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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/48245the item being metallic

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic device packaging with galvanic isolation
- Patent number 12,278,169
- Issue date Apr 15, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Maria Cristina Estacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive members atop semiconductor packages
- Patent number 12,272,626
- Issue date Apr 8, 2025
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated transformer module
- Patent number 12,272,638
- Issue date Apr 8, 2025
- Murata Manufacturing Co., Ltd.
- Takayuki Tange
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having wettable lead flanks and tie bars and...
- Patent number 12,261,101
- Issue date Mar 25, 2025
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing leadless semiconductor package with wettab...
- Patent number 12,255,076
- Issue date Mar 18, 2025
- STMicroelectronics, Inc.
- Ian Harvey Arellano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus and method of manufacturing s...
- Patent number 12,255,080
- Issue date Mar 18, 2025
- Mitsubishi Electric Corporation
- Takamasa Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices in semiconductor package cavities
- Patent number 12,255,115
- Issue date Mar 18, 2025
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and manufacturing method thereof
- Patent number 12,243,811
- Issue date Mar 4, 2025
- Dai Nippon Printing Co., Ltd.
- Masahiro Nagata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Laser-cut lead-frame for integrated circuit (IC) packages
- Patent number 12,224,181
- Issue date Feb 11, 2025
- Texas Instruments Incorporated
- Tiange Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ESD protection device
- Patent number 12,224,579
- Issue date Feb 11, 2025
- Nexperia B.V.
- Hans-Martin Ritter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,211,764
- Issue date Jan 28, 2025
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices and corresponding sem...
- Patent number 12,211,772
- Issue date Jan 28, 2025
- STMicroelectronics S.r.l.
- Fulvio Vittorio Fontana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and lead frame with enhanced device isolation
- Patent number 12,211,770
- Issue date Jan 28, 2025
- Infineon Technologies Austria AG
- Balehithlu Manjappaiah Upendra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 12,211,821
- Issue date Jan 28, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package having first and second lead frames
- Patent number 12,211,824
- Issue date Jan 28, 2025
- Infineon Technologies AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures
- Patent number 12,199,088
- Issue date Jan 14, 2025
- ANCORA SEMICONDUCTORS INC.
- Jen-Chih Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Covers for semiconductor package components
- Patent number 12,198,995
- Issue date Jan 14, 2025
- Texas Instruments Incorporated
- Sreenivasan Kalyani Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with blind hole attachment to heat sink
- Patent number 12,191,229
- Issue date Jan 7, 2025
- Infineon Technologies AG
- Ryan Tordillo Comadre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for fabricating the same
- Patent number 12,191,262
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemically anchored mold compounds in semiconductor packages
- Patent number 12,180,595
- Issue date Dec 31, 2024
- Texas Instruments Incorporated
- Nazila Dadvand
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Fluorescent body, method for manufacturing same, and light-emitting...
- Patent number 12,180,402
- Issue date Dec 31, 2024
- National Institute for Materials Science
- Naoto Hirosaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of determining a sequence for creating a plurality of wire...
- Patent number 12,183,711
- Issue date Dec 31, 2024
- Kulicke and Soffa Industries, Inc.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,183,663
- Issue date Dec 31, 2024
- Rohm Co., Ltd.
- Kazuki Okuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Floating die package
- Patent number 12,176,298
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dicing die attach film, and semiconductor package using the same an...
- Patent number 12,176,314
- Issue date Dec 24, 2024
- Furukawa Electric Co., Ltd.
- Minoru Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,176,269
- Issue date Dec 24, 2024
- Rohm Co., Ltd.
- Katsutoki Shirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation device and method of transmitting a signal across an isol...
- Patent number 12,166,146
- Issue date Dec 10, 2024
- MPICS INNOVATIONS PTE. LTD
- Kok Keong Richard Lum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-side cooling semiconductor packages and related methods
- Patent number 12,154,844
- Issue date Nov 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,136,589
- Issue date Nov 5, 2024
- Rohm Co., Ltd.
- Yoshizo Osumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,131,983
- Issue date Oct 29, 2024
- Rohm Co., Ltd.
- Katsutoki Shirai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE HAVING WETTABLE LEAD FLANKS AND TIE BARS AND...
