the item being non-metallic

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H01L2224/32155

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/32155the item being non-metallic

Industries

Patents Grantslast 30 patents

Information Patent Grant
Interposer directly bonded to bonding pads on a plurality of dies
- Patent number 12,165,952
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for integration of biological chips
- Patent number 12,128,377
- Issue date Oct 29, 2024
- MGI Tech Co., Ltd.
- Liang Wang
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Semiconductor device, endoscope, and method for manufacturing semic...
- Patent number 12,033,975
- Issue date Jul 9, 2024
- Olympus Corporation
- Keiichi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,015,006
- Issue date Jun 18, 2024
- Denso Corporation
- Shohei Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of chip package with protective lid
- Patent number 11,978,715
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Tsung Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semicondutor package substrate with die cavity and redistribution l...
- Patent number 11,854,922
- Issue date Dec 26, 2023
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming protective layer around...
- Patent number 11,804,416
- Issue date Oct 31, 2023
- UTAC HEADQUARTERS PTE. LTD.
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and power conversion device
- Patent number 11,699,666
- Issue date Jul 11, 2023
- Mitsubishi Electric Corporation
- Akira Kosugi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a chip carrier and a metal plate sized...
- Patent number 11,676,879
- Issue date Jun 13, 2023
- Infineon Technologies AG
- Stefan Woetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,610,873
- Issue date Mar 21, 2023
- Mitsubishi Electric Corporation
- Ryo Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control of under-fill using a film during fabrication for a dual-si...
- Patent number 11,244,835
- Issue date Feb 8, 2022
- Skyworks Solutions, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control of under-fill using a dam on a packaging substrate for a du...
- Patent number 11,201,066
- Issue date Dec 14, 2021
- Skyworks Solutions, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,177,190
- Issue date Nov 16, 2021
- Fuji Electric Co., Ltd.
- Makoto Isozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic packages with stacked sitffeners and methods of assembli...
- Patent number 10,964,677
- Issue date Mar 30, 2021
- Intel Corporation
- Jenny Shio Yin Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,916,533
- Issue date Feb 9, 2021
- Samsung Electronics Co., Ltd.
- Seunghyun Baik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interposer frame over se...
- Patent number RE48408
- Issue date Jan 26, 2021
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Reza A. Pagaila
Information Patent Grant
Chip packaging structure, chip module and electronic terminal
- Patent number 10,854,526
- Issue date Dec 1, 2020
- Shenzhen Goodix Technology Co., Ltd.
- Shengbin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded chip package, manufacturing method thereof, and package-on...
- Patent number 10,797,017
- Issue date Oct 6, 2020
- Unimicron Technology Corp.
- Po-Chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Under-fill deflash for a dual-sided ball grid array package
- Patent number 10,770,312
- Issue date Sep 8, 2020
- Skyworks Solutions, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with plated lead frame
- Patent number 10,748,787
- Issue date Aug 18, 2020
- Infineon Technologies AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interposer frame over se...
- Patent number RE48111
- Issue date Jul 21, 2020
- JCET Semiconductor (Shaoxing) Co. Ltd.
- Reza A. Pagaila
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 10,663,816
- Issue date May 26, 2020
- LG Display Co., Ltd.
- WonJun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control of under-fill with a packaging substrate having an integrat...
- Patent number 10,593,565
- Issue date Mar 17, 2020
- Skyworks Solutions, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,566,295
- Issue date Feb 18, 2020
- Toyota Jidosha Kabushiki Kaisha
- Akinori Sakakibara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control of under-fill using an encapsulant for a dual-sided ball gr...
- Patent number 10,460,957
- Issue date Oct 29, 2019
- Skyworks Solutions, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control of under-fill using under-fill deflash for a dual-sided bal...
- Patent number 10,410,885
- Issue date Sep 10, 2019
- Skyworks Solutions, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 10,310,341
- Issue date Jun 4, 2019
- LG Display Co., Ltd.
- WonJun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulated circuit board, power module and power unit
- Patent number 10,170,433
- Issue date Jan 1, 2019
- Mitsubishi Electric Corporation
- Shinnosuke Soda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with plated lead frame, and method for manufac...
- Patent number 9,847,235
- Issue date Dec 19, 2017
- Infineon Technologies AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging structure and manufacturing method thereof
- Patent number 9,640,475
- Issue date May 2, 2017
