the layer being a laminate, i.e. composed of sublayers

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/022the layer being a laminate, i.e. composed of sublayers

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Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of semiconductor structure comprising a gap an...
- Patent number 12,368,074
- Issue date Jul 22, 2025
- CHANGXI MEMORY TECHNOLOGIES, INC.
- Ting Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor test sample and manufacturing method thereof
- Patent number 12,368,051
- Issue date Jul 22, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Rui Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for forming metal-insulator-metal capacitors
- Patent number 12,369,336
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Liang Chen
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Information Patent Grant
Nanosheet transistor
- Patent number 12,369,379
- Issue date Jul 22, 2025
- Adeia Semiconductor Solutions LLC
- Kangguo Cheng
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Substrate processing apparatus, processing method, and non-transito...
- Patent number 12,368,043
- Issue date Jul 22, 2025
- Kokusai Electric Corporation
- Akinori Tanaka
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Information Patent Grant
Method of processing substrate, method of manufacturing semiconduct...
- Patent number 12,365,987
- Issue date Jul 22, 2025
- Kokusai Electric Corporation
- Hiroaki Hiramatsu
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Information Patent Grant
Method of engraving a three-dimensional dielectric layer
- Patent number 12,369,340
- Issue date Jul 22, 2025
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Nicolas Posseme
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Precursors and processes for deposition of Si-containing films usin...
- Patent number 12,368,042
- Issue date Jul 22, 2025
- L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GE...
- Naoto Noda
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Information Patent Grant
Compound semiconductor device, amplifier, and method for manufactur...
- Patent number 12,369,345
- Issue date Jul 22, 2025
- Fujitsu Limited
- Shirou Ozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and methods of forming the same
- Patent number 12,368,076
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-An Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure with high aspect ratio
- Patent number 12,369,390
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Han-Pin Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming dielectric layers through deposition and anneal...
- Patent number 12,368,044
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
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Information Patent Grant
Method of manufacturing semiconductor device including passivation...
- Patent number 12,368,090
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitride semiconductor device and fabrication method therefor
- Patent number 12,369,346
- Issue date Jul 22, 2025
- Rohm Co., Ltd.
- Kenji Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film transistor including a compositionally- graded gate diele...
- Patent number 12,369,354
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Wu-Wei Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solvent annealing of an organic planarization layer
- Patent number 12,362,168
- Issue date Jul 15, 2025
- International Business Machines Corporation
- Jing Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating germanium/silicon on insulator in radio freq...
- Patent number 12,362,225
- Issue date Jul 15, 2025
- Indian Institute of Technology Bombay
- Udayan Ganguly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,362,224
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Cheng Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing composite layer circuit structure of elect...
- Patent number 12,362,252
- Issue date Jul 15, 2025
- INNOLUX CORPORATION
- Yu-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,362,280
- Issue date Jul 15, 2025
- Renesas Electronics Corporation
- Takeshi Kawamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for forming a layer comprising aluminum, titani...
- Patent number 12,362,171
- Issue date Jul 15, 2025
- ASM IP Holding B.V.
- Lifu Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Source/drain contacts and methods of forming same
- Patent number 12,363,946
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,363,961
- Issue date Jul 15, 2025
- Infineon Technologies AG
- Carsten Schaeffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal deposition of silicon carbide films using heterogeneous p...
- Patent number 12,359,311
- Issue date Jul 15, 2025
- Lam Research Corporation
- Matthew Scott Weimer
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Information Patent Grant
Formation of gate all around device
- Patent number 12,363,948
- Issue date Jul 15, 2025
- Applied Materials, Inc.
- Myungsun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition of oxides and nitrides
- Patent number 12,359,315
- Issue date Jul 15, 2025
- ASM IP Holding B.V.
- Henri Jussila
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Field effect transistor with negative capacitance dielectric struct...
- Patent number 12,363,978
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chansyun David Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film stress control for plasma enhanced chemical vapor deposition
- Patent number 12,362,149
- Issue date Jul 15, 2025
- Applied Materials, Inc.
- Chien-Teh Kao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 12,362,156
- Issue date Jul 15, 2025
- Tokyo Electron Limited
- Atsushi Kubo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatus for low temperature silicon nitride films
- Patent number 12,362,169
- Issue date Jul 15, 2025
- Applied Materials, Inc.
- Wenbo Yan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

