the item being a discrete passive component

Industry

CPC
H01L2224/48195

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48195the item being a discrete passive component

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic package with interposer between integrated circuit dies
- Patent number 12,136,615
- Issue date Nov 5, 2024
- Qorvo US, Inc.
- Matthew Essar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink, semiconductor package and semiconductor module
- Patent number 12,130,096
- Issue date Oct 29, 2024
- JFE PRECISION CORPORATION
- Hoshiaki Terao
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Doherty amplifier
- Patent number 12,081,174
- Issue date Sep 3, 2024
- Mitsubishi Electric Corporation
- Katsuya Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device having a coupled interstage transformer and process implemen...
- Patent number 12,068,265
- Issue date Aug 20, 2024
- MACOM Technology Solutions Holdings, Inc.
- Marvin Marbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolated semiconductor package with HV isolator on block
- Patent number 11,929,311
- Issue date Mar 12, 2024
- Texas Instruments Incorporated
- Vivek K Arora
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package with reinforced isolation
- Patent number 11,908,834
- Issue date Feb 20, 2024
- Texas Instruments Incorporated
- Vivek Arora
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thinning system in package
- Patent number 11,869,876
- Issue date Jan 9, 2024
- WALTON ADVANCED ENGINEERING INC.
- Chun Jung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively shielded radio frequency module with multi-mode stacked...
- Patent number 11,864,295
- Issue date Jan 2, 2024
- Skyworks Solutions, Inc.
- Yasser Khairat Soliman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support structure for MEMS device with particle filter
- Patent number 11,807,521
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus for measure of quantity and associated method of manufact...
- Patent number 11,719,725
- Issue date Aug 8, 2023
- HALL ELEMENT DEVICES (IP HOLDINGS) LIMITED
- Tomaz Slivnik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,705,401
- Issue date Jul 18, 2023
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor module
- Patent number 11,657,953
- Issue date May 23, 2023
- Rohm Co., Ltd.
- Kosei Osada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Replaceable end effector contact pads, end effectors, and maintenan...
- Patent number 11,600,580
- Issue date Mar 7, 2023
- Applied Materials, Inc.
- Whitney Kroetz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System in package
- Patent number 11,587,854
- Issue date Feb 21, 2023
- WALTON ADVANCED ENGINEERING INC.
- Chun Jung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front end systems with multi-mode power amplifier stage and overloa...
- Patent number 11,576,248
- Issue date Feb 7, 2023
- Skyworks Solutions, Inc.
- Leslie Paul Wallis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully symmetrical laterally coupled transformer for signal and powe...
- Patent number 11,569,340
- Issue date Jan 31, 2023
- Analog Devices, Inc.
- Ruida Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having galvanic isolation and method t...
- Patent number 11,502,068
- Issue date Nov 15, 2022
- NXP USA, INC.
- Burton Jesse Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic device with suspended magnetic subassembly
- Patent number 11,482,477
- Issue date Oct 25, 2022
- Texas Instruments Incorporated
- Vijaylaxmi Khanolkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Amplifier having improved stability
- Patent number 11,482,501
- Issue date Oct 25, 2022
- Ampleon Netherlands B.V.
- Yi Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged transistor devices with input-output isolation and methods...
- Patent number 11,417,617
- Issue date Aug 16, 2022
- Wolfspeed, Inc.
- Frank Trang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for measure of quantity and associated method of manufact...
- Patent number 11,353,482
- Issue date Jun 7, 2022
- HALL ELEMENT DEVICES (IP HOLDINGS) LIMITED
- Tomaz Slivnik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and amplifier having bonding wire and conducti...
- Patent number 11,342,279
- Issue date May 24, 2022
- Sumitomo Electric Industries, Ltd.
- Ayumu Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package with reinforced isolation
- Patent number 11,329,025
- Issue date May 10, 2022
- Texas Instruments Incorporated
- Vivek Arora
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Receiver optical module and process of assembling the same
- Patent number 11,152,342
- Issue date Oct 19, 2021
- Sumitomo Electric Device Innovations, Inc.
- Kyohei Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively shielded radio frequency module with linearized low noi...
- Patent number 11,037,893
- Issue date Jun 15, 2021
- Skyworks Solutions, Inc.
- Leslie Paul Wallis
- F21 - LIGHTING
Information Patent Grant
Semiconductor assembly with package on package structure and electr...
- Patent number 11,037,890
- Issue date Jun 15, 2021
- Samsung Electronics Co., Ltd.
- Ki Cheol Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor module
- Patent number 11,011,297
- Issue date May 18, 2021
- Rohm Co., Ltd.
- Kosei Osada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support structure for MEMS device with particle filter
- Patent number 10,968,097
- Issue date Apr 6, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus for measure of quantity and associated method of manufact...
