Membership
Tour
Register
Log in
the item being metallic
Follow
Industry
CPC
H01L2224/08175
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/08175
the item being metallic
Industries
Overview
Organizations
People
Information
Impact
Please log in for detailed analytics
Patents Grants
last 30 patents
Patents Applications
last 30 patents
Information
Patent Application
POWER SEMICONDUCTOR MODULE HAVING A METALLIC CLIP WITH ULTRASONICAL...
Publication number
20240404982
Publication date
Dec 5, 2024
INFINEON TECHNOLOGIES AG
Marian Sebastian Broll
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MODULE AND HEAT DISSIPATION BASE
Publication number
20240387334
Publication date
Nov 21, 2024
Fuji Electric Co., Ltd.
Makoto ISOZAKI
H01 - BASIC ELECTRIC ELEMENTS