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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/24175the item being metallic

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages having thermal conductive pattern
- Patent number 12,068,224
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,068,173
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and corresponding method of manufacture
- Patent number 12,068,276
- Issue date Aug 20, 2024
- STMicroelectronics S.R.L.
- Giovanni Graziosi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead between a plurality of encapsulated MOSFETs
- Patent number 11,830,792
- Issue date Nov 28, 2023
- Rohm Co., Ltd.
- Kentaro Nasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure comprising via structure and redist...
- Patent number 11,817,413
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Neng-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,810,883
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and method of manufacturing the same
- Patent number 11,798,859
- Issue date Oct 24, 2023
- Advanced Semiconductor Engineering, Inc.
- Chia-Pin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,699,597
- Issue date Jul 11, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices and corresponding sem...
- Patent number 11,626,379
- Issue date Apr 11, 2023
- STMicroelectronics S.r.l.
- Roberto Tiziani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having thermal conductive patterns surroundi...
- Patent number 11,562,941
- Issue date Jan 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded packaging module and manufacturing method for the same
- Patent number 11,552,039
- Issue date Jan 10, 2023
- Delta Electronics (Shanghai) Co., Ltd.
- Zengsheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic semiconductor device and method for producing optoel...
- Patent number 11,462,500
- Issue date Oct 4, 2022
- OSRAM OLED GmbH
- Matthias Hien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating package structure
- Patent number 11,450,641
- Issue date Sep 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure with landing pads and manufacturing...
- Patent number 11,437,336
- Issue date Sep 6, 2022
- Powertech Technology Inc.
- Jeffrey Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,322,438
- Issue date May 3, 2022
- Winbond Electronics Corp.
- Yen-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 11,264,313
- Issue date Mar 1, 2022
- Kabushiki Kaisha Toshiba
- Akito Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging method and chip structure
- Patent number 11,233,028
- Issue date Jan 25, 2022
- PEP INOVATION PTE. LTD.
- Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices, corresponding device...
- Patent number 11,133,242
- Issue date Sep 28, 2021
- STMicroelectronics S.r.l.
- Michele Derai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,081,369
- Issue date Aug 3, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices and corresponding sem...
- Patent number 10,971,375
- Issue date Apr 6, 2021
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor having system-in-package module, method for producing the sa...
- Patent number 10,950,574
- Issue date Mar 16, 2021
- Continental Teves AG & Co. OHG
- Manfred Goll
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having thermal conductive pattern surrounding...
- Patent number 10,916,488
- Issue date Feb 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices, corresponding device...
- Patent number 10,818,578
- Issue date Oct 27, 2020
- STMicroelectronics S.r.l.
- Michele Derai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including a semiconductor chip monolithically integrated wit...
- Patent number 10,763,246
- Issue date Sep 1, 2020
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating interconnect for silicon chip
- Patent number 10,755,940
- Issue date Aug 25, 2020
- Texas Instruments Incorporated
- Jerard Canuto Malado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Producing wafer level packaging using leadframe strip and related d...
- Patent number 10,304,763
- Issue date May 28, 2019
- GLOBALFOUNDRIES Inc.
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Remapped packaged extracted die with 3D printed bond connections
- Patent number 10,147,660
- Issue date Dec 4, 2018
- Global Circuits Innovations, Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D printed hermetic package assembly and method
- Patent number 10,128,161
- Issue date Nov 13, 2018
- Global Circuit Innovations, Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for printing integrated circuit bond connections
- Patent number 9,935,028
- Issue date Apr 3, 2018
- Global Circuit Innovations Incorporated
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with printed bond connections
- Patent number 9,824,948
- Issue date Nov 21, 2017
- Global Circuit Innovations Incorporated
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20240186233
- Publication date Jun 6, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240055329
- Publication date Feb 15, 2024
- ROHM CO., LTD.
- Kentaro NASU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240047403
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Neng-Chieh CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20230369273
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230290650
- Publication date Sep 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20230230948
- Publication date Jul 20, 2023
- STMicroelectronics S.r.l.
- Roberto TIZIANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED HEAT DISSIPATION POWER SEMICONDUCTOR MODULE AND METHOD...
- Publication number 20230197557
- Publication date Jun 22, 2023
- LX Semicon Co., Ltd.
- Tae Ryong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS FOR MANUFACTURING THEREOF
- Publication number 20230117806
- Publication date Apr 20, 2023
- INFINEON TECHNOLOGIES AG
- Thorsten MEYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20230112056
- Publication date Apr 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230067826
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Neng-Chieh CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220367306
- Publication date Nov 17, 2022
- Advanced Semiconductor Engineering, Inc.
- Chia-Pin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRCATING THE SAME
- Publication number 20220367409
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT EMBEDDED SUBSTRATE AND CIRCUIT MODULE USING TH...
- Publication number 20220238474
- Publication date Jul 28, 2022
- TDK Corporation
- Toshiyuki ABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220077051
- Publication date Mar 10, 2022
- WINBOND ELECTRONICS CORP.
- Yen-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210398884
- Publication date Dec 23, 2021
- Kentaro NASU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210358768
- Publication date Nov 18, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210343674
- Publication date Nov 4, 2021
- Powertech Technology Inc.
- Jeffrey Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT IDENTIFICATION CHIP PACKAGE AND METHOD FOR MAKING SAME
- Publication number 20210313244
- Publication date Oct 7, 2021
- SOCLE TECHNOLOGY CORP.
- HSIANG-HUA LU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20210305191
- Publication date Sep 30, 2021
- STMicroelectronics S.r.l.
- Roberto TIZIANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURE
- Publication number 20210305203
- Publication date Sep 30, 2021
- STMicroelectronics S.r.l
- Giovanni GRAZIOSI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure for High Power GaN Module
- Publication number 20210175195
- Publication date Jun 10, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20210159147
- Publication date May 27, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRCATING PACKAGE STRUCTURE
- Publication number 20210098417
- Publication date Apr 1, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...
- Publication number 20210013134
- Publication date Jan 14, 2021
- STMicroelectronics S.r.l.
- Michele DERAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optoelectronic Semiconductor Device and Method for Producing Optoel...
- Publication number 20200402943
- Publication date Dec 24, 2020
- OSRAM OLED GmbH
- Matthias HIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200273718
- Publication date Aug 27, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PACKAGING MODULE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20200251438
- Publication date Aug 6, 2020
- DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Zengsheng WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING METHOD AND CHIP STRUCTURE
- Publication number 20200203302
- Publication date Jun 25, 2020
- PEP INNOVATION PTE LTD.
- Jimmy CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20200083150
- Publication date Mar 12, 2020
- Kabushiki Kaisha Toshiba
- Akito Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATING INTERCONNECT FOR SILICON CHIP
- Publication number 20200027737
- Publication date Jan 23, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Jerard Canuto Malado
- H01 - BASIC ELECTRIC ELEMENTS