- Publication number 20250183132
- Publication date Jun 5, 2025
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRATED LAMINATE TRANSFORMER
- Publication number 20250183133
- Publication date Jun 5, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Chun Ping Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERSION DEVICE
- Publication number 20250183816
- Publication date Jun 5, 2025
- Mitsubishi Electric Corporation
- Tatsuya FUKASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND MANUFACTURING METHOD THEREOF
- Publication number 20250174530
- Publication date May 29, 2025
- DAI NIPPON PRINTING CO., LTD.
- Masahiro NAGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250174527
- Publication date May 29, 2025
- ROHM CO., LTD.
- Ryuta YAGINUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH A BATTERY SECURED BY A BENT LEADFRAME
- Publication number 20250174531
- Publication date May 29, 2025
- NXP USA, Inc.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250167063
- Publication date May 22, 2025
- Mitsubishi Electric Corporation
- Takeshi TOKOROZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MOUNTING ELECTRONIC COMPONENT
- Publication number 20250168985
- Publication date May 22, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- Toshiharu MOTOFUSA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250157961
- Publication date May 15, 2025
- DENSO CORPORATION
- Shiro MIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATTERY PROTECTION PACKAGE HAVING CO-PACKED TRANSISTORS AND INTEGRA...
- Publication number 20250157894
- Publication date May 15, 2025
- Alpha and Omega Semiconductor International LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSOR PACKAGE
- Publication number 20250160011
- Publication date May 15, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Brian Patrick McGARVEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MOUNTING SEMICONDUCTOR DEVICE
- Publication number 20250157911
- Publication date May 15, 2025
- Mitsubishi Electric Corporation
- Kazuki NISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINT BODY, SEMICONDUCTOR DEVICE EQUIPPED WITH JOINT BODY, AND JOIN...
- Publication number 20250144890
- Publication date May 8, 2025
- Mitsubishi Electric Corporation
- Tatsuya KITAGAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COVERS FOR SEMICONDUCTOR PACKAGE COMPONENTS
- Publication number 20250149394
- Publication date May 8, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan Kalyani KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250149410
- Publication date May 8, 2025
- RENESAS ELECTRONICS CORPORATION
- Seiya ISOZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250149415
- Publication date May 8, 2025
- JCET Group Co., LTD.
- Yun GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID QUAD FLAT PACKAGE ELECTRONIC DEVICE
- Publication number 20250140653
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITIES IN PACKAGE CONDUCTIVE TERMINALS
- Publication number 20250140655
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Jefferson LUGUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC-FILLED BOND PADS IN CLIP PACKAGES
- Publication number 20250140718
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Jose Arvin M. PLOMANTES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID POWER CONVERTERS, LATERAL DEVICES, VERTICAL DEVICES, MULTIPL...
- Publication number 20250132666
- Publication date Apr 24, 2025
- MURATA MANUFACTURING CO., LTD.
- David GIULIANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multifunctional Adhesion Promoter for Semiconductor Device Packages
- Publication number 20250122413
- Publication date Apr 17, 2025
- Wolfspeed, Inc.
- Afshin Dadvand
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250125693
- Publication date Apr 17, 2025
- Fuji Electric Co., Ltd.
- Shigemi MIYAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTELLIGENT POWER MODULE ARRANGEMENT
- Publication number 20250118634
- Publication date Apr 10, 2025
- Infineon Technologies Austria AG
- Chang Young PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20250118705
- Publication date Apr 10, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRAL THERMAL DISSIPATION STRU...
- Publication number 20250112114
- Publication date Apr 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Ninad Shahane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250112095
- Publication date Apr 3, 2025
- Mitsubishi Electric Corporation
- Kazufumi OKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH AN INSULATION LAYER
- Publication number 20250112182
- Publication date Apr 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250112562
- Publication date Apr 3, 2025
- Hitachi Astemo, Ltd.
- Junpei KUSUKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED STACKED SUBSTRATE FOR ISOLATED POWER MODULE
- Publication number 20250096084
- Publication date Mar 20, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Vijaylaxmi Khanolkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ENHANCED SOLDERABILITY AND METHOD THEREFOR
- Publication number 20250096077
- Publication date Mar 20, 2025
- NXP B.V.
- Yen-Chih Lin
- H01 - BASIC ELECTRIC ELEMENTS

