the item being metallic

Industry

CPC
H01L2224/32175

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/32175the item being metallic

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having second connector that overlaps a part o...
- Patent number 11,688,711
- Issue date Jun 27, 2023
- Kabushiki Kaisha Toshiba
- Yoshiharu Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a chip carrier and a metal plate sized...
- Patent number 11,676,879
- Issue date Jun 13, 2023
- Infineon Technologies AG
- Stefan Woetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,538,737
- Issue date Dec 27, 2022
- Samsung Electronics Co., Ltd.
- Myungsam Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having second connector that overlaps a part o...
- Patent number 11,195,814
- Issue date Dec 7, 2021
- Kabushiki Kaisha Toshiba
- Yoshiharu Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 11,152,275
- Issue date Oct 19, 2021
- Mitsubishi Electric Corporation
- Takanobu Kajihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate
- Patent number 9,818,681
- Issue date Nov 14, 2017
- Shinko Electric Industries Co., Ltd.
- Yoshihiro Machida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging structure and manufacturing method thereof
- Patent number 9,640,475
- Issue date May 2, 2017
- MStar Semiconductor, Inc.
- You-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packages having sidewall-deposited heat spreader st...
- Patent number 9,355,985
- Issue date May 31, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method and bonding material using metal particle
- Patent number 8,821,768
- Issue date Sep 2, 2014
- Hitachi, Ltd.
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD TO CONNECT POWER TERMINAL TO SUBSTRATE WITHIN SEMICONDUCTOR...
- Publication number 20240355718
- Publication date Oct 24, 2024
- LITTELFUSE, INC.
- THOMAS SPANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFICATION HIGH-FREQUENCY CIRCUIT DEVICE
- Publication number 20240213189
- Publication date Jun 27, 2024
- Mitsubishi Electric Corporation
- Yuta SUGIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE INCLUDING DISPLAY MODULE AND METHOD FOR MANUFACTURIN...
- Publication number 20240203910
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Tackmo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module
- Publication number 20220399259
- Publication date Dec 15, 2022
- Michael Ebli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A CHIP CARRIER AND A METAL PLATE SIZED...
- Publication number 20220102235
- Publication date Mar 31, 2022
- INFINEON TECHNOLOGIES AG
- Stefan Woetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220059494
- Publication date Feb 24, 2022
- Kabushiki Kaisha Toshiba
- Yoshiharu TAKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210210414
- Publication date Jul 8, 2021
- Samsung Electronics Co., Ltd.
- Myungsam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE USING CONDUCTIVE METAL STRUCTURE
- Publication number 20210166997
- Publication date Jun 3, 2021
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200402946
- Publication date Dec 24, 2020
- Kabushiki Kaisha Toshiba
- Yoshiharu TAKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGES HAVING SIDEWALL-DEPOSITED HEAT SPREADER ST...
- Publication number 20150348865
- Publication date Dec 3, 2015
- MICHAEL B. VINCENT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM TRANSFERABLE LOGIC CIRCUIT, AND METHODS FOR PROVIDING FILM TRA...
- Publication number 20140264462
- Publication date Sep 18, 2014
- Illinois Tool Works, Inc.
- JOHN H. SCHNEIDER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD AND BONDING MATERIAL USING METAL PARTICLE
- Publication number 20080156398
- Publication date Jul 3, 2008
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

the item being metallic

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device having second connector that overlaps a part o...

Semiconductor package having a chip carrier and a metal plate sized...

Semiconductor package

Semiconductor device having second connector that overlaps a part o...

Semiconductor device and method for manufacturing semiconductor device

Wiring substrate

Chip packaging structure and manufacturing method thereof

Microelectronic packages having sidewall-deposited heat spreader st...

Bonding method and bonding material using metal particle

Patents Applicationslast 30 patents

METHOD TO CONNECT POWER TERMINAL TO SUBSTRATE WITHIN SEMICONDUCTOR...

POWER AMPLIFICATION HIGH-FREQUENCY CIRCUIT DEVICE

DISPLAY DEVICE INCLUDING DISPLAY MODULE AND METHOD FOR MANUFACTURIN...

Power Semiconductor Module

SEMICONDUCTOR PACKAGE HAVING A CHIP CARRIER AND A METAL PLATE SIZED...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE USING CONDUCTIVE METAL STRUCTURE

SEMICONDUCTOR DEVICE

MICROELECTRONIC PACKAGES HAVING SIDEWALL-DEPOSITED HEAT SPREADER ST...

FILM TRANSFERABLE LOGIC CIRCUIT, AND METHODS FOR PROVIDING FILM TRA...

BONDING METHOD AND BONDING MATERIAL USING METAL PARTICLE