- MStar Semiconductor, Inc.
- You-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HYBRID MULTI-DIE QFP-QFN PACKAGE
- Publication number 20240297147
- Publication date Sep 5, 2024
- STMicroelectronics International N.V.
- Shei Meng LOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH PROTECTIVE LID
- Publication number 20240250055
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsung KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REFLECTORS FOR SUPPORT STRUCTURES IN LIGHT-EMITTING DIODE PACKAGES
- Publication number 20240120452
- Publication date Apr 11, 2024
- CreeLED, Inc.
- Derek Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240014163
- Publication date Jan 11, 2024
- Samsung Electronics Co., Ltd.
- Jong Youn KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND MANUFACTURING METHOD THEREFOR
- Publication number 20230307409
- Publication date Sep 28, 2023
- Sony Semiconductor Solutions Corporation
- SHOGO ONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230299247
- Publication date Sep 21, 2023
- SAMSUNG DISPLAY CO., LTD.
- Dong Hyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230282563
- Publication date Sep 7, 2023
- Fuji Electric Co., Ltd.
- Sota YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND MANUFACTURING METHOD OF THE SAME
- Publication number 20230260872
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-Dimensional Device Package with Vertical Heat Pipes
- Publication number 20230260871
- Publication date Aug 17, 2023
- Marvell Asia Pte Ltd.
- Janak G. Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE INCLUDING A WIRING PAD AND METHOD FOR MANUFACTURING...
- Publication number 20230207573
- Publication date Jun 29, 2023
- SAMSUNG DISPLAY CO., LTD.
- JI WOONG CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING ADHESIVE LAYER AND METHOD FOR MANUF...
- Publication number 20230072616
- Publication date Mar 9, 2023
- Samsung Electronics Co., Ltd.
- Yeohoon YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUTOR PACKAGE SUBSTRATE WITH DIE CAVITY AND REDISTRIBUTION L...
- Publication number 20220406673
- Publication date Dec 22, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220310549
- Publication date Sep 29, 2022
- DENSO CORPORATION
- Shohei NAGAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH PROTECTIVE LID
- Publication number 20220278069
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsung KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A CHIP CARRIER AND A METAL PLATE SIZED...
- Publication number 20220102235
- Publication date Mar 31, 2022
- INFINEON TECHNOLOGIES AG
- Stefan Woetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Protective Layer Around...
- Publication number 20220077019
- Publication date Mar 10, 2022
- UTAC Headquarters Pte. Ltd.
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR INTEGRATION OF BIOLOGICAL CHIPS
- Publication number 20220040662
- Publication date Feb 10, 2022
- Liang Wang
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE, ENDOSCOPE, AND METHOD FOR MANUFACTURING SEMIC...
- Publication number 20210288023
- Publication date Sep 16, 2021
- OLYMPUS CORPORATION
- Keiichi KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210249389
- Publication date Aug 12, 2021
- Mitsubishi Electric Corporation
- Ryo GOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE
- Publication number 20210118815
- Publication date Apr 22, 2021
- Mitsubishi Electric Corporation
- Akira KOSUGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200286807
- Publication date Sep 10, 2020
- Fuji Electric Co., Ltd.
- Makoto ISOZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200013767
- Publication date Jan 9, 2020
- Samsung Electronics Co., Ltd.
- SEUNGHYUN BAIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED CHIP PACKAGE, MANUFACTURING METHOD THEREOF, AND PACKAGE-ON...
- Publication number 20190295984
- Publication date Sep 26, 2019
- Unimicron Technology Corp.
- Po-Chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190164913
- Publication date May 30, 2019
- Toyota Jidosha Kabushiki Kaisha
- Akinori Sakakibara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING STRUCTURE, CHIP MODULE AND ELECTRONIC TERMINAL
- Publication number 20190027415
- Publication date Jan 24, 2019
- Shenzhen Goodix Technology Co., Ltd.
- Shengbin ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROL OF UNDER-FILL USING A FILM DURING FABRICATION FOR A DUAL-SI...
- Publication number 20180226271
- Publication date Aug 9, 2018
- SKYWORKS SOLUTIONS, INC.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Plated Lead Frame
- Publication number 20180061671
- Publication date Mar 1, 2018
- INFINEON TECHNOLOGIES AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATED CIRCUIT BOARD, POWER MODULE AND POWER UNIT
- Publication number 20170338189
- Publication date Nov 23, 2017
- MITSUBISHI ELECTRIC CORPORATION
- Shinnosuke SODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Display Device and Method of Manufacturing the Same
- Publication number 20160377905
- Publication date Dec 29, 2016
- LG Display Co., Ltd.
- WonJun CHOI
- G02 - OPTICS
Information Patent Application
On Package Floating Metal/Stiffener Grounding to Mitigate RFI and S...
- Publication number 20160268213
- Publication date Sep 15, 2016
- Intel Corporation
- Hongjin JIANG
- H01 - BASIC ELECTRIC ELEMENTS

