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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    POWER MODULES
    • Publication number 20250221320
    • Publication date Jul 3, 2025
    • Hyundai Motor Company
    • Suk Hyun LIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20250201679
    • Publication date Jun 19, 2025
    • DENSO CORPORATION
    • Mitsuki KAWANO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ISOLATOR
    • Publication number 20250194115
    • Publication date Jun 12, 2025
    • Kabushiki Kaisha Toshiba
    • Jia LIU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICES WITH BENT POLYIMIDE TAPE AND ASSOCIATED MANUF...
    • Publication number 20250191959
    • Publication date Jun 12, 2025
    • INFINEON TECHNOLOGIES AG
    • Rainer Markus SCHALLER
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER MODULES
    • Publication number 20250169375
    • Publication date May 22, 2025
    • Hyundai Motor Company
    • Suk Hyun LIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20250157912
    • Publication date May 15, 2025
    • SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
    • Takuma MORI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE
    • Publication number 20250140660
    • Publication date May 1, 2025
    • ROHM CO., LTD.
    • Kenji HAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIRECT COPPER WIRE BONDING ON NANOTWIN COPPER STRUCTURES
    • Publication number 20250140735
    • Publication date May 1, 2025
    • TEXAS INSTRUMENTS INCORPORATED
    • Jomari AUSTRIA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR DEVICE
    • Publication number 20250140737
    • Publication date May 1, 2025
    • Mitsubishi Electric Corporation
    • Koichi TOKUBO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20250140658
    • Publication date May 1, 2025
    • Fuji Electric Co., Ltd.
    • Masanori TANAKA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20250132230
    • Publication date Apr 24, 2025
    • Mitsubishi Electric Corporation
    • Tatsuya KAWASE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20250125214
    • Publication date Apr 17, 2025
    • DENSO CORPORATION
    • Ryo KIMURA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20250118621
    • Publication date Apr 10, 2025
    • DENSO CORPORATION
    • MOTOMI MUROZAKI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20250118623
    • Publication date Apr 10, 2025
    • DENSO CORPORATION
    • Ryo KIMURA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    • Publication number 20250112134
    • Publication date Apr 3, 2025
    • Mitsubishi Electric Corporation
    • Yoshihisa UCHIDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COMPACT POWER MODULE
    • Publication number 20250112211
    • Publication date Apr 3, 2025
    • Wolfspeed, Inc.
    • Brice McPherson
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGES WITH STEPPED CONDUCTIVE TERMINALS
    • Publication number 20250112133
    • Publication date Apr 3, 2025
    • TEXAS INSTRUMENTS INCORPORATED
    • Huo Yun DUAN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE HAVING LEAD FRAME WITH SLANTED SECTIONS
    • Publication number 20250112132
    • Publication date Apr 3, 2025
    • ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
    • Zhiqiang Niu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    QUAD FLAT NO-LEAD PACKAGE WITH ENHANCED CORNER PADS FOR BOARD LEVEL...
    • Publication number 20250105104
    • Publication date Mar 27, 2025
    • TEXAS INSTRUMENTS INCORPORATED
    • Li Jiang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC CIRCUIT PACKAGES THAT DEMONSTRATE REDUCED ADHESION TO MO...
    • Publication number 20250105107
    • Publication date Mar 27, 2025
    • Aculon, Inc.
    • Donald Cunningham
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND POWER CONTROL UNIT
    • Publication number 20250105081
    • Publication date Mar 27, 2025
    • DENSO CORPORATION
    • Keita FUKUTANI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20250072020
    • Publication date Feb 27, 2025
    • Rohm Co., Ltd.
    • Akira SAGAWA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20250069998
    • Publication date Feb 27, 2025
    • ROHM CO., LTD.
    • Takahiro KOTANI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING
    • Publication number 20250062217
    • Publication date Feb 20, 2025
    • NXP USA, Inc.
    • You Ge
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER MODULE AND METHOD FOR MANUFACTURING A POWER MODULE
    • Publication number 20250062242
    • Publication date Feb 20, 2025
    • Hitachi Energy Ltd
    • Fabian FISCHER
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor Device and Method Using Lead Frame Interposer in Bump...
    • Publication number 20250054902
    • Publication date Feb 13, 2025
    • STATS ChipPAC Pte Ltd.
    • Peik Eng Ooi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE
    • Publication number 20250022822
    • Publication date Jan 16, 2025
    • ROHM CO., LTD.
    • Hirofumi TANAKA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20250006604
    • Publication date Jan 2, 2025
    • DENSO CORPORATION
    • Kazuki YAMAUCHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20250006621
    • Publication date Jan 2, 2025
    • ROHM CO., LTD.
    • Ryohei UMENO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240429133
    • Publication date Dec 26, 2024
    • ROHM CO., LTD.
    • Tsunehisa ONO
    • H01 - BASIC ELECTRIC ELEMENTS