the item being non-metallic

Industry

CPC
H01L2224/40155

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/40155the item being non-metallic

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,040,301
- Issue date Jul 16, 2024
- Rohm Co., Ltd.
- Katsuhiko Yoshihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,664,288
- Issue date May 30, 2023
- Mitsubishi Electric Corporation
- Kenta Nakahara
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device with a laser-connected terminal
- Patent number 11,664,342
- Issue date May 30, 2023
- Fuji Electric Co., Ltd.
- Shinji Tada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, semiconductor device,...
- Patent number 11,195,770
- Issue date Dec 7, 2021
- Mitsubishi Electric Corporation
- Kenta Nakahara
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of manufacturing semiconductor device, semiconductor device,...
- Patent number 11,171,068
- Issue date Nov 9, 2021
- Mitsubishi Electric Corporation
- Kenta Nakahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 10,181,445
- Issue date Jan 15, 2019
- Mitsubishi Electric Corporation
- Akihisa Fukumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,028,400
- Issue date Jul 17, 2018
- Fuji Electric Co., Ltd.
- Shin Soyano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip power semiconductor device
- Patent number 9,443,760
- Issue date Sep 13, 2016
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip power semiconductor device
- Patent number 8,916,968
- Issue date Dec 23, 2014
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT RADIATION STRUCTURE, COOLING S...
- Publication number 20250174521
- Publication date May 29, 2025
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250157892
- Publication date May 15, 2025
- Fuji Electric Co., Ltd.
- Takahiro KOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250079413
- Publication date Mar 6, 2025
- Fuji Electric Co., Ltd.
- Akira HIRAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE WITH BALANCED CURRENT FLOW
- Publication number 20240379526
- Publication date Nov 14, 2024
- Navitas Semiconductor Limited
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240355774
- Publication date Oct 24, 2024
- Mitsubishi Electric Corporation
- Nozomi SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING RIBBON...
- Publication number 20240250058
- Publication date Jul 25, 2024
- STMicroelectronics International N.V.
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER LEADFRAME PACKAGE WITH REDUCED SOLDER VOIDS
- Publication number 20240113064
- Publication date Apr 4, 2024
- STMICROELECTRONICS, INC.
- Jefferson Sismundo TALLEDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240096764
- Publication date Mar 21, 2024
- Fuji Electric Co., Ltd.
- Shinichiro ADACHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20240055355
- Publication date Feb 15, 2024
- ROHM CO., LTD.
- Ryuta WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT SUBSTRATE-SIDE COOLING IN POWER DEVICE MODULE
- Publication number 20240038632
- Publication date Feb 1, 2024
- Semiconductor Components Industries, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND METHOD FOR MANUFACTURING SAME
- Publication number 20230369195
- Publication date Nov 16, 2023
- Hyundai Motor Company
- Hyeon Uk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A LASER-CONNECTED TERMINAL
- Publication number 20210407955
- Publication date Dec 30, 2021
- Fuji Electric Co., Ltd.
- Shinji TADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210407954
- Publication date Dec 30, 2021
- Rohm Co., Ltd.
- Katsuhiko YOSHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE,...
- Publication number 20200168519
- Publication date May 28, 2020
- Mitsubishi Electric Corporation
- Kenta NAKAHARA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
POWER MODULE
- Publication number 20170352629
- Publication date Dec 7, 2017
- MITSUBISHI ELECTRIC CORPORATION
- Akihisa FUKUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multichip Power Semiconductor Device
- Publication number 20130256856
- Publication date Oct 3, 2013
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS

the item being non-metallic

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Method of manufacturing semiconductor device

Semiconductor device with a laser-connected terminal

Method of manufacturing semiconductor device, semiconductor device,...

Method of manufacturing semiconductor device, semiconductor device,...

Power module

Semiconductor device

Multichip power semiconductor device

Multichip power semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE INCLUDING HEAT RADIATION STRUCTURE, COOLING S...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

POWER MODULE WITH BALANCED CURRENT FLOW

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING RIBBON...

POWER LEADFRAME PACKAGE WITH REDUCED SOLDER VOIDS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR APPARATUS

DIRECT SUBSTRATE-SIDE COOLING IN POWER DEVICE MODULE

POWER MODULE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE WITH A LASER-CONNECTED TERMINAL

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE,...

POWER MODULE

Multichip Power Semiconductor Device