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the item being a discrete passive component

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  • H01L2224/16195
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/16195the item being a discrete passive component
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Patents Grantslast 30 patents

  • Information Patent Grant

    Fan-out package structure
    • Patent number 10,128,192
    • Issue date Nov 13, 2018
    • Mediatek Inc.
    • Min-Chen Lin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Sensor and method for manufacturing sensor
    • Patent number 9,255,940
    • Issue date Feb 9, 2016
    • Seiko Epson Corporation
    • Satoshi Nakajima
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Chip package
    • Patent number 9,245,857
    • Issue date Jan 26, 2016
    • Novatek Microelectronics Corp.
    • Jhih-Siou Cheng
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

  • Information Patent Application

    CAPACITOR WIRE AND ELECTRONIC DEVICE INCLUDING THE SAME
    • Publication number 20230245828
    • Publication date Aug 3, 2023
    • Samsung Electronics Co., Ltd.
    • SOOJAE PARK
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FAN-OUT PACKAGE STRUCTURE
    • Publication number 20180025985
    • Publication date Jan 25, 2018
    • MEDIATEK INC.
    • Min-Chen LIN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP PACKAGE
    • Publication number 20150262943
    • Publication date Sep 17, 2015
    • NOVATEK MICROELECTRONICS CORP.
    • Jhih-Siou Cheng
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    SENSOR AND METHOD FOR MANUFACTURING SENSOR
    • Publication number 20140204552
    • Publication date Jul 24, 2014
    • SEIKO EPSON CORPORATION
    • Satoshi Nakajima
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    CHIP PACKAGE
    • Publication number 20140004725
    • Publication date Jan 2, 2014
    • NOVATEK MICROELECTRONICS CORP.
    • Jhih-Siou Cheng
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    INTEGRATED CIRCUIT PACKAGE CONNECTED TO A DATA TRANSMISSION MEDIUM
    • Publication number 20120148187
    • Publication date Jun 14, 2012
    • International Business Machines Corporation
    • Harry Barowski
    • G02 - OPTICS