the item being metallic

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor packages having thermal conductive pattern

Package structure and manufacturing method thereof

Semiconductor device and corresponding method of manufacture

Lead between a plurality of encapsulated MOSFETs

Semiconductor package structure comprising via structure and redist...

Package structure

Electronic device package and method of manufacturing the same

Package structure and manufacturing method thereof

Method of manufacturing semiconductor devices and corresponding sem...

Semiconductor packages having thermal conductive patterns surroundi...

Embedded packaging module and manufacturing method for the same

Optoelectronic semiconductor device and method for producing optoel...

Method of fabricating package structure

Semiconductor package structure with landing pads and manufacturing...

Package structure and manufacturing method thereof

Semiconductor device and method for manufacturing same

Chip packaging method and chip structure

Method of manufacturing semiconductor devices, corresponding device...

Package structure and manufacturing method thereof

Method of manufacturing semiconductor devices and corresponding sem...

Sensor having system-in-package module, method for producing the sa...

Semiconductor package having thermal conductive pattern surrounding...

Method of manufacturing semiconductor devices, corresponding device...

Device including a semiconductor chip monolithically integrated wit...

Plating interconnect for silicon chip

Producing wafer level packaging using leadframe strip and related d...

Remapped packaged extracted die with 3D printed bond connections

3D printed hermetic package assembly and method

Method and apparatus for printing integrated circuit bond connections

Integrated circuit with printed bond connections

Patents Applicationslast 30 patents

PACKAGING STRUCTURE AND PACKAGING METHOD

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE STRUCTURE

PACKAGE STRUCTURE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

DOUBLE-SIDED HEAT DISSIPATION POWER SEMICONDUCTOR MODULE AND METHOD...

SEMICONDUCTOR PACKAGES AND METHODS FOR MANUFACTURING THEREOF

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

PACKAGE STRUCTURE AND METHOD OF FABRCATING THE SAME

ELECTRONIC COMPONENT EMBEDDED SUBSTRATE AND CIRCUIT MODULE USING TH...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

FINGERPRINT IDENTIFICATION CHIP PACKAGE AND METHOD FOR MAKING SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURE

Interconnect Structure for High Power GaN Module

SEMICONDUCTOR PACKAGES

METHOD OF FABRCATING PACKAGE STRUCTURE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...

Optoelectronic Semiconductor Device and Method for Producing Optoel...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

EMBEDDED PACKAGING MODULE AND MANUFACTURING METHOD FOR THE SAME

CHIP PACKAGING METHOD AND CHIP STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

PLATING INTERCONNECT FOR SILICON CHIP