the kinked part being in proximity to the bonding area on the semiconductor or solid-state body

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CPC
H01L2224/48096

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48096the kinked part being in proximity to the bonding area on the semiconductor or solid-state body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 12,159,857
- Issue date Dec 3, 2024
- Samsung Electronics Co., Ltd.
- Jungseok Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,776,936
- Issue date Oct 3, 2023
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices and methods of packaging semiconduct...
- Patent number 11,664,287
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Company
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an electrical connection between semico...
- Patent number 11,417,625
- Issue date Aug 16, 2022
- Murata Manufacturing Co., Ltd.
- Shizuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged transistor devices with input-output isolation and methods...
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- Issue date Aug 16, 2022
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- Frank Trang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
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- Issue date Jan 25, 2022
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing an ultra-high density space interconnect lead...
- Patent number 11,211,357
- Issue date Dec 28, 2021
- GUANGDONG UNIVERSITY OF TECHNOLOGY
- Yun Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bond wire support systems and methods
- Patent number 11,049,836
- Issue date Jun 29, 2021
- Texas Instruments Incorporated
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip on package structure and method
- Patent number 10,964,666
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices and methods of packaging semiconduct...
- Patent number 10,950,514
- Issue date Mar 16, 2021
- Taiwan Semiconductor Manufacturing Company
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
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- Issue date Mar 9, 2021
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- Yuya Hasegawa
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device having an electrical connection between semico...
- Patent number 10,804,238
- Issue date Oct 13, 2020
- Murata Manufacturing Co., Ltd.
- Shizuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged transistor devices with input-output isolation and methods...
- Patent number 10,770,415
- Issue date Sep 8, 2020
- Cree, Inc.
- Frank Trang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a filled conductive cavity
- Patent number 10,770,399
- Issue date Sep 8, 2020
- Infineon Technologies AG
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curable heat radiation composition
- Patent number 10,717,896
- Issue date Jul 21, 2020
- Showa Denko K.K.
- Yoichiro Sakaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged semiconductor devices and methods of packaging semiconduct...
- Patent number 10,629,508
- Issue date Apr 21, 2020
- Taiwan Semiconductor Manufacturing Company
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chips and semiconductor packages including the same
- Patent number 10,622,312
- Issue date Apr 14, 2020
- Samsung Electronics Co., Ltd.
- Myoung-soo Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board, method, and semiconductor package
- Patent number 10,553,452
- Issue date Feb 4, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Suk-Chang Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, electronic equipment, and method for manufact...
- Patent number 10,529,869
- Issue date Jan 7, 2020
- Canon Kabushiki Kaisha
- Taiki Shitamichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip on package structure and method
- Patent number 10,510,717
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package for assembling various dice in a single...
- Patent number 10,410,996
- Issue date Sep 10, 2019
- Dialog Semiconductor (UK) Limited
- Melvin Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package for assembling various dice in a single...
- Patent number 10,332,864
- Issue date Jun 25, 2019
- Dialog Semiconductor (UK) Limited
- Melvin Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices and methods of packaging semiconduct...
- Patent number 10,269,673
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,032,736
- Issue date Jul 24, 2018
- Renesas Electronics Corporation
- Yoshinao Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,997,499
- Issue date Jun 12, 2018
- Renesas Electronics Corporation
- Hiroshi Kuroda
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for making semiconductor device with lead frame made from to...
- Patent number 9,947,636
- Issue date Apr 17, 2018
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices and methods of packaging semiconduct...
- Patent number 9,911,675
- Issue date Mar 6, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,754,919
- Issue date Sep 5, 2017
- Renesas Electronics Corporation
- Hiroshi Kuroda
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Chip on package structure and method
- Patent number 9,704,826
- Issue date Jul 11, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waterfall wire bonding
- Patent number 9,704,797
- Issue date Jul 11, 2017
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Zhong Lu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER MODULE
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- Publication date Jul 4, 2024
- Mitsubishi Electric Corporation
- Kenta NAKAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE STITCH WIREBONDS
- Publication number 20240113065
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Xiaolin KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REVERSE EMBEDDED POWER STRUCTURE FOR GRAPHICAL PROCESSING UNIT CHIP...
- Publication number 20240096802
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- NVIDIA Corporation
- Shawn Xiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DEVICE AND METHOD OF MANUFACTURING OPTICAL DEVICE
- Publication number 20240038747
- Publication date Feb 1, 2024
- SEIKO NPC CORPORATION
- Takahiro NAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230402432
- Publication date Dec 14, 2023
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECORDING ELEMENT UNIT AND METHOD FOR MANUFACTURING RECORDING ELEME...
- Publication number 20230311498
- Publication date Oct 5, 2023
- Canon Kabushiki Kaisha
- NAOYA TSUKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230260952
- Publication date Aug 17, 2023
- Mitsubishi Electric Corporation
- Hideki YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS, METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEV...
- Publication number 20220208721
- Publication date Jun 30, 2022
- SHINKAWA LTD.
- Hiroaki YOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220108977
- Publication date Apr 7, 2022
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING AN ULTRA-HIGH DENSITY SPACE INTERCONNECT LEAD...
- Publication number 20210210461
- Publication date Jul 8, 2021
- Guangdong University of Technology
- Yun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Devices and Methods of Packaging Semiconduct...
- Publication number 20210202335
- Publication date Jul 1, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210134762
- Publication date May 6, 2021
- Rohm Co., Ltd.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING AN ELECTRICAL CONNECTION BETWEEN SEMICO...
- Publication number 20200411465
- Publication date Dec 31, 2020
- MURATA MANUFACTURING CO., LTD.
- Shizuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED TRANSISTOR DEVICES WITH INPUT-OUTPUT ISOLATION AND METHODS...
- Publication number 20200402933
- Publication date Dec 24, 2020
- Cree, Inc.
- Frank Trang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Semiconductor Package Having a Filled Conductive Cavity
- Publication number 20200258842
- Publication date Aug 13, 2020
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Devices and Methods of Packaging Semiconduct...
- Publication number 20200227331
- Publication date Jul 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED TRANSISTOR DEVICES WITH INPUT-OUTPUT ISOLATION AND METHODS...
- Publication number 20200176402
- Publication date Jun 4, 2020
- Cree, Inc.
- Frank Trang
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
- Publication number 20200091416
- Publication date Mar 19, 2020
- ROHM CO., LTD.
- Yuya Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND WIRE SUPPORT SYSTEMS AND METHODS
- Publication number 20190326247
- Publication date Oct 24, 2019
- TEXAS INSTRUMENTS INCORPORATED
- MATTHEW DAVID ROMIG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Devices and Methods of Packaging Semiconduct...
- Publication number 20190252280
- Publication date Aug 15, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip on Package Structure and Method
- Publication number 20180374822
- Publication date Dec 27, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT, ELECTRONIC EQUIPMENT, AND METHOD FOR MANUFACT...
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- Publication date Aug 30, 2018
- Canon Kabushiki Kaisha
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- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Packaged Semiconductor Devices and Methods of Packaging Semiconduct...
- Publication number 20180190559
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- Taiwan Semiconductor Manufacturing Company, Ltd.
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- H01 - BASIC ELECTRIC ELEMENTS
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Integrated Circuit Package For Assembling Various Dice In A Single...
- Publication number 20180158804
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- Publication date Nov 16, 2017
- Renesas Electronics Corporation
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip on Package Structure and Method
- Publication number 20170309596
- Publication date Oct 26, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURABLE HEAT RADIATION COMPOSITION
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Information Patent Application
WAFER CIRCUIT
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- Publication date Jan 26, 2017
- LEYARD OPTOELECTRONIC CO., LTD.
- Changjun LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20160351464
- Publication date Dec 1, 2016
- Kabushiki Kaisha Toshiba
- Hiroaki Kishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip on Package Structure and Method
- Publication number 20160293577
- Publication date Oct 6, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

