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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/48245the item being metallic

Industries

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Patents Grantslast 30 patents

Information Patent Grant
MEMS resonator integrated cicruit fabrication
- Patent number 12,365,582
- Issue date Jul 22, 2025
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device
- Patent number 12,362,264
- Issue date Jul 15, 2025
- Kabushiki Kaisha Toshiba
- Toru Sugiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,362,339
- Issue date Jul 15, 2025
- Kabushiki Kaisha Toshiba
- Kenichi Agawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,347,756
- Issue date Jul 1, 2025
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced electronic packages for GaN power integrated cir...
- Patent number 12,334,421
- Issue date Jun 17, 2025
- NAVITAS SEMICONDUCTOR LIMITED
- Daniel M. Kinzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packaging with galvanic isolation
- Patent number 12,278,169
- Issue date Apr 15, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Maria Cristina Estacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive members atop semiconductor packages
- Patent number 12,272,626
- Issue date Apr 8, 2025
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated transformer module
- Patent number 12,272,638
- Issue date Apr 8, 2025
- Murata Manufacturing Co., Ltd.
- Takayuki Tange
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having wettable lead flanks and tie bars and...
- Patent number 12,261,101
- Issue date Mar 25, 2025
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing leadless semiconductor package with wettab...
- Patent number 12,255,076
- Issue date Mar 18, 2025
- STMicroelectronics, Inc.
- Ian Harvey Arellano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus and method of manufacturing s...
- Patent number 12,255,080
- Issue date Mar 18, 2025
- Mitsubishi Electric Corporation
- Takamasa Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices in semiconductor package cavities
- Patent number 12,255,115
- Issue date Mar 18, 2025
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and manufacturing method thereof
- Patent number 12,243,811
- Issue date Mar 4, 2025
- Dai Nippon Printing Co., Ltd.
- Masahiro Nagata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Laser-cut lead-frame for integrated circuit (IC) packages
- Patent number 12,224,181
- Issue date Feb 11, 2025
- Texas Instruments Incorporated
- Tiange Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ESD protection device
- Patent number 12,224,579
- Issue date Feb 11, 2025
- Nexperia B.V.
- Hans-Martin Ritter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,211,764
- Issue date Jan 28, 2025
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices and corresponding sem...
- Patent number 12,211,772
- Issue date Jan 28, 2025
- STMicroelectronics S.r.l.
- Fulvio Vittorio Fontana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and lead frame with enhanced device isolation
- Patent number 12,211,770
- Issue date Jan 28, 2025
- Infineon Technologies Austria AG
- Balehithlu Manjappaiah Upendra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 12,211,821
- Issue date Jan 28, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package having first and second lead frames
- Patent number 12,211,824
- Issue date Jan 28, 2025
- Infineon Technologies AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures
- Patent number 12,199,088
- Issue date Jan 14, 2025
- ANCORA SEMICONDUCTORS INC.
- Jen-Chih Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Covers for semiconductor package components
- Patent number 12,198,995
- Issue date Jan 14, 2025
- Texas Instruments Incorporated
- Sreenivasan Kalyani Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with blind hole attachment to heat sink
- Patent number 12,191,229
- Issue date Jan 7, 2025
- Infineon Technologies AG
- Ryan Tordillo Comadre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for fabricating the same
- Patent number 12,191,262
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemically anchored mold compounds in semiconductor packages
- Patent number 12,180,595
- Issue date Dec 31, 2024
- Texas Instruments Incorporated
- Nazila Dadvand
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Fluorescent body, method for manufacturing same, and light-emitting...
- Patent number 12,180,402
- Issue date Dec 31, 2024
- National Institute for Materials Science
- Naoto Hirosaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of determining a sequence for creating a plurality of wire...
- Patent number 12,183,711
- Issue date Dec 31, 2024
- Kulicke and Soffa Industries, Inc.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,183,663
- Issue date Dec 31, 2024
- Rohm Co., Ltd.
- Kazuki Okuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Floating die package
- Patent number 12,176,298
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dicing die attach film, and semiconductor package using the same an...
- Patent number 12,176,314
- Issue date Dec 24, 2024
- Furukawa Electric Co., Ltd.
- Minoru Morita
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHEMICALLY ANCHORED MOLD COMPOUNDS IN SEMICONDUCTOR PACKAGES
- Publication number 20250236955
- Publication date Jul 24, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
IMMERSION PLATING PROCESS FOR AN INTEGRATED CIRCUIT
