the item being a discrete passive component

Follow

Industry

CPC
H01L2224/40195

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/40195the item being a discrete passive component

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Ribbon bond solution for reducing thermal stress on an intermittent...
- Patent number 11,706,852
- Issue date Jul 18, 2023
- Illinois Tool Works Inc.
- Marco Carcano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor system having unidirectional connections to...
- Patent number 10,756,013
- Issue date Aug 25, 2020
- Texas Instruments Incorporated
- Saumya Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 10,325,895
- Issue date Jun 18, 2019
- Mitsubishi Electric Corporation
- Kenta Nakahara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGED SEMICONDUCTOR SYSTEM HAVING UNIDIRECTIONAL CONNECTIONS TO...
- Publication number 20200185323
- Publication date Jun 11, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Saumya Gandhi
- H01 - BASIC ELECTRIC ELEMENTS