the kinked part being in proximity to the bonding area on the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package

Semiconductor device

Packaged semiconductor devices and methods of packaging semiconduct...

Semiconductor device having an electrical connection between semico...

Packaged transistor devices with input-output isolation and methods...

Semiconductor device

Method for processing an ultra-high density space interconnect lead...

Bond wire support systems and methods

Chip on package structure and method

Packaged semiconductor devices and methods of packaging semiconduct...

Semiconductor device

Semiconductor device having an electrical connection between semico...

Packaged transistor devices with input-output isolation and methods...

Semiconductor package having a filled conductive cavity

Curable heat radiation composition

Packaged semiconductor devices and methods of packaging semiconduct...

Semiconductor chips and semiconductor packages including the same

Printed circuit board, method, and semiconductor package

Electronic component, electronic equipment, and method for manufact...

Chip on package structure and method

Integrated circuit package for assembling various dice in a single...

Integrated circuit package for assembling various dice in a single...

Packaged semiconductor devices and methods of packaging semiconduct...

Semiconductor device

Semiconductor device and method of manufacturing the same

Method for making semiconductor device with lead frame made from to...

Packaged semiconductor devices and methods of packaging semiconduct...

Semiconductor device and method of manufacturing the same

Chip on package structure and method

Waterfall wire bonding

Patents Applicationslast 30 patents

POWER MODULE

DOUBLE STITCH WIREBONDS

REVERSE EMBEDDED POWER STRUCTURE FOR GRAPHICAL PROCESSING UNIT CHIP...

OPTICAL DEVICE AND METHOD OF MANUFACTURING OPTICAL DEVICE

SEMICONDUCTOR DEVICE

RECORDING ELEMENT UNIT AND METHOD FOR MANUFACTURING RECORDING ELEME...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

WIRE BONDING APPARATUS, METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEV...

SEMICONDUCTOR DEVICE

METHOD FOR PROCESSING AN ULTRA-HIGH DENSITY SPACE INTERCONNECT LEAD...

Packaged Semiconductor Devices and Methods of Packaging Semiconduct...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE HAVING AN ELECTRICAL CONNECTION BETWEEN SEMICO...

PACKAGED TRANSISTOR DEVICES WITH INPUT-OUTPUT ISOLATION AND METHODS...

Semiconductor Package Having a Filled Conductive Cavity

Packaged Semiconductor Devices and Methods of Packaging Semiconduct...

PACKAGED TRANSISTOR DEVICES WITH INPUT-OUTPUT ISOLATION AND METHODS...

SEMICONDUCTOR DEVICE

BOND WIRE SUPPORT SYSTEMS AND METHODS

Packaged Semiconductor Devices and Methods of Packaging Semiconduct...

Chip on Package Structure and Method

ELECTRONIC COMPONENT, ELECTRONIC EQUIPMENT, AND METHOD FOR MANUFACT...

Packaged Semiconductor Devices and Methods of Packaging Semiconduct...

Integrated Circuit Package For Assembling Various Dice In A Single...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Chip on Package Structure and Method

CURABLE HEAT RADIATION COMPOSITION

WAFER CIRCUIT

SEMICONDUCTOR DEVICE PACKAGE

Chip on Package Structure and Method