- Publication number 20250239462
- Publication date Jul 24, 2025
- TEXAS INSTRUMENTS INCORPORATED
- NAZILA DADVAND
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250239559
- Publication date Jul 24, 2025
- Mitsubishi Electric Corporation
- Takashi TSUBAKIDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS CONDITION MEASUREMENT DEVICE INCLUDING THERMALLY ISOLATED E...
- Publication number 20250239473
- Publication date Jul 24, 2025
- KLA Corporation
- Farhat A. Quli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGING WITH GALVANIC ISOLATION
- Publication number 20250233055
- Publication date Jul 17, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Maria Cristina ESTACIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED COOLING SEMICONDUCTOR DEVICE
- Publication number 20250233032
- Publication date Jul 17, 2025
- Power Master Semiconductor Co., Ltd.
- Ki-Myung YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HEAT FLOW RESTRICTING CONNECTOR
- Publication number 20250226351
- Publication date Jul 10, 2025
- Infineon Technologies Austria AG
- Bhargav Pandya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE SEMICONDUCTOR PACKAGE
- Publication number 20250226295
- Publication date Jul 10, 2025
- Infineon Technologies Austria AG
- Bhargav Pandya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Devices Including Shape-Memory Metallization
- Publication number 20250226338
- Publication date Jul 10, 2025
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUITABLE FOR HIGH VOLTAGE APPLICATIONS AND ME...
- Publication number 20250226353
- Publication date Jul 10, 2025
- INFINEON TECHNOLOGIES AG
- Chin Yong Neo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE PACKAGE WITH IMPROVED LIGHT QUALITY
- Publication number 20250226362
- Publication date Jul 10, 2025
- Lumileds LLC
- Cheng Wei HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH COMPONENT-CARRYING INTERMEDIATE STRUCTURE AND ADDITION...
- Publication number 20250218914
- Publication date Jul 3, 2025
- INFINEON TECHNOLOGIES AG
- Hao ZHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES
- Publication number 20250218886
- Publication date Jul 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel MANACK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR BATTERY CONNECTION IN MICROELECTRONIC PACKAGES
- Publication number 20250210479
- Publication date Jun 26, 2025
- NXP USA, Inc.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER DEVICE, AND POWER MODULE
- Publication number 20250210574
- Publication date Jun 26, 2025
- Kabushiki Kaisha Toshiba
- Fumiyoshi KAWASHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED WIRE BOND CONFIGURATION FOR A LIGHT EMITTING DIODE PACKAGE
- Publication number 20250212573
- Publication date Jun 26, 2025
- DOMINANT Opto Technologies Sdn Bhd
- LOW TEK BENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD FOR FORMING HIGH VOLTAGE RESISTOR NETWORKS OVER...
- Publication number 20250201703
- Publication date Jun 19, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey A. West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250201673
- Publication date Jun 19, 2025
- RENESAS ELECTRONICS CORPORATION
- Kazuki MATSUMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE MEMBERS ATOP SEMICONDUCTOR PACKAGES
- Publication number 20250201677
- Publication date Jun 19, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING USING A FLOATING PAD
- Publication number 20250201681
- Publication date Jun 19, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Hiroshi INOGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND BYPRODUCT OF SEMICONDUCTOR COMP...
- Publication number 20250201752
- Publication date Jun 19, 2025
- PANJIT INTERNATIONAL INC.
- Chung Hsiung HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Engineered Interconnect Structures for Enhanced Bonding Strength
- Publication number 20250201674
- Publication date Jun 19, 2025
- Wolfspeed, Inc.
- Brice McPherson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTELLIGENT POWER MODULE
- Publication number 20250201680
- Publication date Jun 19, 2025
- RICHTEK TECHNOLOGY CORPORATION
- Lung-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD FOR PRODUCING THE SAME
- Publication number 20250191916
- Publication date Jun 12, 2025
- Mitsubishi Electric Corporation
- Kazuhiro NISHIMURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICES WITH SIDEWALL RECESSES
- Publication number 20250192090
- Publication date Jun 12, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Rennier RODRIGUEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING WETTABLE LEAD FLANKS AND TIE BARS AND...
- Publication number 20250183132
- Publication date Jun 5, 2025
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRATED LAMINATE TRANSFORMER
- Publication number 20250183133
- Publication date Jun 5, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Chun Ping Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERSION DEVICE
- Publication number 20250183816
- Publication date Jun 5, 2025
- Mitsubishi Electric Corporation
- Tatsuya FUKASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND MANUFACTURING METHOD THEREOF
- Publication number 20250174530
- Publication date May 29, 2025
- DAI NIPPON PRINTING CO., LTD.
- Masahiro NAGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250174527
- Publication date May 29, 2025
- ROHM CO., LTD.
- Ryuta YAGINUMA
- H01 - BASIC ELECTRIC ELEMENTS

