the layer being a laminate, i.e. composed of sublayers

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/022the layer being a laminate, i.e. composed of sublayers

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Patents Grantslast 30 patents

Information Patent Grant
Multigate device structure with engineered cladding and method maki...
- Patent number 12,249,539
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,249,654
- Issue date Mar 11, 2025
- Japan Display Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 12,249,502
- Issue date Mar 11, 2025
- Kokusai Electric Corporation
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device including epitaxial region
- Patent number 12,249,505
- Issue date Mar 11, 2025
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Treatments to improve device performance
- Patent number 12,249,511
- Issue date Mar 11, 2025
- Applied Materials, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 12,249,503
- Issue date Mar 11, 2025
- Kokusai Electric Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and material deposition systems for forming semiconductor l...
- Patent number 12,249,506
- Issue date Mar 11, 2025
- SILANNA UV TECHNOLOGIES PTE LTD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus, method of manufacturing semiconduct...
- Patent number 12,249,485
- Issue date Mar 11, 2025
- Kokusai Electric Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing and reuse of semiconductor substrates
- Patent number 12,249,504
- Issue date Mar 11, 2025
- Infineon Technologies AG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with an interconnect structure in a...
- Patent number 12,249,542
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 12,249,607
- Issue date Mar 11, 2025
- United Microelectronics Corp.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for selective film formation in semiconductor...
- Patent number 12,243,753
- Issue date Mar 4, 2025
- Kokusai Electric Corporation
- Kimihiko Nakatani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Negative-capacitance and ferroelectric field-effect transistor (NCF...
- Patent number 12,243,932
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Te-Yang Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having nickel oxide film on gate electrode
- Patent number 12,243,927
- Issue date Mar 4, 2025
- Sumitomo Electric Device Innovations, Inc.
- Tomohiro Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal oxidation for gate all around nanosheet I/O device
- Patent number 12,243,941
- Issue date Mar 4, 2025
- Applied Materials, Inc.
- Myungsun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a substrate
- Patent number 12,243,742
- Issue date Mar 4, 2025
- ASM IP Holding B.V.
- SeungHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hard mask removal without damaging top epitaxial layer
- Patent number 12,243,770
- Issue date Mar 4, 2025
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for wafer bonding
- Patent number 12,234,145
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Wei Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Deposition method
- Patent number 12,237,167
- Issue date Feb 25, 2025
- Tokyo Electron Limited
- Ken Okoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for increasing germanium concentration of surfaces of a sil...
- Patent number 12,237,404
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Che-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device
- Patent number 12,237,214
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SiC semiconductor substrate, and, production method therefor and pr...
- Patent number 12,237,377
- Issue date Feb 25, 2025
- Kwansei Gakuin Educational Foundation
- Tadaaki Kaneko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organoaminosilane precursors and methods for depositing films compr...
- Patent number 12,230,496
- Issue date Feb 18, 2025
- VERSUM MATERIALS US, LLC
- Mark Leonard O'Neill
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Word line structure of three-dimensional memory device
- Patent number 12,232,320
- Issue date Feb 18, 2025
- Yangtze Memory Technologies Co., Ltd.
- Qiang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate supporting apparatus, substrate processing apparatus incl...
- Patent number 12,230,531
- Issue date Feb 18, 2025
- ASM IP Holding B.V.
- Seung Woo Choi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of post treating silicon nitride based dielectric films wit...
- Patent number 12,230,499
- Issue date Feb 18, 2025
- Applied Materials, Inc.
- Yong Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device including air gap
- Patent number 12,230,498
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Dain Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Self-aligned inner spacer on gate-all-around structure and methods...
- Patent number 12,230,692
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsungyu Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate-all-around integrated circuit structures having depopulated ch...
- Patent number 12,230,635
- Issue date Feb 18, 2025
- Intel Corporation
- Nicole Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming oxide-nitride-oxide stack of non-volatile memory...
- Patent number 12,232,324
- Issue date Feb 18, 2025
- Infineon Technologies LLC
- Michael Allen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
GAPFILL METHOD, SYSTEM AND APPARATUS
- Publication number 20250079160
- Publication date Mar 6, 2025
- ASM IP HOLDING B.V.
- Jereld Lee Winkler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS AND WARPAGE MODULATING STRUCTURE FOR MULTI-STACKED WAFER AND...
