the item being a discrete passive component

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H01L2224/32195

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/32195the item being a discrete passive component

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming an integrated circuit package having a padding la...
- Patent number 12,322,726
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic packages with stacked sitffeners and methods of assembli...
- Patent number 10,964,677
- Issue date Mar 30, 2021
- Intel Corporation
- Jenny Shio Yin Ong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062186
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Junghoo Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20230282614
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR WIRE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20230245828
- Publication date Aug 3, 2023
- Samsung Electronics Co., Ltd.
- SOOJAE PARK
- H01 - BASIC ELECTRIC ELEMENTS