the item being metallic

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

MEMS resonator integrated cicruit fabrication

Semiconductor device

Semiconductor device

Semiconductor device

Thermally enhanced electronic packages for GaN power integrated cir...

Electronic device packaging with galvanic isolation

Conductive members atop semiconductor packages

Integrated transformer module

Semiconductor package having wettable lead flanks and tie bars and...

Method for manufacturing leadless semiconductor package with wettab...

Semiconductor manufacturing apparatus and method of manufacturing s...

Electronic devices in semiconductor package cavities

Lead frame and manufacturing method thereof

Laser-cut lead-frame for integrated circuit (IC) packages

ESD protection device

Semiconductor device and method of manufacturing the same

Method of manufacturing semiconductor devices and corresponding sem...

Semiconductor package and lead frame with enhanced device isolation

Package-on-package assembly with wire bond vias

Power semiconductor package having first and second lead frames

Package structures

Covers for semiconductor package components

Semiconductor package with blind hole attachment to heat sink

Package structure and method for fabricating the same

Chemically anchored mold compounds in semiconductor packages

Fluorescent body, method for manufacturing same, and light-emitting...

Methods of determining a sequence for creating a plurality of wire...

Semiconductor device

Floating die package

Dicing die attach film, and semiconductor package using the same an...

Patents Applicationslast 30 patents

CHEMICALLY ANCHORED MOLD COMPOUNDS IN SEMICONDUCTOR PACKAGES

IMMERSION PLATING PROCESS FOR AN INTEGRATED CIRCUIT

SEMICONDUCTOR DEVICE

PROCESS CONDITION MEASUREMENT DEVICE INCLUDING THERMALLY ISOLATED E...

ELECTRONIC DEVICE PACKAGING WITH GALVANIC ISOLATION

DOUBLE-SIDED COOLING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE WITH HEAT FLOW RESTRICTING CONNECTOR

MULTI-DIE SEMICONDUCTOR PACKAGE

Power Semiconductor Devices Including Shape-Memory Metallization

SEMICONDUCTOR PACKAGE SUITABLE FOR HIGH VOLTAGE APPLICATIONS AND ME...

LIGHT EMITTING DIODE PACKAGE WITH IMPROVED LIGHT QUALITY

PACKAGE WITH COMPONENT-CARRYING INTERMEDIATE STRUCTURE AND ADDITION...

ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES

METHODS FOR BATTERY CONNECTION IN MICROELECTRONIC PACKAGES

SEMICONDUCTOR DEVICE, POWER DEVICE, AND POWER MODULE

ENHANCED WIRE BOND CONFIGURATION FOR A LIGHT EMITTING DIODE PACKAGE

FABRICATION METHOD FOR FORMING HIGH VOLTAGE RESISTOR NETWORKS OVER...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

CONDUCTIVE MEMBERS ATOP SEMICONDUCTOR PACKAGES

WIRE BONDING USING A FLOATING PAD

SEMICONDUCTOR PACKAGE STRUCTURE AND BYPRODUCT OF SEMICONDUCTOR COMP...

Engineered Interconnect Structures for Enhanced Bonding Strength

INTELLIGENT POWER MODULE

SEMICONDUCTOR APPARATUS AND METHOD FOR PRODUCING THE SAME

SEMICONDUCTOR DEVICES WITH SIDEWALL RECESSES

SEMICONDUCTOR PACKAGE HAVING WETTABLE LEAD FLANKS AND TIE BARS AND...

SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRATED LAMINATE TRANSFORMER

POWER CONVERSION DEVICE

LEAD FRAME AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE