the layer being a laminate, i.e. composed of sublayers

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/022the layer being a laminate, i.e. composed of sublayers

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Patents Grantslast 30 patents

Information Patent Grant
Method of processing substrate, method of manufacturing semiconduct...
- Patent number 12,288,684
- Issue date Apr 29, 2025
- Kokusai Electric Corporation
- Katsuyoshi Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-temperature direct growth method of multilayer graphene, pellic...
- Patent number 12,287,568
- Issue date Apr 29, 2025
- Korea Electronics Technology Institute
- Hyeong Keun Kim
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Pulsed DC power for deposition of film
- Patent number 12,288,670
- Issue date Apr 29, 2025
- Applied Materials, Inc.
- Abhijeet Laxman Sangle
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 12,288,683
- Issue date Apr 29, 2025
- Kokusai Electric Corporation
- Yasunobu Koshi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gate-all-around integrated circuit structures having insulator fin...
- Patent number 12,288,813
- Issue date Apr 29, 2025
- Intel Corporation
- Aaron D. Lilak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitride-based semiconductor device and method for manufacturing the...
- Patent number 12,289,904
- Issue date Apr 29, 2025
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Yi-Lun Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing nitride semiconductor photoelectrode
- Patent number 12,286,718
- Issue date Apr 29, 2025
- Nippon Telegraph and Telephone Corporation
- Yuya Uzumaki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Nitride-based semiconductor device and method for manufacturing the...
- Patent number 12,289,903
- Issue date Apr 29, 2025
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Yi-Lun Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for carbon compound film deposition
- Patent number 12,288,672
- Issue date Apr 29, 2025
- Applied Materials, Inc.
- Qiwei Liang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Film deposition apparatus for fine pattern forming
- Patent number 12,288,671
- Issue date Apr 29, 2025
- Tokyo Electron Limited
- Kazuhide Hasebe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal complexes containing cyclopentadienyl ligands
- Patent number 12,286,449
- Issue date Apr 29, 2025
- Merck Patent GmbH
- Ming Fang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Modifying hydrophobicity of a wafer surface using an organosilicon...
- Patent number 12,288,685
- Issue date Apr 29, 2025
- Lam Research Corporation
- Jeremy D. Fields
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,288,814
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wan-Yi Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitride-based semiconductor device and method for manufacturing the...
- Patent number 12,289,902
- Issue date Apr 29, 2025
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Yi-Lun Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition method to form air gaps
- Patent number 12,283,520
- Issue date Apr 22, 2025
- ASM IP Holding B.V.
- Chiyu Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for depositing blocking layers on conductive surfaces
- Patent number 12,281,382
- Issue date Apr 22, 2025
- Applied Materials, Inc.
- Lakmal C. Kalutarage
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and/or system for coating a substrate
- Patent number 12,283,499
- Issue date Apr 22, 2025
- Service Support Specialties, Inc
- Gary Hillman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing metal gate
- Patent number 12,284,824
- Issue date Apr 22, 2025
- Shanghai Huali Integrated Circuit Corporation
- Yanxia Hao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method
- Patent number 12,283,479
- Issue date Apr 22, 2025
- ASM IP Holding B.V.
- JaeOk Ko
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 12,283,476
- Issue date Apr 22, 2025
- Kokusai Electric Corporation
- Hiroshi Ashihara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 12,283,481
- Issue date Apr 22, 2025
- United Microelectronics Corp.
- Yu Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench-gated heterostructure and double-heterostructure active devices
- Patent number 12,284,817
- Issue date Apr 22, 2025
- MaxPower Semiconductor Inc.
- Jun Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for compound semiconductor device
- Patent number 12,283,922
- Issue date Apr 22, 2025
- Fujitsu Limited
- Kozo Makiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing substrate for forming film containing silicon...
- Patent number 12,281,386
- Issue date Apr 22, 2025
- Kokusai Electric Corporation
- Kimihiko Nakatani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Processing method, method of manufacturing semiconductor device, pr...
- Patent number 12,283,478
- Issue date Apr 22, 2025
- Kokusai Electric Corporation
- Yoshitomo Hashimoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 12,279,431
- Issue date Apr 15, 2025
- Ramey M. Abdelrahaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with silicon nitride passivation film
- Patent number 12,278,102
- Issue date Apr 15, 2025
- Sumitomo Electric Industries, Ltd.
- Kazuhide Sumiyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Treatment liquid and substrate treatment method
- Patent number 12,275,921
- Issue date Apr 15, 2025
- FUJIFILM Corporation
- Tomonori Takahashi
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Method of processing substrate and method of manufacturing semicond...
- Patent number 12,278,103
- Issue date Apr 15, 2025
- Kokusai Electric Corporation
- Takayuki Waseda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Manufacturing method of semiconductor structure
- Patent number 12,278,114
- Issue date Apr 15, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Qiang Wan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE HAVING A METAL PAD AND A PROTECTIVE LAYER FOR...
- Publication number 20250140722
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION BY NANO PIPES
- Publication number 20250140644
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hsien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lithography Process and Material for Negative Tone Development
- Publication number 20250138428
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Chien-Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Dielectric Material Treated with Microw...
- Publication number 20250140553
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250142887
- Publication date May 1, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Kenichi OKAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION OF CARBON GAPFILL MATERIALS
- Publication number 20250137119
- Publication date May 1, 2025
- Applied Materials, Inc.
- Bhargav S. CITLA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250142926
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Zhen YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AREA SELECTIVE DEPOSITION OF HARDMASKS FOR VACUUM GAP FORMATION
- Publication number 20250140550
- Publication date May 1, 2025
- Noel Arellano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A MEMORY DEVICE IN A RECESSED FEATURE
- Publication number 20250140551
- Publication date May 1, 2025
- TOKYO ELECTRON LIMITED
- Dina H. Triyoso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20250129474
- Publication date Apr 24, 2025
- TOKYO ELECTRON LIMITED
- Ryota IFUKU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CARRIER WAFER DEBONDING PROCESS AND METHOD
- Publication number 20250132150
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Che Chi Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL OXIDE COMPOSITE AS ETCH STOP LAYER
- Publication number 20250132197
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Feng Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL OXIDE CONVERSION FOR MEOL AND BEOL APPLICATIONS
- Publication number 20250132146
- Publication date Apr 24, 2025
- Applied Materials, Inc.
- Mohammad Mahdi TAVAKOLI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM-FORMING METHOD AND FILM-FORMING SYSTEM
- Publication number 20250129479
- Publication date Apr 24, 2025
- TOKYO ELECTRON LIMITED
- Hitoshi KATO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ADDITIVE APPROACHES TO MODIFYING WAFER GEOMETRY
- Publication number 20250133786
- Publication date Apr 24, 2025
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION SYSTEM AND METHOD
- Publication number 20250132148
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Hsi WANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CAPACITOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250133755
- Publication date Apr 24, 2025
- United Microelectronics Corp.
- Shin-Hung LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUSES FOR TEMPERATURE INDEXED ALD
- Publication number 20250129473
- Publication date Apr 24, 2025
- ASM IP HOLDING B.V.
- Bert Jongbloed
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR TREATMENT OF HIGH-K MATERIALS TO REDUCE LEAKAGE CURRENT...
- Publication number 20250132147
- Publication date Apr 24, 2025
- Applied Materials, Inc.
- Jae Young PARK
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HYDROGEN BARRIERS AND RELATED STRUCTURES, SYSTEMS, AND METHODS
- Publication number 20250132149
- Publication date Apr 24, 2025
- ASM IP HOLDING B.V.
- Aditya Chauhan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
USE OF TIN THIN FILM FOR BONDING AND AS MASKING FILM
- Publication number 20250132158
- Publication date Apr 24, 2025
- University of South-Eastern Norway
- Avisek ROY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING SUBSTRATE
- Publication number 20250122611
- Publication date Apr 17, 2025
- TES CO., LTD.
- Sungwoo LEE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRECURSOR FOR FORMING YTTRIUM- OR SCANDIUM-CONTAINING THIN FILM, ME...
- Publication number 20250122619
- Publication date Apr 17, 2025
- SK TRI CHEM CO., LTD.
- Han Sol OH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250125144
- Publication date Apr 17, 2025
- NANYA TECHNOLOGY CORPORATION
- Yubon CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING CHAMBER DEPOSITION CONFINEMENT
- Publication number 20250125129
- Publication date Apr 17, 2025
- Applied Materials, Inc.
- Sarah Michelle Bobek
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING METHOD FOR FILLING ONE OR MORE GAPS ON A SURFA...
- Publication number 20250125142
- Publication date Apr 17, 2025
- ASM IP HOLDING B.V.
- SangHeon Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE CAPABLE OF CONTROLLING...
- Publication number 20250125143
- Publication date Apr 17, 2025
- Kokusai Electric Corporation
- Keigo NISHIDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS TO IMPROVE OXIDE SIDEWALL QUALITY
- Publication number 20250125145
- Publication date Apr 17, 2025
- Applied Materials, Inc.
- Tianyang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING MULTIPLE COPPER ELEMENTS AND METHOD OF BONDING MU...
- Publication number 20250125185
- Publication date Apr 17, 2025
- National Cheng Kung University
- Shih-kang LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE CAPABLE OF CONTROLLING...
- Publication number 20250118549
- Publication date Apr 10, 2025
- Kokusai Electric Corporation
- Keigo NISHIDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