the item being metallic

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device packaging with galvanic isolation

Conductive members atop semiconductor packages

Integrated transformer module

Semiconductor package having wettable lead flanks and tie bars and...

Method for manufacturing leadless semiconductor package with wettab...

Semiconductor manufacturing apparatus and method of manufacturing s...

Electronic devices in semiconductor package cavities

Lead frame and manufacturing method thereof

Laser-cut lead-frame for integrated circuit (IC) packages

ESD protection device

Semiconductor device and method of manufacturing the same

Method of manufacturing semiconductor devices and corresponding sem...

Semiconductor package and lead frame with enhanced device isolation

Package-on-package assembly with wire bond vias

Power semiconductor package having first and second lead frames

Package structures

Covers for semiconductor package components

Semiconductor package with blind hole attachment to heat sink

Package structure and method for fabricating the same

Chemically anchored mold compounds in semiconductor packages

Fluorescent body, method for manufacturing same, and light-emitting...

Methods of determining a sequence for creating a plurality of wire...

Semiconductor device

Floating die package

Dicing die attach film, and semiconductor package using the same an...

Semiconductor device

Isolation device and method of transmitting a signal across an isol...

Dual-side cooling semiconductor packages and related methods

Semiconductor device

Semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE HAVING WETTABLE LEAD FLANKS AND TIE BARS AND...

SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRATED LAMINATE TRANSFORMER

POWER CONVERSION DEVICE

LEAD FRAME AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

ELECTRONIC PACKAGE WITH A BATTERY SECURED BY A BENT LEADFRAME

SEMICONDUCTOR DEVICE

CIRCUIT BOARD AND METHOD FOR MOUNTING ELECTRONIC COMPONENT

SEMICONDUCTOR DEVICE

BATTERY PROTECTION PACKAGE HAVING CO-PACKED TRANSISTORS AND INTEGRA...

OPTICAL SENSOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF MOUNTING SEMICONDUCTOR DEVICE

JOINT BODY, SEMICONDUCTOR DEVICE EQUIPPED WITH JOINT BODY, AND JOIN...

COVERS FOR SEMICONDUCTOR PACKAGE COMPONENTS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PACKAGING STRUCTURE AND METHOD FOR FORMING THE SAME

HYBRID QUAD FLAT PACKAGE ELECTRONIC DEVICE

CAVITIES IN PACKAGE CONDUCTIVE TERMINALS

DIELECTRIC-FILLED BOND PADS IN CLIP PACKAGES

HYBRID POWER CONVERTERS, LATERAL DEVICES, VERTICAL DEVICES, MULTIPL...

Multifunctional Adhesion Promoter for Semiconductor Device Packages

SEMICONDUCTOR DEVICE

INTELLIGENT POWER MODULE ARRANGEMENT

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRAL THERMAL DISSIPATION STRU...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE WITH AN INSULATION LAYER

SEMICONDUCTOR DEVICE

INTEGRATED STACKED SUBSTRATE FOR ISOLATED POWER MODULE

SEMICONDUCTOR DEVICE WITH ENHANCED SOLDERABILITY AND METHOD THEREFOR