the layer being a laminate, i.e. composed of sublayers

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/022the layer being a laminate, i.e. composed of sublayers

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Patents Grantslast 30 patents

Information Patent Grant
Method and system for forming material within a gap
- Patent number 12,341,003
- Issue date Jun 24, 2025
- ASM IP Holding B.V.
- Timothee Blanquart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film formation method and film formation apparatus
- Patent number 12,341,004
- Issue date Jun 24, 2025
- Tokyo Electron Limited
- Yumiko Kawano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for annealing a gate insulation layer on a wide band gap sem...
- Patent number 12,341,012
- Issue date Jun 24, 2025
- Infineon Technologies AG
- Thomas Aichinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light irradiation type heat treatment method and heat treatment app...
- Patent number 12,341,031
- Issue date Jun 24, 2025
- SCREEN Holdings Co., Ltd.
- Akitsugu Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom-up fill dielectric materials for semiconductor structure fab...
- Patent number 12,341,061
- Issue date Jun 24, 2025
- Intel Corporation
- Florian Gstrein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of SiCN thin films
- Patent number 12,341,005
- Issue date Jun 24, 2025
- ASM IP Holding B.V.
- Varun Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming method of semiconductor structure and semiconductor structure
- Patent number 12,341,073
- Issue date Jun 24, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Huiwen Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin isolation structures of semiconductor devices
- Patent number 12,342,604
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Cheng Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with fin structures
- Patent number 12,342,605
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kun-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anti-oxidation layer to prevent dielectric loss from planarization...
- Patent number 12,341,019
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Zhen Yu Guan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and forming method thereof
- Patent number 12,342,564
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsueh-Han Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress films for advanced semiconductor applications
- Patent number 12,341,002
- Issue date Jun 24, 2025
- Lam Research Corporation
- Reza Bayati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of selective oxidation on rapid thermal processing (RTP) ch...
- Patent number 12,341,032
- Issue date Jun 24, 2025
- Applied Materials, Inc.
- Chaitanya Anjaneyalu Prasad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices and semiconductor dev...
- Patent number 12,341,055
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jun-Nan Nian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Remote plasma ultraviolet enhanced deposition
- Patent number 12,334,317
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hai-Dang Trinh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for patterning a silicon oxide-silicon nitride-silicon oxid...
- Patent number 12,334,333
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yi-Ren Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 12,336,272
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,336,209
- Issue date Jun 17, 2025
- United Microelectronics Corp.
- Chung-Fu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inner spacers for gate-all-around semiconductor devices
- Patent number 12,336,214
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Yun Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate spacer and formation method thereof
- Patent number 12,336,249
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Rui Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,336,253
- Issue date Jun 17, 2025
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- Chun-Hsien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of optimizing film deposition process in semiconductor fabri...
- Patent number 12,334,335
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Rei-Lin Chu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sidewall passivation for plasma etching
- Patent number 12,334,354
- Issue date Jun 17, 2025
- Applied Materials, Inc.
- Zhonghua Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for fabricating staircase regions of a three...
- Patent number 12,334,399
- Issue date Jun 17, 2025
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- Xiongyu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Remote plasma based deposition of silicon carbide films using silic...
- Patent number 12,334,332
- Issue date Jun 17, 2025
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- Bhadri N. Varadarajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
RF impedance matching network
- Patent number 12,334,306
- Issue date Jun 17, 2025
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- Imran Ahmed Bhutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 12,334,336
- Issue date Jun 17, 2025
- Kokusai Electric Corporation
- Yoshitomo Hashimoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Fabrication of thin-film encapsulation layer for light-emitting device
- Patent number 12,334,402
- Issue date Jun 17, 2025
- Kateeva, Inc.
- Eliyahu Vronsky
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Power control for rf impedance matching network
- Patent number 12,334,307
- Issue date Jun 17, 2025
- ASM IP Holding B.V.
- Ronald Anthony Decker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 12,334,334