the layer being a laminate, i.e. composed of sublayers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of processing substrate, method of manufacturing semiconduct...

Low-temperature direct growth method of multilayer graphene, pellic...

Pulsed DC power for deposition of film

Method of manufacturing semiconductor device, substrate processing...

Gate-all-around integrated circuit structures having insulator fin...

Nitride-based semiconductor device and method for manufacturing the...

Method for producing nitride semiconductor photoelectrode

Nitride-based semiconductor device and method for manufacturing the...

Methods and apparatus for carbon compound film deposition

Film deposition apparatus for fine pattern forming

Metal complexes containing cyclopentadienyl ligands

Modifying hydrophobicity of a wafer surface using an organosilicon...

Semiconductor device and method of manufacture

Nitride-based semiconductor device and method for manufacturing the...

Selective deposition method to form air gaps

Methods for depositing blocking layers on conductive surfaces

Method and/or system for coating a substrate

Method for manufacturing metal gate

Substrate processing method

Method of manufacturing semiconductor device, substrate processing...

Method for manufacturing semiconductor device

Trench-gated heterostructure and double-heterostructure active devices

Manufacturing method for compound semiconductor device

Method of processing substrate for forming film containing silicon...

Processing method, method of manufacturing semiconductor device, pr...

Integrated assemblies and methods of forming integrated assemblies

Semiconductor device with silicon nitride passivation film

Treatment liquid and substrate treatment method

Method of processing substrate and method of manufacturing semicond...

Manufacturing method of semiconductor structure

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE HAVING A METAL PAD AND A PROTECTIVE LAYER FOR...

HEAT DISSIPATION BY NANO PIPES

Lithography Process and Material for Negative Tone Development

Semiconductor Device Having Dielectric Material Treated with Microw...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

DEPOSITION OF CARBON GAPFILL MATERIALS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

AREA SELECTIVE DEPOSITION OF HARDMASKS FOR VACUUM GAP FORMATION

METHOD OF FORMING A MEMORY DEVICE IN A RECESSED FEATURE

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

CARRIER WAFER DEBONDING PROCESS AND METHOD

METAL OXIDE COMPOSITE AS ETCH STOP LAYER

METAL OXIDE CONVERSION FOR MEOL AND BEOL APPLICATIONS

FILM-FORMING METHOD AND FILM-FORMING SYSTEM

ADDITIVE APPROACHES TO MODIFYING WAFER GEOMETRY

DEPOSITION SYSTEM AND METHOD

CAPACITOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD AND APPARATUSES FOR TEMPERATURE INDEXED ALD

METHODS FOR TREATMENT OF HIGH-K MATERIALS TO REDUCE LEAKAGE CURRENT...

HYDROGEN BARRIERS AND RELATED STRUCTURES, SYSTEMS, AND METHODS

USE OF TIN THIN FILM FOR BONDING AND AS MASKING FILM

METHOD FOR PROCESSING SUBSTRATE

PRECURSOR FOR FORMING YTTRIUM- OR SCANDIUM-CONTAINING THIN FILM, ME...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PROCESSING CHAMBER DEPOSITION CONFINEMENT

SUBSTRATE PROCESSING METHOD FOR FILLING ONE OR MORE GAPS ON A SURFA...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE CAPABLE OF CONTROLLING...

METHODS TO IMPROVE OXIDE SIDEWALL QUALITY

METHOD OF BONDING MULTIPLE COPPER ELEMENTS AND METHOD OF BONDING MU...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE CAPABLE OF CONTROLLING...