the item being non-metallic

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Interposer directly bonded to bonding pads on a plurality of dies

System and method for integration of biological chips

Semiconductor device, endoscope, and method for manufacturing semic...

Semiconductor device and method of manufacturing the same

Structure and formation method of chip package with protective lid

Semicondutor package substrate with die cavity and redistribution l...

Semiconductor device and method of forming protective layer around...

Semiconductor device and power conversion device

Semiconductor package having a chip carrier and a metal plate sized...

Semiconductor device and method of manufacturing semiconductor device

Control of under-fill using a film during fabrication for a dual-si...

Control of under-fill using a dam on a packaging substrate for a du...

Semiconductor device

Electronic packages with stacked sitffeners and methods of assembli...

Semiconductor package

Semiconductor device and method of forming interposer frame over se...

Chip packaging structure, chip module and electronic terminal

Embedded chip package, manufacturing method thereof, and package-on...

Under-fill deflash for a dual-sided ball grid array package

Semiconductor device with plated lead frame

Semiconductor device and method of forming interposer frame over se...

Display device and method of manufacturing the same

Control of under-fill with a packaging substrate having an integrat...

Semiconductor device

Control of under-fill using an encapsulant for a dual-sided ball gr...

Control of under-fill using under-fill deflash for a dual-sided bal...

Display device and method of manufacturing the same

Insulated circuit board, power module and power unit

Semiconductor device with plated lead frame, and method for manufac...

Chip packaging structure and manufacturing method thereof

Patents Applicationslast 30 patents

HYBRID MULTI-DIE QFP-QFN PACKAGE

PACKAGE STRUCTURE WITH PROTECTIVE LID

REFLECTORS FOR SUPPORT STRUCTURES IN LIGHT-EMITTING DIODE PACKAGES

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR CHIP AND MANUFACTURING METHOD THEREFOR

DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGES AND MANUFACTURING METHOD OF THE SAME

Three-Dimensional Device Package with Vertical Heat Pipes

DISPLAY DEVICE INCLUDING A WIRING PAD AND METHOD FOR MANUFACTURING...

SEMICONDUCTOR PACKAGE INCLUDING ADHESIVE LAYER AND METHOD FOR MANUF...

SEMICONDUTOR PACKAGE SUBSTRATE WITH DIE CAVITY AND REDISTRIBUTION L...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH PROTECTIVE LID

SEMICONDUCTOR PACKAGE HAVING A CHIP CARRIER AND A METAL PLATE SIZED...

Semiconductor Device and Method of Forming Protective Layer Around...

SYSTEM AND METHOD FOR INTEGRATION OF BIOLOGICAL CHIPS

SEMICONDUCTOR DEVICE, ENDOSCOPE, AND METHOD FOR MANUFACTURING SEMIC...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

EMBEDDED CHIP PACKAGE, MANUFACTURING METHOD THEREOF, AND PACKAGE-ON...

SEMICONDUCTOR DEVICE

CHIP PACKAGING STRUCTURE, CHIP MODULE AND ELECTRONIC TERMINAL

CONTROL OF UNDER-FILL USING A FILM DURING FABRICATION FOR A DUAL-SI...

Semiconductor Device with Plated Lead Frame

INSULATED CIRCUIT BOARD, POWER MODULE AND POWER UNIT

Display Device and Method of Manufacturing the Same

On Package Floating Metal/Stiffener Grounding to Mitigate RFI and S...