- Issue date Jun 17, 2025
- Kokusai Electric Corporation
- Yoshitomo Hashimoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM-BASED THIN FILM MODIFIER, THIN FILM MODIFICATION COMPOSITION...
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE
- Publication number 20250212495
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- IMEC vzw
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY FORMING COMPOSITION
- Publication number 20250206862
- Publication date Jun 26, 2025
- NISSAN CHEMICAL CORPORATION
- Kazuhiko KINOSHITA
- H01 - BASIC ELECTRIC ELEMENTS
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TEMPERATURE CONTROL MODULE FOR A FURNACE REACTOR AND METHOD OF CONT...
- Publication number 20250210343
- Publication date Jun 26, 2025
- ASM IP HOLDING B.V.
- Marina Mariano
- H01 - BASIC ELECTRIC ELEMENTS
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METHODS OF DEPOSITING SILICON-CONTAINING DIELECTRIC LAYERS FOR SEMI...
- Publication number 20250210347
- Publication date Jun 26, 2025
- Applied Materials, Inc.
- Zhijie Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER LINE STRUCTURE
- Publication number 20250210524
- Publication date Jun 26, 2025
- DAI NIPPON PRINTING CO., LTD.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING OF SEMICONDUCTOR ELEMENTS
- Publication number 20250210585
- Publication date Jun 26, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman FOUNTAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming a Semiconductor Structure
- Publication number 20250212494
- Publication date Jun 26, 2025
- IMEC vzw
- Serge Biesemans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH HELMET STRUCTURE BETWEEN TWO SEMICONDUCTO...
- Publication number 20250212505
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Cheng CHING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR...
- Publication number 20250210317
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- Kokusai Electric Corporation
- Yasutoshi TSUBOTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20250210346
- Publication date Jun 26, 2025
- Kokusai Electric Corporation
- Shingo NOHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE...
- Publication number 20250210344
- Publication date Jun 26, 2025
- TOKYO ELECTRON LIMITED
- Rio SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PR...
- Publication number 20250210345
- Publication date Jun 26, 2025
- Kokusai Electric Corporation
- Kimihiko NAKATANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Treating the Dielectric Films Under the Bottoms of Source/Drain Reg...
- Publication number 20250203969
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Hsiang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SOURCE/DRAIN CONTACT FORMED USING BOTTOM-...
- Publication number 20250203976
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Li WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Formation Of Gate All Around Device
- Publication number 20250203942
- Publication date Jun 19, 2025
- Applied Materials, Inc.
- Myungsun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRECURSOR FOR FORMING SILICON-CONTAINING THIN FILM WITH HIGH HARDNE...
- Publication number 20250201549
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- EGTM Co., Ltd.
- Sung Jun Ji
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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METHODS FOR MAKING EUV PATTERNABLE HARD MASKS
- Publication number 20250201553
- Publication date Jun 19, 2025
- LAM RESEARCH CORPORATION
- Chenghao Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-K DIELECTRIC PROTECTION DURING PLASMA DEPOSITION OF SILICON NIT...
- Publication number 20250197996
- Publication date Jun 19, 2025
- LAM RESEARCH CORPORATION
- Awnish Gupta
- H01 - BASIC ELECTRIC ELEMENTS
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METHODS OF DEPOSITING SILICON-CONTAINING DIELECTRIC LAYERS FOR SEMI...
- Publication number 20250201548
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- Applied Materials, Inc.
- Zhijie Chua
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METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20250201550
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- Kokusai Electric Corporation
- Kazuki NONOMURA
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ELECTROMAGNETIC WAVE ASSISTED AREA SELECTIVE DEPOSITION
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- Publication date Jun 19, 2025
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- Krystelle Lionti
- H01 - BASIC ELECTRIC ELEMENTS
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- Timothee Blanquart
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SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250204039
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- UNITED MICROELECTRONICS CORP.
- Chun-Ya Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250201624
- Publication date Jun 19, 2025
- NANYA TECHNOLOGY CORPORATION
- Ming-Yang HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR WET ATOMIC LAYER ETCHING OF TRANSITION METAL OXIDE DIEL...
- Publication number 20250201572
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- TOKYO ELECTRON LIMITED
- Kate Abel
- H01 - BASIC ELECTRIC ELEMENTS
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- Publication number 20250201551
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- Publication number 20250204051
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- BOE TECHNOLOGY GROUP CO., LTD.
- Ming WANG
- H01 - BASIC ELECTRIC ELEMENTS

the layer being a laminate, i.e. composed of sublayers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method and system for forming material within a gap

