the item being non-metallic

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H01L2224/32225

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/32225the item being non-metallic

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 12,255,167
- Issue date Mar 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light emitting device
- Patent number 12,255,275
- Issue date Mar 18, 2025
- Rohm Co., Ltd.
- Tomoichiro Toyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench contact structures for advanced integrated circuit structure...
- Patent number 12,255,247
- Issue date Mar 18, 2025
- Intel Corporation
- Subhash M. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 12,255,168
- Issue date Mar 18, 2025
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 12,255,184
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 12,255,153
- Issue date Mar 18, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable architecture for reduced cycles across SOC
- Patent number 12,255,176
- Issue date Mar 18, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,255,116
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,249,563
- Issue date Mar 11, 2025
- Samsung Electronics Co., Ltd.
- Donguk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and forming method thereof
- Patent number 12,249,587
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method manufacturing the same
- Patent number 12,249,550
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and display unit
- Patent number 12,249,597
- Issue date Mar 11, 2025
- Osram Opto Semiconductors GmbH
- Sebastian Wittmann
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Package structure, RDL structure comprising redistribution layer ha...
- Patent number 12,249,564
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of integrated substrate structure
- Patent number 12,249,567
- Issue date Mar 11, 2025
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor system, moving body, and method...
- Patent number 12,243,789
- Issue date Mar 4, 2025
- Mitsubishi Electric Corporation
- Naoki Yoshimatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with EMI shield and fabricating method thereof
- Patent number 12,243,834
- Issue date Mar 4, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Doo Soub Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wirebondable interposer for flip chip packaged integrated circuit die
- Patent number 12,243,840
- Issue date Mar 4, 2025
- Samtec, Inc.
- Edwin Loy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passives to facilitate mold compound flow
- Patent number 12,243,849
- Issue date Mar 4, 2025
- Texas Instruments Incorporated
- Chittranjan Mohan Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices, systems, and methods for stacked die packages
- Patent number 12,243,850
- Issue date Mar 4, 2025
- Flex Ltd.
- Cheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers and memory...
- Patent number 12,243,765
- Issue date Mar 4, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package
- Patent number 12,237,252
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Yoonyoung Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuits including micropatterns and using partial curing to adhere...
- Patent number 12,237,292
- Issue date Feb 25, 2025
- 3M Innovative Properties Company
- Teresa M. Goeddel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display substrate, tiled display panel and display device
- Patent number 12,237,316
- Issue date Feb 25, 2025
- BOE Technology Group Co., Ltd.
- Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy structure of stacked and bonded semiconductor device
- Patent number 12,237,291
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure
- Patent number 12,238,865
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with bridge chiplets
- Patent number 12,238,872
- Issue date Feb 25, 2025
- Advanced Micro Devices, Inc.
- Robert N. McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating the same
- Patent number 12,237,253
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Jun Hyeong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package having wirebonded multi-die stack
- Patent number 12,237,305
- Issue date Feb 25, 2025
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,237,239
- Issue date Feb 25, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Young Khim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 12,237,240
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Jinwoo Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF PACKAGING SEMICONDUCT...
- Publication number 20250096008
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED VOLTAGE REGULATOR (IVR) PACKAGE INCLUDING INDUCTOR AND C...
- Publication number 20250096211
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Sangnam JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF
- Publication number 20250096220
- Publication date Mar 20, 2025
- Yangtze Memory Technologies Co., Ltd.
- Peng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS
- Publication number 20250098325
- Publication date Mar 20, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250096218
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Haseob SEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250096049
- Publication date Mar 20, 2025
- Mitsubishi Electric Corporation
- Tatsuya UDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN ADHESIVE COMPOSITION FOR OPTICAL IRRADIATIO...
- Publication number 20250092293
- Publication date Mar 20, 2025
- NISSAN CHEMICAL CORPORATION
- Hiroshi OGINO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20250096107
- Publication date Mar 20, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250096153
- Publication date Mar 20, 2025
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250096179
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Wooyoung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING RESIN, AND ELECTRONIC DEVICE INCLUD...
- Publication number 20250096186
- Publication date Mar 20, 2025
- Samsung Electronics Co.,Ltd.
- Chagyu SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH CAVITY, AND AN INTEGRATED DEVIC...
- Publication number 20250096051
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Jaehyun YEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL DISSIPATION IN SEMICONDUCTOR DEVICES
- Publication number 20250096185
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE WITH STACKED STRUCTURE
- Publication number 20250096210
- Publication date Mar 20, 2025
- Monolithic Power Systems, Inc.
- Ting Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST PACKAGE WARPAGE SOLUTION
- Publication number 20250096009
- Publication date Mar 20, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED THERMAL HEALING AND DOPING OF GLASS CORES FOR MICROELECTR...
- Publication number 20250096052
- Publication date Mar 20, 2025
- Intel Corporation
- Mohamed R. Saber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIR-STEP CONFIGURATION FOR A SEMICONDUCTOR DIE OF AN INTEGRATED C...
- Publication number 20250096058
- Publication date Mar 20, 2025
- Western Digital Technologies, Inc.
- Huoliang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250096066
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING FILM, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUC...
- Publication number 20250096184
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Jihwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20250096203
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDE-COOLING POWER MODULE
- Publication number 20250096209
- Publication date Mar 20, 2025
- Monolithic Power Systems, Inc.
- Ting Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLUGS FOR INTERCONNECT LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCT...
- Publication number 20250098258
- Publication date Mar 20, 2025
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS
- Publication number 20250087543
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. Hsinchu
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH LATERALLY CONFINED SUBSTRATE AND METHODS...
- Publication number 20250087564
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250087571
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Yueh Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250087603
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Young Lyong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250087647
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID ENCAPSULATION RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
- Publication number 20250084232
- Publication date Mar 13, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- Taisuke YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURABLE COMPOSITION, CURED PRODUCT FORMED FROM THE SAME AND USE OF...
- Publication number 20250084274
- Publication date Mar 13, 2025
- Daxin Materials Corp.
- Yun-Ching WU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SYSTEMS AND METHODS FOR NON-OVERLAP ENFORCEMENT FOR INVERTER FOR EL...
- Publication number 20250089224
- Publication date Mar 13, 2025
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL

the item being non-metallic

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor packages with an intermetallic layer

Semiconductor light emitting device

Trench contact structures for advanced integrated circuit structure...

Electronic device with multi-layer contact and system

Semiconductor packages and methods of forming the same

Wire bond wires for interference shielding

Scalable architecture for reduced cycles across SOC

Semiconductor structure and manufacturing method thereof

Semiconductor device

Semiconductor structure and forming method thereof

Semiconductor package and method manufacturing the same

Display device and display unit

Package structure, RDL structure comprising redistribution layer ha...

Manufacturing method of integrated substrate structure

Semiconductor device, semiconductor system, moving body, and method...

Semiconductor package with EMI shield and fabricating method thereof

Wirebondable interposer for flip chip packaged integrated circuit die

Passives to facilitate mold compound flow

Devices, systems, and methods for stacked die packages

3D semiconductor device and structure with metal layers and memory...

Semiconductor package

Circuits including micropatterns and using partial curing to adhere...

Display substrate, tiled display panel and display device

Dummy structure of stacked and bonded semiconductor device

Integrated circuit structure

Circuit board with bridge chiplets

Semiconductor package and method for fabricating the same

Integrated circuit package having wirebonded multi-die stack

Semiconductor device and manufacturing method thereof

Semiconductor package and method of manufacturing semiconductor pac...

Patents Applicationslast 30 patents

PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF PACKAGING SEMICONDUCT...

INTEGRATED VOLTAGE REGULATOR (IVR) PACKAGE INCLUDING INDUCTOR AND C...

SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF

3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

METHOD FOR PRODUCING AN ADHESIVE COMPOSITION FOR OPTICAL IRRADIATIO...

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING RESIN, AND ELECTRONIC DEVICE INCLUD...

PACKAGE COMPRISING A SUBSTRATE WITH CAVITY, AND AN INTEGRATED DEVIC...

THERMAL DISSIPATION IN SEMICONDUCTOR DEVICES

POWER MODULE WITH STACKED STRUCTURE

LOW COST PACKAGE WARPAGE SOLUTION

LOCALIZED THERMAL HEALING AND DOPING OF GLASS CORES FOR MICROELECTR...

STAIR-STEP CONFIGURATION FOR A SEMICONDUCTOR DIE OF AN INTEGRATED C...

SEMICONDUCTOR PACKAGE

CHIP BONDING FILM, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUC...

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

DOUBLE-SIDE-COOLING POWER MODULE

PLUGS FOR INTERCONNECT LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCT...

INTEGRATED CIRCUIT PACKAGES AND METHODS

SEMICONDUCTOR PACKAGE WITH LATERALLY CONFINED SUBSTRATE AND METHODS...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

LIQUID ENCAPSULATION RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

CURABLE COMPOSITION, CURED PRODUCT FORMED FROM THE SAME AND USE OF...

SYSTEMS AND METHODS FOR NON-OVERLAP ENFORCEMENT FOR INVERTER FOR EL...