- Publication number 20250079336
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Hsin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR HIGH STRENGTH ASYMMETRIC DIELECTRIC IN H...
- Publication number 20250079357
- Publication date Mar 6, 2025
- Applied Materials, Inc.
- Tyler Sherwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND MATERIAL SYSTEM FOR HIGH STRENGTH SELECTIVE DIELECTRIC I...
- Publication number 20250079356
- Publication date Mar 6, 2025
- Applied Materials, Inc.
- Tyler Sherwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HAFNIUM-CONTAINING STRUCTURES AND RELATED METHODS AND SYSTEMS
- Publication number 20250079155
- Publication date Mar 6, 2025
- ASM IP HOLDING B.V.
- Fatemeh Davodi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE ARCHITECTURES WITH TENSILE AND COMPRESSIVE STRAINED SUBSTRATES
- Publication number 20250081561
- Publication date Mar 6, 2025
- SOITEC
- Bich-Yen Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF SWITCH DEVICE WITH A SIDEWALL SPACER HAVING A LOW DIELECTRIC CON...
- Publication number 20250081570
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE
- Publication number 20250079154
- Publication date Mar 6, 2025
- TES CO., LTD.
- Joonyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250079158
- Publication date Mar 6, 2025
- Sumitomo Electric Industries, Ltd.
- Takahide HIRASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION OF ORGANIC MATERIAL
- Publication number 20250079161
- Publication date Mar 6, 2025
- ASM IP HOLDING B.V.
- Adam Vianna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR WET ATOMIC LAYER ETCHING OF MOLYBDENUM
- Publication number 20250079180
- Publication date Mar 6, 2025
- TOKYO ELECTRON LIMITED
- Tulashi Dahal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20250081492
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Lin CHAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEVICE AND METHOD FOR HIGH PRESSURE ANNEAL
- Publication number 20250079162
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM OF DETERMINING LEAKAGE OF SEMICONDUCTOR MANUFACTURING TOOL A...
- Publication number 20250079200
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-YING PEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GALLIUM NITRIDE-BASED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTU...
- Publication number 20250079257
- Publication date Mar 6, 2025
- Japan Display Inc.
- Masanobu IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250081498
- Publication date Mar 6, 2025
- United Semiconductor (Xiamen) Co., Ltd.
- Jun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING A SEMICONDUCTOR DEVICE STRUCTURE AND RELATED SE...
- Publication number 20250081588
- Publication date Mar 6, 2025
- ASM IP HOLDING B.V.
- Chiyu Zhu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF IMPROVING PMOS TRANSISTOR PERFORMANCE
- Publication number 20250081593
- Publication date Mar 6, 2025
- APPLIED MATERIALS ,INC.
- Yongjing Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR GAS DELIVERY IN A PROCESSING CHAMBER
- Publication number 20250075369
- Publication date Mar 6, 2025
- Applied Materials, Inc.
- Ryan Sungbin HU
- C30 - CRYSTAL GROWTH
Information Patent Application
NITROGEN-BASED OXYGEN-FREE DIPOLES, RELATED DEVICES, RELATED SYSTEM...
- Publication number 20250079156
- Publication date Mar 6, 2025
- ASM IP HOLDING B.V.
- Giuseppe Alessio Verni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF IMPROVING METAL OXIDE DEPOSITION WITH NITROGEN OXIDE AND...
- Publication number 20250079157
- Publication date Mar 6, 2025
- Entegris, Inc.
- Rong Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR IMPROVED SILICON DEPOSITION
- Publication number 20250079159
- Publication date Mar 6, 2025
- ASM IP HOLDING, B.V.
- Dieter Pierreux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Opaque Thermal Layer for Silicon Carbide Substrates
- Publication number 20250079186
- Publication date Mar 6, 2025
- Yi ZHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAM PERFORMANCE IMPROVEMENT USING HYDROXYLATION FOR GAPFILL
- Publication number 20250066913
- Publication date Feb 27, 2025
- Applied Materials, Inc.
- Supriya Ghosh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MULTIPLE-CHAMBER REACTOR FOR SELECTIVE DEPOSITION OF SILICON NITRID...
- Publication number 20250066921
- Publication date Feb 27, 2025
- ASM IP HOLDING B.V.
- Ranjit Rohidas Borude
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELECTIVE DEPOSITION OF OXIDE MATERIAL AND A DEPOSITION ASSEMBLY
- Publication number 20250069883
- Publication date Feb 27, 2025
- ASM IP HOLDING B.V.
- Vincent Vandalon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR FORMING LOW-K DIELECTRIC MATERIALS WITH REDUCED DIELECT...
- Publication number 20250069884
- Publication date Feb 27, 2025
- Applied Materials, Inc.
- Rui Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHUCK ASSEMBLY, PLANARIZATION PROCESS, APPARATUS AND METHOD OF MANU...
- Publication number 20250069938
- Publication date Feb 27, 2025
- Canon Kabushiki Kaisha
- SETH J. BAMESBERGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20250072028
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-TE CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING AN INTERCONNECT STRUCTURE HAVING AN AIR GAP AND S...
- Publication number 20250070027
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS

the layer being a laminate, i.e. composed of sublayers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multigate device structure with engineered cladding and method maki...