Film formation method and film formation apparatus

Method for annealing a gate insulation layer on a wide band gap sem...

Light irradiation type heat treatment method and heat treatment app...

Bottom-up fill dielectric materials for semiconductor structure fab...

Formation of SiCN thin films

Forming method of semiconductor structure and semiconductor structure

Fin isolation structures of semiconductor devices

Semiconductor device with fin structures

Anti-oxidation layer to prevent dielectric loss from planarization...

Semiconductor structure and forming method thereof

Low stress films for advanced semiconductor applications

Methods of selective oxidation on rapid thermal processing (RTP) ch...

Method of manufacturing semiconductor devices and semiconductor dev...

Remote plasma ultraviolet enhanced deposition

Methods for patterning a silicon oxide-silicon nitride-silicon oxid...

Semiconductor device structure and methods of forming the same

Semiconductor device and method for fabricating the same

Inner spacers for gate-all-around semiconductor devices

Gate spacer and formation method thereof

Semiconductor device and method for fabricating the same

Method of optimizing film deposition process in semiconductor fabri...

Sidewall passivation for plasma etching

Structures and methods for fabricating staircase regions of a three...

Remote plasma based deposition of silicon carbide films using silic...

RF impedance matching network

Method of manufacturing semiconductor device, substrate processing...

Fabrication of thin-film encapsulation layer for light-emitting device

Power control for rf impedance matching network

Method of manufacturing semiconductor device, substrate processing...

Patents Applicationslast 30 patents

REDUCING CAPACITANCE IN SEMICONDUCTOR DEVICES

VACUUM-BASED THIN FILM MODIFIER, THIN FILM MODIFICATION COMPOSITION...

METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE

CAVITY FORMING COMPOSITION

TEMPERATURE CONTROL MODULE FOR A FURNACE REACTOR AND METHOD OF CONT...

METHODS OF DEPOSITING SILICON-CONTAINING DIELECTRIC LAYERS FOR SEMI...

MULTI-LAYER LINE STRUCTURE

DIRECT BONDING OF SEMICONDUCTOR ELEMENTS

Method for Forming a Semiconductor Structure

SEMICONDUCTOR DEVICE WITH HELMET STRUCTURE BETWEEN TWO SEMICONDUCTO...

SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR...

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE...

PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PR...

Treating the Dielectric Films Under the Bottoms of Source/Drain Reg...

SEMICONDUCTOR DEVICE WITH SOURCE/DRAIN CONTACT FORMED USING BOTTOM-...

Formation Of Gate All Around Device

PRECURSOR FOR FORMING SILICON-CONTAINING THIN FILM WITH HIGH HARDNE...

METHODS FOR MAKING EUV PATTERNABLE HARD MASKS

LOW-K DIELECTRIC PROTECTION DURING PLASMA DEPOSITION OF SILICON NIT...

METHODS OF DEPOSITING SILICON-CONTAINING DIELECTRIC LAYERS FOR SEMI...

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

ELECTROMAGNETIC WAVE ASSISTED AREA SELECTIVE DEPOSITION

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, METHOD...

METHODS FOR DEPOSITING GAP FILLING FLUIDS AND RELATED SYSTEMS AND D...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHODS FOR WET ATOMIC LAYER ETCHING OF TRANSITION METAL OXIDE DIEL...

SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCT...

THIN FILM TRANSISTOR AND METHOD FOR MANUFACTURING THIN FILM TRANSISTOR