- Patent number 10,830,797
- Issue date Nov 10, 2020
- HALL ELEMENT DEVICES (IP HOLDINGS) LIMITED
- TomaToma{hacek over (z)} Slivnik
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device
- Patent number 10,825,758
- Issue date Nov 3, 2020
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DEVICE HAVING A COUPLED INTERSTAGE TRANSFORMER AND PROCESS IMPLEMEN...
- Publication number 20240371802
- Publication date Nov 7, 2024
- MACOM Technology Solutions Holdings, Inc.
- Marvin MARBELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240363606
- Publication date Oct 31, 2024
- ROHM CO., LTD.
- Yoshizo OSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING CHIP AND SIGNAL PROPAGATING DEVICE
- Publication number 20240332345
- Publication date Oct 3, 2024
- ROHM CO., LTD.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312969
- Publication date Sep 19, 2024
- RENESAS ELECTRONICS CORPORATION
- Takayuki IGARASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light-Receiving Element and Light Receiving Circuit
- Publication number 20240222532
- Publication date Jul 4, 2024
- Nippon Telegraph and Telephone Corporation
- Atsushi Kanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATED SEMICONDUCTOR PACKAGE WITH HV ISOLATOR ON BLOCK
- Publication number 20240222237
- Publication date Jul 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Vivek K. Arora
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240194618
- Publication date Jun 13, 2024
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- HUI DONG LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER MODULE WITH TRANSISTOR DIES FOR MULTIPLE AMPLIFIER...
- Publication number 20240186212
- Publication date Jun 6, 2024
- NXP USA, Inc.
- Stephen Reza Hiemstra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240164118
- Publication date May 16, 2024
- RENESAS ELECTRONICS CORPORATION
- Kazuaki TSUCHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240145413
- Publication date May 2, 2024
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Makoto NISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDS FOR GALVANIC ISOLATION DEVICE
- Publication number 20240113155
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tunable Fingertip Capacitors with Enhanced Shielding in Ceramic Pac...
- Publication number 20240072025
- Publication date Feb 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Rajen M. Murugan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CAPACITORS FOR SEMICONDUCTOR DEVICES AND ASSOCIATED SYSTEMS...
- Publication number 20240072022
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOHERTY AMPLIFIERS
- Publication number 20240063756
- Publication date Feb 22, 2024
- NXP USA, Inc.
- Qi Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR EQUIPMENT
- Publication number 20240047438
- Publication date Feb 8, 2024
- Rohm Co., Ltd.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATOR, INSULATING MODULE, AND GATE DRIVER
- Publication number 20240030276
- Publication date Jan 25, 2024
- ROHM CO., LTD.
- Keiji WADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230402353
- Publication date Dec 14, 2023
- Rohm Co., Ltd.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR MEASURE OF QUANTITY AND ASSOCIATED METHOD OF MANUFACT...
- Publication number 20230333145
- Publication date Oct 19, 2023
- HALL ELEMENT DEVICES (IP HOLDINGS) LIMITED
- Tomaz SLIVNIK
- G01 - MEASURING TESTING
Information Patent Application
CAPACITOR WIRE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20230245828
- Publication date Aug 3, 2023
- Samsung Electronics Co., Ltd.
- SOOJAE PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE HAVING A COUPLED INTERSTAGE TRANSFORMER AND PROCESS IMPLEMEN...
- Publication number 20230207496
- Publication date Jun 29, 2023
- Wolfspeed, Inc.
- Marvin MARBELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH INTERPOSER BETWEEN INTEGRATED CIRCUIT DIES
- Publication number 20230170340
- Publication date Jun 1, 2023
- Qorvo US, Inc.
- Matthew Essar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230163085
- Publication date May 25, 2023
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ayuhiko SAITOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATED SEMICONDUCTOR PACKAGE WITH HV ISOLATOR ON BLOCK
- Publication number 20230119127
- Publication date Apr 20, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Vivek K. Arora
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20230099673
- Publication date Mar 30, 2023
- LAPIS TECHNOLOGY CO., LTD.
- KOYA SHIMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230089615
- Publication date Mar 23, 2023
- Kabushiki Kaisha Toshiba
- Kenichi AGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERTER, MOTOR DRIVE CONTROLLER, BLOWER, COMPRESSOR, AND AI...
- Publication number 20230092110
- Publication date Mar 23, 2023
- Mitsubishi Electric Corporation
- Satoru ICHIKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED ELECTRONIC DEVICE WITH SUSPENDED MAGNETIC SUBASSEMBLY
- Publication number 20230022572
- Publication date Jan 26, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Vijaylaxmi Khanolkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220328416
- Publication date Oct 13, 2022
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220293550
- Publication date Sep 15, 2022
- Sumitomo Electric Industries, Ltd.
- Shuichi NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THINNING SYSTEM IN PACKAGE
- Publication number 20220293562
- Publication date Sep 15, 2022
- WALTON ADVANCED ENGINEERING INC.
- Chun Jung LIN
- H01 - BASIC ELECTRIC ELEMENTS