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FILLING OPENINGS BY COMBINING NON-FLOWABLE AND FLOWABLE PROCESSES
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- H01 - BASIC ELECTRIC ELEMENTS
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INTEGRATED ASSEMBLIES AND METHODS OF FORMING INTEGRATED ASSEMBLIES
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- Lodestar Licensing Group LLC
- Ramey M. Abdelrahaman
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20250241045
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- UNITED MICROELECTRONICS CORP.
- Chang-Po Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
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DIRECT NITRATION FOR BACKSIDE POWER DELIVER NETWORK ISOLATION MODULE
- Publication number 20250239452
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- Applied Materials, Inc.
- Prasad BHOSALE
- H01 - BASIC ELECTRIC ELEMENTS
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METHODS OF OPERATING A SPATIAL DEPOSITION TOOL
- Publication number 20250239479
- Publication date Jul 24, 2025
- Applied Materials, Inc.
- Joseph AuBuchon
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SELF-ALIGNED SOURCE CONTACT FOR SIC SWITCH UTILIZING OXIDATION RATE...
- Publication number 20250241037
- Publication date Jul 24, 2025
- MaxPower Semiconductor, Inc.
- Jun Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SELF-ALIGNED VIAS
- Publication number 20250239487
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE INCLUDING SiOCN LAYER AND METHOD OF FORMING SAME
- Publication number 20250239444
- Publication date Jul 24, 2025
- ASM IP HOLDING B.V.
- YoungChol Byun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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METHOD AND APPARATUS FOR SELECTIVE DEPOSITION OF DIELECTRIC FILMS
- Publication number 20250239445
- Publication date Jul 24, 2025
- Applied Materials, Inc.
- Ning Li
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Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20250234594
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPLACEMENT CONTROL GATE METHODS AND APPARATUSES
- Publication number 20250234534
- Publication date Jul 17, 2025
- Micron Technology, Inc.
- Luan C. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FILLING A GAP
- Publication number 20250232974
- Publication date Jul 17, 2025
- ASM IP HOLDING B.V.
- Sungdae Woo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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DEPOSITION APPARATUS WITH DETECTION SYSTEM AND METHODS
- Publication number 20250232992
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Ming-Yao HSIAO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Gapfill Process Using Pulsed High-Frequency Radio-Frequency (HFRF)...
- Publication number 20250230541
- Publication date Jul 17, 2025
- Applied Materials, Inc.
- Rui Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF SELECTIVE ATOMIC LAYER DEPOSITION
- Publication number 20250230545
- Publication date Jul 17, 2025
- Applied Materials, Inc.
- Bhaskar Jyoti Bhuyan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20250232975
- Publication date Jul 17, 2025
- Kokusai Electric Corporation
- Kimihiko NAKATANI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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METHOD FOR MANUFACTURING MODIFIED SUBSTRATE AND METHOD FOR MANUFACT...
- Publication number 20250230539
- Publication date Jul 17, 2025
- FUJIFILM CORPORATION
- Akihiro Hakamata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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SEMICONDUCTOR DEVICE PROCESSING COMPOSITION, COMPOUND, METHOD FOR P...
- Publication number 20250230321
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- FUJIFILM CORPORATION
- Naoya Shimoju
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GAP-FILLING METHOD FOR A SEMICONDUCTOR DEVICE AND METHOD OF MANUFAC...
- Publication number 20250233017
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- WONIK IPS CO., LTD.
- Chang Gyu SONG
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SEAM PERFORMANCE IMPROVEMENT FOR LARGE AREA GAPFILL
- Publication number 20250230540
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- Applied Materials, Inc.
- Supriya Ghosh
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METHOD OF CONTROLLING ATMOSPHERE, METHOD OF PROCESSING SUBSTRATE, M...
- Publication number 20250230548
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- Kokusai Electric Corporation
- Kaoru YAMAMOTO
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GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING INSULATOR FIN...
- Publication number 20250227959
- Publication date Jul 10, 2025
- Intel Corporation
- Aaron D. LILAK
- H01 - BASIC ELECTRIC ELEMENTS
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METHOD FOR SELECTIVE DEPOSITION ON DIELECTRIC MATERIALS
- Publication number 20250226205
- Publication date Jul 10, 2025
- Entegris, Inc.
- SungHae Lee
- H01 - BASIC ELECTRIC ELEMENTS
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METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20250226206
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- Daigo YAMAGUCHI
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- Publication number 20250226208
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- TOKYO ELECTRON LIMITED
- Shan Hu
- H01 - BASIC ELECTRIC ELEMENTS
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Fabrication and processing of graphene electronic devices on Silico...
- Publication number 20250226212
- Publication date Jul 10, 2025
- Archer Materials Limited
- Alexander James PORKOVICH
- H01 - BASIC ELECTRIC ELEMENTS
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FILM DEPOSITION APPARATUS FOR FINE PATTERN FORMING
- Publication number 20250226177
- Publication date Jul 10, 2025
- TOKYO ELECTRON LIMITED
- Kazuhide HASEBE
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
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- Madhu Santosh Kumar Mutyala
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- Publication number 20250226204
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the layer being a laminate, i.e. composed of sublayers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Manufacturing method of semiconductor structure comprising a gap an...

Semiconductor test sample and manufacturing method thereof

Method and system for forming metal-insulator-metal capacitors

Nanosheet transistor

Substrate processing apparatus, processing method, and non-transito...

Method of processing substrate, method of manufacturing semiconduct...

Method of engraving a three-dimensional dielectric layer

Precursors and processes for deposition of Si-containing films usin...

Compound semiconductor device, amplifier, and method for manufactur...

Interconnect structure and methods of forming the same

Method for forming semiconductor structure with high aspect ratio

Methods of forming dielectric layers through deposition and anneal...

Method of manufacturing semiconductor device including passivation...

Nitride semiconductor device and fabrication method therefor

Thin film transistor including a compositionally- graded gate diele...

Solvent annealing of an organic planarization layer

Method for fabricating germanium/silicon on insulator in radio freq...

Semiconductor device and manufacturing method thereof

Method for manufacturing composite layer circuit structure of elect...

Semiconductor device and method of manufacturing the same

Methods and systems for forming a layer comprising aluminum, titani...

Source/drain contacts and methods of forming same

Semiconductor device

Conformal deposition of silicon carbide films using heterogeneous p...

Formation of gate all around device

Deposition of oxides and nitrides

Field effect transistor with negative capacitance dielectric struct...

Film stress control for plasma enhanced chemical vapor deposition

Substrate processing method and substrate processing apparatus

Methods and apparatus for low temperature silicon nitride films

Patents Applicationslast 30 patents

FILLING OPENINGS BY COMBINING NON-FLOWABLE AND FLOWABLE PROCESSES

INTEGRATED ASSEMBLIES AND METHODS OF FORMING INTEGRATED ASSEMBLIES

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

DIRECT NITRATION FOR BACKSIDE POWER DELIVER NETWORK ISOLATION MODULE

METHODS OF OPERATING A SPATIAL DEPOSITION TOOL

SELF-ALIGNED SOURCE CONTACT FOR SIC SWITCH UTILIZING OXIDATION RATE...

SEMICONDUCTOR DEVICE WITH SELF-ALIGNED VIAS

STRUCTURE INCLUDING SiOCN LAYER AND METHOD OF FORMING SAME

METHOD AND APPARATUS FOR SELECTIVE DEPOSITION OF DIELECTRIC FILMS

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

REPLACEMENT CONTROL GATE METHODS AND APPARATUSES

METHOD OF FILLING A GAP

DEPOSITION APPARATUS WITH DETECTION SYSTEM AND METHODS

Gapfill Process Using Pulsed High-Frequency Radio-Frequency (HFRF)...

METHODS OF SELECTIVE ATOMIC LAYER DEPOSITION

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

METHOD FOR MANUFACTURING MODIFIED SUBSTRATE AND METHOD FOR MANUFACT...

SEMICONDUCTOR DEVICE PROCESSING COMPOSITION, COMPOUND, METHOD FOR P...

GAP-FILLING METHOD FOR A SEMICONDUCTOR DEVICE AND METHOD OF MANUFAC...

SEAM PERFORMANCE IMPROVEMENT FOR LARGE AREA GAPFILL

METHOD OF CONTROLLING ATMOSPHERE, METHOD OF PROCESSING SUBSTRATE, M...

GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING INSULATOR FIN...

METHOD FOR SELECTIVE DEPOSITION ON DIELECTRIC MATERIALS

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

METHODS FOR PROTECTING A PERIPHERAL EDGE AND BACKSIDE OF A SEMICOND...

Fabrication and processing of graphene electronic devices on Silico...

FILM DEPOSITION APPARATUS FOR FINE PATTERN FORMING

ENHANCED DEUTERIUM MIGRATION

PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PR...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...