Semiconductor device

Method of manufacturing semiconductor device, substrate processing...

Semiconductor device including epitaxial region

Treatments to improve device performance

Method of manufacturing semiconductor device, substrate processing...

Methods and material deposition systems for forming semiconductor l...

Substrate processing apparatus, method of manufacturing semiconduct...

Manufacturing and reuse of semiconductor substrates

Semiconductor device structure with an interconnect structure in a...

Semiconductor structure

Method and apparatus for selective film formation in semiconductor...

Negative-capacitance and ferroelectric field-effect transistor (NCF...

Semiconductor device having nickel oxide film on gate electrode

Conformal oxidation for gate all around nanosheet I/O device

Method for processing a substrate

Hard mask removal without damaging top epitaxial layer

Methods for wafer bonding

Deposition method

Methods for increasing germanium concentration of surfaces of a sil...

Method of forming a semiconductor device

SiC semiconductor substrate, and, production method therefor and pr...

Organoaminosilane precursors and methods for depositing films compr...

Word line structure of three-dimensional memory device

Substrate supporting apparatus, substrate processing apparatus incl...

Methods of post treating silicon nitride based dielectric films wit...

Method for manufacturing semiconductor device including air gap

Self-aligned inner spacer on gate-all-around structure and methods...

Gate-all-around integrated circuit structures having depopulated ch...

Method of forming oxide-nitride-oxide stack of non-volatile memory...

Patents Applicationslast 30 patents

GAPFILL METHOD, SYSTEM AND APPARATUS

STRESS AND WARPAGE MODULATING STRUCTURE FOR MULTI-STACKED WAFER AND...

METHODS AND STRUCTURES FOR HIGH STRENGTH ASYMMETRIC DIELECTRIC IN H...

METHOD AND MATERIAL SYSTEM FOR HIGH STRENGTH SELECTIVE DIELECTRIC I...

HAFNIUM-CONTAINING STRUCTURES AND RELATED METHODS AND SYSTEMS

DEVICE ARCHITECTURES WITH TENSILE AND COMPRESSIVE STRAINED SUBSTRATES

RF SWITCH DEVICE WITH A SIDEWALL SPACER HAVING A LOW DIELECTRIC CON...

METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

DEPOSITION OF ORGANIC MATERIAL

METHODS FOR WET ATOMIC LAYER ETCHING OF MOLYBDENUM

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

DEVICE AND METHOD FOR HIGH PRESSURE ANNEAL

SYSTEM OF DETERMINING LEAKAGE OF SEMICONDUCTOR MANUFACTURING TOOL A...

GALLIUM NITRIDE-BASED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTU...

SEMICONDUCTOR STRUCTURE

METHODS FOR FORMING A SEMICONDUCTOR DEVICE STRUCTURE AND RELATED SE...

METHODS OF IMPROVING PMOS TRANSISTOR PERFORMANCE

METHOD AND APPARATUS FOR GAS DELIVERY IN A PROCESSING CHAMBER

NITROGEN-BASED OXYGEN-FREE DIPOLES, RELATED DEVICES, RELATED SYSTEM...

METHODS OF IMPROVING METAL OXIDE DEPOSITION WITH NITROGEN OXIDE AND...

METHOD FOR IMPROVED SILICON DEPOSITION

Opaque Thermal Layer for Silicon Carbide Substrates

SEAM PERFORMANCE IMPROVEMENT USING HYDROXYLATION FOR GAPFILL

MULTIPLE-CHAMBER REACTOR FOR SELECTIVE DEPOSITION OF SILICON NITRID...

SELECTIVE DEPOSITION OF OXIDE MATERIAL AND A DEPOSITION ASSEMBLY

METHODS FOR FORMING LOW-K DIELECTRIC MATERIALS WITH REDUCED DIELECT...

CHUCK ASSEMBLY, PLANARIZATION PROCESS, APPARATUS AND METHOD OF MANU...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME

METHOD OF FORMING AN INTERCONNECT STRUCTURE HAVING AN AIR GAP AND S...