the item being a discrete passive component

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic package with interposer between integrated circuit dies

Heat sink, semiconductor package and semiconductor module

Doherty amplifier

Device having a coupled interstage transformer and process implemen...

Isolated semiconductor package with HV isolator on block

Multi-chip package with reinforced isolation

Thinning system in package

Selectively shielded radio frequency module with multi-mode stacked...

Support structure for MEMS device with particle filter

Apparatus for measure of quantity and associated method of manufact...

Semiconductor package structure and method for manufacturing the same

Semiconductor device and semiconductor module

Replaceable end effector contact pads, end effectors, and maintenan...

System in package

Front end systems with multi-mode power amplifier stage and overloa...

Fully symmetrical laterally coupled transformer for signal and powe...

Semiconductor device package having galvanic isolation and method t...

Packaged electronic device with suspended magnetic subassembly

Amplifier having improved stability

Packaged transistor devices with input-output isolation and methods...

Apparatus for measure of quantity and associated method of manufact...

Semiconductor device and amplifier having bonding wire and conducti...

Multi-chip package with reinforced isolation

Receiver optical module and process of assembling the same

Selectively shielded radio frequency module with linearized low noi...

Semiconductor assembly with package on package structure and electr...

Semiconductor device and semiconductor module

Support structure for MEMS device with particle filter

Apparatus for measure of quantity and associated method of manufact...

Semiconductor device

Patents Applicationslast 30 patents

DEVICE HAVING A COUPLED INTERSTAGE TRANSFORMER AND PROCESS IMPLEMEN...

SEMICONDUCTOR DEVICE

INSULATING CHIP AND SIGNAL PROPAGATING DEVICE

SEMICONDUCTOR DEVICE

Light-Receiving Element and Light Receiving Circuit

ISOLATED SEMICONDUCTOR PACKAGE WITH HV ISOLATOR ON BLOCK

SEMICONDUCTOR PACKAGE

POWER AMPLIFIER MODULE WITH TRANSISTOR DIES FOR MULTIPLE AMPLIFIER...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

WIRE BONDS FOR GALVANIC ISOLATION DEVICE

Tunable Fingertip Capacitors with Enhanced Shielding in Ceramic Pac...

STACKED CAPACITORS FOR SEMICONDUCTOR DEVICES AND ASSOCIATED SYSTEMS...

DOHERTY AMPLIFIERS

SEMICONDUCTOR EQUIPMENT

ISOLATOR, INSULATING MODULE, AND GATE DRIVER

SEMICONDUCTOR DEVICE

APPARATUS FOR MEASURE OF QUANTITY AND ASSOCIATED METHOD OF MANUFACT...

CAPACITOR WIRE AND ELECTRONIC DEVICE INCLUDING THE SAME

DEVICE HAVING A COUPLED INTERSTAGE TRANSFORMER AND PROCESS IMPLEMEN...

ELECTRONIC PACKAGE WITH INTERPOSER BETWEEN INTEGRATED CIRCUIT DIES

SEMICONDUCTOR DEVICE

ISOLATED SEMICONDUCTOR PACKAGE WITH HV ISOLATOR ON BLOCK

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE

POWER CONVERTER, MOTOR DRIVE CONTROLLER, BLOWER, COMPRESSOR, AND AI...

PACKAGED ELECTRONIC DEVICE WITH SUSPENDED MAGNETIC SUBASSEMBLY

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

THINNING SYSTEM IN PACKAGE