the item being metallic

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H01L2224/24245

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/24245the item being metallic

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package for improving reliability
- Patent number 11,557,560
- Issue date Jan 17, 2023
- Samsung Electronics Co., Ltd.
- Yeohoon Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure of a SiC MOSFET power module and manufacturing...
- Patent number 11,251,106
- Issue date Feb 15, 2022
- Beijing University of Technology
- Fei Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electrically contacting a component by galvanic connecti...
- Patent number 11,037,862
- Issue date Jun 15, 2021
- Siemens Aktiengesellschaft
- Hubert Baueregger
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Power integrated module
- Patent number 11,024,588
- Issue date Jun 1, 2021
- Delta Electronics (Shanghai) Co., Ltd.
- Jianhong Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power integrated module
- Patent number 10,629,550
- Issue date Apr 21, 2020
- Delta Electronics (Shanghai) Co., Ltd.
- Jianhong Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio die package with backside conductive plate
- Patent number 10,453,804
- Issue date Oct 22, 2019
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switch circuit package module
- Patent number 10,276,520
- Issue date Apr 30, 2019
- Delta Electronics (Shanghai) Co., Ltd.
- Zeng Li
- G11 - INFORMATION STORAGE
Information Patent Grant
Switch circuit package module
- Patent number 9,754,871
- Issue date Sep 5, 2017
- Delta Electronics (Shanghai) Co., Ltd.
- Zeng Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with embedded bridge
- Patent number 9,716,067
- Issue date Jul 25, 2017
- Intel Corporation
- Ravindranath V. Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor package with conductive carr...
- Patent number 9,673,109
- Issue date Jun 6, 2017
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with multi-section conductive carrier
- Patent number 9,620,441
- Issue date Apr 11, 2017
- Infineon Technologies Americas Corp.
- Eung San Cho
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electrode connection structure and electrode connection method
- Patent number 9,601,448
- Issue date Mar 21, 2017
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package having vertically stacked driver IC
- Patent number 9,502,395
- Issue date Nov 22, 2016
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package with multi-section conductive carrier
- Patent number 9,331,005
- Issue date May 3, 2016
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for embedding controlled-cavity MEMS package in integration...
- Patent number 9,321,631
- Issue date Apr 26, 2016
- Texas Instruments Incorporated
- Christopher Daniel Manack
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit package with embedded bridge
- Patent number 9,275,955
- Issue date Mar 1, 2016
- Intel Corporation
- Ravindranath V. Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molding material and method for packaging semiconductor chips
- Patent number 9,209,152
- Issue date Dec 8, 2015
- Infineon Technologies AG
- Kok Chai Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device having an embedded system
- Patent number 9,171,787
- Issue date Oct 27, 2015
- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power converter package including vertically stacked driver IC
- Patent number 9,159,703
- Issue date Oct 13, 2015
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with conductive carrier integrated heat spreader
- Patent number 9,111,921
- Issue date Aug 18, 2015
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package with non-contiguous, multi-section cond...
- Patent number 9,111,776
- Issue date Aug 18, 2015
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for embedding controlled-cavity MEMS package in integration...
- Patent number 8,866,237
- Issue date Oct 21, 2014
- Texas Instruments Incorporated
- Christopher D. Manack
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Die arrangement and method of forming a die arrangement
- Patent number 8,686,569
- Issue date Apr 1, 2014
- Infineon Technologies AG
- Frank Daeche
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with conductor tracks between semiconductor ch...
- Patent number 7,443,019
- Issue date Oct 28, 2008
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20240332238
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- Guendalina CATALANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE FOR IMPROVING RELIABILITY
- Publication number 20220059492
- Publication date Feb 24, 2022
- Samsung Electronics Co., Ltd.
- Yeohoon Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging structure of a SiC MOSFET power module and manufacturing...
- Publication number 20210217681
- Publication date Jul 15, 2021
- BEIJING UNIVERSITY OF TECHNOLOGY
- FEI QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH EMBEDDED BRIDGE
- Publication number 20150171015
- Publication date Jun 18, 2015
- Ravindranath V. Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Device
- Publication number 20140353808
- Publication date Dec 4, 2014
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molding Material and Method for Packaging Semiconductor Chips
- Publication number 20140312497
- Publication date Oct 23, 2014
- INFINEON TECHNOLOGIES AG
- Kok Chai Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Conductive Carrier Integrated Heat Spreader
- Publication number 20140110796
- Publication date Apr 24, 2014
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Converter Package Including Vertically Stacked Driver IC
- Publication number 20140110863
- Publication date Apr 24, 2014
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Embedding Controlled-Cavity MEMS Package in Integration...
- Publication number 20130221455
- Publication date Aug 29, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Christopher D. Manack
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIE ARRANGEMENT AND METHOD OF FORMING A DIE ARRANGEMENT
- Publication number 20120146201
- Publication date Jun 14, 2012
- INFINEON TECHNOLOGIES AG
- Frank Daeche
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with conductor tracks between semiconductor ch...
- Publication number 20070034997
- Publication date Feb 15, 2007
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS

the item being metallic

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package for improving reliability

Packaging structure of a SiC MOSFET power module and manufacturing...

Method for electrically contacting a component by galvanic connecti...

Power integrated module

Power integrated module

Radio die package with backside conductive plate

Switch circuit package module

Switch circuit package module

Integrated circuit package with embedded bridge

Method for fabricating a semiconductor package with conductive carr...

Semiconductor package with multi-section conductive carrier

Electrode connection structure and electrode connection method

Power semiconductor package having vertically stacked driver IC

Power semiconductor package with multi-section conductive carrier

Method for embedding controlled-cavity MEMS package in integration...

Integrated circuit package with embedded bridge

Molding material and method for packaging semiconductor chips

Packaged semiconductor device having an embedded system

Power converter package including vertically stacked driver IC

Semiconductor package with conductive carrier integrated heat spreader

Power semiconductor package with non-contiguous, multi-section cond...

Methods for embedding controlled-cavity MEMS package in integration...

Die arrangement and method of forming a die arrangement

Semiconductor device with conductor tracks between semiconductor ch...

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

SEMICONDUCTOR PACKAGE FOR IMPROVING RELIABILITY

Packaging structure of a SiC MOSFET power module and manufacturing...

INTEGRATED CIRCUIT PACKAGE WITH EMBEDDED BRIDGE

Packaged Semiconductor Device

Molding Material and Method for Packaging Semiconductor Chips

Semiconductor Package with Conductive Carrier Integrated Heat Spreader

Power Converter Package Including Vertically Stacked Driver IC

Methods for Embedding Controlled-Cavity MEMS Package in Integration...

DIE ARRANGEMENT AND METHOD OF FORMING A DIE ARRANGEMENT

Semiconductor device with conductor tracks between semiconductor ch...