issue date Feb 23, 2016
- STATS ChipPAC, Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including embedded controller die and method o...
- Patent number 9,236,368
- Issue date Jan 12, 2016
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Shiv Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack frame for electrical connections and the method to fabricate...
- Patent number 9,142,426
- Issue date Sep 22, 2015
- Cyntec Co., Ltd.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a chip arrangement comprising disposing a m...
- Patent number 8,956,918
- Issue date Feb 17, 2015
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-leadframe multi-chip package
- Patent number 8,933,549
- Issue date Jan 13, 2015
- Alpha & Omega Semiconductor, Inc.
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and manufacturing method thereof
- Patent number 8,866,268
- Issue date Oct 21, 2014
- Unistars Corporation
- Shang-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING LEADFR...
- Publication number 20240145429
- Publication date May 2, 2024
- STMicroelectronics S.r.l.
- Riccardo VILLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE HAVING IMPROVED RELIABILITY AND INSPE...
- Publication number 20220084980
- Publication date Mar 17, 2022
- STMicroelectronics S.r.l.
- Agatino Minotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURED INTERCONNECT PACKAGING STRUCTURE
- Publication number 20210217712
- Publication date Jul 15, 2021
- Board of Trustees of Michigan State University
- Ioannis PAPAPOLYMEROU
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20200243427
- Publication date Jul 30, 2020
- Advanced Semiconductor Engineering, Inc.
- Hui Hua LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20200194327
- Publication date Jun 18, 2020
- Advanced Semiconductor Engineering, Inc.
- Chi-Tsung CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A Stack Frame for Electrical Connections and the Method to Fabricat...
- Publication number 20200176270
- Publication date Jun 4, 2020
- CYNTEC CO., LTD.
- BAU-RU LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20180358276
- Publication date Dec 13, 2018
- Advanced Semiconductor Engineering, Inc.
- Chi-Tsung CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION
- Publication number 20180254213
- Publication date Sep 6, 2018
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stack Frame for Electrical Connections and the Method to Fabricate...
- Publication number 20180233380
- Publication date Aug 16, 2018
- CYNTEC CO., LTD.
- BAU-RU LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT WAFER LEVEL CHIP PACKAGE STRUCTURE
- Publication number 20170338154
- Publication date Nov 23, 2017
- NIKO SEMICONDUCTOR CO., LTD.
- CHIH-CHENG HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stack Frame for Electrical Connections and the Method to Fabricate...
- Publication number 20170316954
- Publication date Nov 2, 2017
- CYNTEC CO., LTD.
- BAU-RU LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION
- Publication number 20170256443
- Publication date Sep 7, 2017
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK FRAME FOR ELECTRICAL CONNECTIONS AND THE METHOD TO FABRICATE...
- Publication number 20170047229
- Publication date Feb 16, 2017
- CYNTEC CO., LTD.
- BAU-RU LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making an Embedded Wafer Level B...
- Publication number 20140367848
- Publication date Dec 18, 2014
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A CHIP ARRANGEMENT, AND CHIP ARRANGEMENT
- Publication number 20140175624
- Publication date Jun 26, 2014
- INFINEON TECHNOLOGIES AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual-leadframe Multi-chip Package
- Publication number 20140103512
- Publication date Apr 17, 2014
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION
- Publication number 20130010441
- Publication date Jan 10, 2013
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK FRAME FOR ELECTRICAL CONNECTIONS AND THE METHOD TO FABRICATE...
- Publication number 20120319258
- Publication date Dec 20, 2012
- CYNTEC CO., LTD.
- BAU-RU LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Embedded Die and Manufacturing Methods T...
- Publication number 20120235309
- Publication date Sep 20, 2012
- ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Kay Stephan Essig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20120228745
- Publication date Sep 13, 2012
- Shang-Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device Including Two Semiconductor Chips and Manufacturing Thereof
- Publication number 20120187565
- Publication date Jul 26, 2012
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DIODE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120168794
- Publication date Jul 5, 2012
- CHI MEI LIGHTING TECHNOLOGY CORP.
- Kuohui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual-leadframe Multi-chip Package and Method of Manufacture
- Publication number 20120161304
- Publication date Jun 28, 2012
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION
- Publication number 20120020026
- Publication date Jan 26, 2012
- Tessera Research LLC
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual-leadframe Multi-chip Package and Method of Manufacture
- Publication number 20110233746
- Publication date Sep 29, 2011
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20100252921
- Publication date Oct 7, 2010
- Shinko Electric Industries Co., Ltd.
- Fumimasa KATAGIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR DEVICE
- Publication number 20100248475
- Publication date Sep 30, 2010
- INFINEON TECHNOLOGIES AG
- Manfred Mengel
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH REDISTRIBUTION LAYER
- Publication number 20100052131
- Publication date Mar 4, 2010
- Lionel Chien Hui Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090200665
- Publication date Aug 13, 2009
- CASIO COMPUTER CO., LTD.
- Hiroyasu Jobetto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20070126128
- Publication date Jun 7, 2007
- CASIO COMPUTER CO., LTD.
- Hiroyasu Jobetto
- H01 - BASIC ELECTRIC ELEMENTS

the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of additively manufacturing an integrated circuit of an inte...

Semiconductor device and power converter

Semiconductor device package

Method for fabricating package structure having encapsulate sensing...

Stack frame for electrical connections and the method to fabricate...

Package structure and method for fabricating the same

Semiconductor packaging method, semiconductor package and stacked s...

Semiconductor device package

Stack frame for electrical connections and the method to fabricate...

Microelectronic elements with post-assembly planarization

Chip packaging and composite system board

Fan-out wafer level chip package structure

IC packaging method and a packaged IC device

Semiconductor device package

Semiconductor package for sensor applications

Stack frame for electrical connections and the method to fabricate...

Microelectronic elements with post-assembly planarization

Low profile reinforced package-on-package semiconductor device

Fan-out wafer level chip package structure and manufacturing method...

Stack frame for electrical connections and the method to fabricate...

Microelectronic elements with post-assembly planarization

Fan-out wafer level packages containing embedded ground plane inter...

Stack frame for electrical connections and the method to fabricate...

Coreless package structure and method for manufacturing same

Semiconductor device and method of making an embedded wafer level b...

Semiconductor device including embedded controller die and method o...

Stack frame for electrical connections and the method to fabricate...

Method of manufacturing a chip arrangement comprising disposing a m...

Dual-leadframe multi-chip package

Semiconductor package structure and manufacturing method thereof

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING LEADFR...

PACKAGED SEMICONDUCTOR DEVICE HAVING IMPROVED RELIABILITY AND INSPE...

MANUFACTURED INTERCONNECT PACKAGING STRUCTURE

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR DEVICE PACKAGE

A Stack Frame for Electrical Connections and the Method to Fabricat...

SEMICONDUCTOR DEVICE PACKAGE

MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION

Stack Frame for Electrical Connections and the Method to Fabricate...

FAN-OUT WAFER LEVEL CHIP PACKAGE STRUCTURE

Stack Frame for Electrical Connections and the Method to Fabricate...

MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION

STACK FRAME FOR ELECTRICAL CONNECTIONS AND THE METHOD TO FABRICATE...

Semiconductor Device and Method of Making an Embedded Wafer Level B...

METHOD FOR MANUFACTURING A CHIP ARRANGEMENT, AND CHIP ARRANGEMENT

Dual-leadframe Multi-chip Package

MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION

STACK FRAME FOR ELECTRICAL CONNECTIONS AND THE METHOD TO FABRICATE...

Semiconductor Package with Embedded Die and Manufacturing Methods T...

SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Device Including Two Semiconductor Chips and Manufacturing Thereof

LIGHT-EMITTING DIODE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Dual-leadframe Multi-chip Package and Method of Manufacture

MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION

Dual-leadframe Multi-chip Package and Method of Manufacture

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

METHOD OF FABRICATING A SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH REDISTRIBUTION LAYER

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME