the layer being a laminate, i.e. composed of sublayers

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/022the layer being a laminate, i.e. composed of sublayers

Industries

Patents Grantslast 30 patents

Information Patent Grant
Dynamic precursor dosing for atomic layer deposition
- Patent number 11,970,772
- Issue date Apr 30, 2024
- Lam Research Corporation
- Purushottam Kumar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Area selective carbon-based film deposition
- Patent number 11,972,940
- Issue date Apr 30, 2024
- Applied Materials, Inc.
- Xinke Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 11,972,945
- Issue date Apr 30, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Kenichi Okazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate oxide fabrication and system
- Patent number 11,972,942
- Issue date Apr 30, 2024
- Texas Instruments Incorporated
- Mona M. Eissa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vaporizer, substrate processing apparatus and method for manufactur...
- Patent number 11,970,771
- Issue date Apr 30, 2024
- Kokusai Electric Corporation
- Atsushi Morikawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatus for depositing dielectric material
- Patent number 11,972,943
- Issue date Apr 30, 2024
- Applied Materials, Inc.
- Bhargav S. Citla
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for depositing a gap-fill layer by plasma-assisted deposition
- Patent number 11,972,944
- Issue date Apr 30, 2024
- ASM IP Holding B.V.
- Timothee Julien Vincent Blanquart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Film forming method and film forming apparatus
- Patent number 11,970,768
- Issue date Apr 30, 2024
- Tokyo Electron Limited
- Hideomi Hane
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device
- Patent number 11,973,117
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer deposition of metal films
- Patent number 11,970,776
- Issue date Apr 30, 2024
- Lam Research Corporation
- Joshua Collins
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Precursor solution for thin film deposition and thin film forming m...
- Patent number 11,972,941
- Issue date Apr 30, 2024
- SK TRICHEM
- Chang Sung Hong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Adhesion layers for EUV lithography
- Patent number 11,972,948
- Issue date Apr 30, 2024
- Brewer Science, Inc.
- Andrea M. Chacko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming asymmetric differential spacers for optimized MOS...
- Patent number 11,973,130
- Issue date Apr 30, 2024
- X-FAB France SAS
- Sébastien Daveau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sequential infiltration synthesis apparatus
- Patent number 11,970,766
- Issue date Apr 30, 2024
- ASM IP Holding B.V.
- Ivo Johannes Raaijmakers
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and manufacturing method of a semiconductor de...
- Patent number 11,974,435
- Issue date Apr 30, 2024
- SK hynix Inc.
- In Su Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor film composition, method for manufacturing semiconduc...
- Patent number 11,965,109
- Issue date Apr 23, 2024
- Mitsui Chemicals, Inc.
- Yasuhisa Kayaba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of depositing thin film and method of manufacturing semicond...
- Patent number 11,967,503
- Issue date Apr 23, 2024
- Wonik IPS Co., Ltd.
- Su In Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-assembled monolayer for selective deposition
- Patent number 11,967,523
- Issue date Apr 23, 2024
- Applied Materials, Inc.
- Xiangjin Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleaning method, method of manufacturing semiconductor device, and...
- Patent number 11,965,240
- Issue date Apr 23, 2024
- Kokusai Electric Corporation
- Keigo Nishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitride semiconductor substrate, laminate, substrate selection prog...
- Patent number 11,967,617
- Issue date Apr 23, 2024
- Sumitomo Chemical Company, Limited
- Fumimasa Horikiri
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Systems and methods for depositing low-k dielectric films
- Patent number 11,967,498
- Issue date Apr 23, 2024
- Applied Materials, Inc.
- Bo Xie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma generating device, substrate processing apparatus, and metho...
- Patent number 11,967,490
- Issue date Apr 23, 2024
- Kokusai Electric Corporation
- Akihiro Sato
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gate structures in transistor devices and methods of forming same
- Patent number 11,967,504
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Yi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method, substrate processing apparatus using t...
- Patent number 11,965,244
- Issue date Apr 23, 2024
- Wonik IPS Co., Ltd.
- Kyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 11,967,500
- Issue date Apr 23, 2024
- Kokusai Electric Corporation
- Arito Ogawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of forming material layer, semiconductor devices, and metho...
- Patent number 11,967,502
- Issue date Apr 23, 2024
- Samsung Electronics Co., Ltd.
- Younsoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fill structures with air gaps
- Patent number 11,961,884
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Yung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for controlling stress variation in a material...
- Patent number 11,961,722
- Issue date Apr 16, 2024
- SPTS Technologies Limited
- Anthony Wilby
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Cyclic plasma processing
- Patent number 11,961,735
- Issue date Apr 16, 2024
- Tokyo Electron Limited
- Yun Han
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
RF devices with nanotube particles for enhanced performance and met...
- Patent number 11,961,781
- Issue date Apr 16, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE HAVING CONTACT PLUG
- Publication number 20240145384
- Publication date May 2, 2024
- Micron Technology, Inc.
- Akira Kaneko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fin Field-Effect Transistor Device Having Contact Plugs with Re-Ent...
- Publication number 20240145597
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BENZYL COMPOUND PASSIVATION FOR SELECTIVE DEPOSITION AND SELECTIVE...
- Publication number 20240145232
- Publication date May 2, 2024
- Applied Materials, Inc.
- Feng Q. Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SIN GAP FILL VIA NUCLEATION INHIBITION
- Publication number 20240145235
- Publication date May 2, 2024
- Applied Materials, Inc.
- Zeqing SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CLEANING USING PLASMA-FREE PRECURSORS
- Publication number 20240145230
- Publication date May 2, 2024
- Applied Materials, Inc.
- Abhishek Mandal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PR...
- Publication number 20240145233
- Publication date May 2, 2024
- Kokusai Electric Corporation
- Daigo YAMAGUCHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
OXIDATION ENHANCED DOPING
- Publication number 20240145246
- Publication date May 2, 2024
- Applied Materials, Inc.
- Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE THIN FILM FORMATION METHOD AND METHOD OF MANUFACTURING SE...
- Publication number 20240145303
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Sunhye HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL DEPOSITION OF SILICON CARBIDE FILMS
- Publication number 20240145234
- Publication date May 2, 2024
- Novellus Systems, Inc.
- Bhadri N. Varadarajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF APPLYING A DIELECTRIC COATING ON A COMPONENT OF AN ELECTR...
- Publication number 20240145237
- Publication date May 2, 2024
- Quantinuum LLC
- Christopher Todd Ertsgaard
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DOPING FREE CONNECTION STRUCTURES AND METHODS
- Publication number 20240145298
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20240145236
- Publication date May 2, 2024
- ASM IP HOLDING B.V.
- Hyunchul Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
GAS INJECTOR ASSEMBLY
- Publication number 20240145262
- Publication date May 2, 2024
- ASM IP HOLDING B.V.
- Theodorus G.M. Oosterlaken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRYSTALLOGRAPHIC- AND OXYNITRIDE-BASED SURFACE
- Publication number 20240141519
- Publication date May 2, 2024
- The Regents of the University of Michigan
- Francesca Maria Toma
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
INSERTING INHIBITION LAYER FOR INDUCING ANTIFERROELECTRICITY TO FER...
- Publication number 20240145571
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUXILIARY PRECURSOR, THIN-FILM PRECURSOR COMPOSITION, METHOD OF FOR...
- Publication number 20240136175
- Publication date Apr 25, 2024
- SOULBRAIN CO., LTD.
- Jae Sun JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier-Free Approach for Forming Contact Plugs
- Publication number 20240136227
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Different Isolation Liners for Different Type FinFETs and Associate...
- Publication number 20240136222
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Tzung-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESONANT ANTENNA FOR PHYSICAL VAPOR DEPOSITION APPLICATIONS
- Publication number 20240136151
- Publication date Apr 25, 2024
- TOKYO ELECTRON LIMITED
- Barton LANE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INNER SPACERS FOR GATE-ALL-AROUND SEMICONDUCTOR DEVICES
- Publication number 20240136438
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Yun Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240136442
- Publication date Apr 25, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Kenichi OKAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WORDLINES WITH REDUCED BLOCKING LAY...
- Publication number 20240138147
- Publication date Apr 25, 2024
- Applied Materials, Inc.
- Jaesoo Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN FIELD-EFFECT TRANSISTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240136191
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Hsiu Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-STRESS PASSIVATION LAYER
- Publication number 20240136291
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Ku SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A FERROELECTRIC DEVICE
- Publication number 20240128308
- Publication date Apr 18, 2024
- TOKYO ELECTRON LIMITED
- Dina Triyoso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240128351
- Publication date Apr 18, 2024
- Mitsubishi Electric Corporation
- Hiroyuki OKAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...
- Publication number 20240128152
- Publication date Apr 18, 2024
- Intel Corporation
- Elizabeth NOFEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND TOOL FOR FILM DEPOSITION
- Publication number 20240128078
- Publication date Apr 18, 2024
- NANYA TECHNOLOGY CORPORATION
- JI-FENG LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING RAW MATERIAL SOLUTION, METHOD OF FILM-FORMING A...
- Publication number 20240124974
- Publication date Apr 18, 2024
- Shin-Etsu Chemical Co., Ltd.
- Takenori WATABE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Particle Reduction in Physical Vapor Deposition of Amorphous Silicon
- Publication number 20240128075
- Publication date Apr 18, 2024
- Peijiao FANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

the layer being a laminate, i.e. composed of sublayers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Dynamic precursor dosing for atomic layer deposition

Area selective carbon-based film deposition

Method for manufacturing semiconductor device

Gate oxide fabrication and system

Vaporizer, substrate processing apparatus and method for manufactur...

Methods and apparatus for depositing dielectric material

Method for depositing a gap-fill layer by plasma-assisted deposition

Film forming method and film forming apparatus

Semiconductor device

Atomic layer deposition of metal films

Precursor solution for thin film deposition and thin film forming m...

Adhesion layers for EUV lithography

Method of forming asymmetric differential spacers for optimized MOS...

Sequential infiltration synthesis apparatus

Semiconductor device and manufacturing method of a semiconductor de...

Semiconductor film composition, method for manufacturing semiconduc...

Method of depositing thin film and method of manufacturing semicond...

Self-assembled monolayer for selective deposition

Cleaning method, method of manufacturing semiconductor device, and...

Nitride semiconductor substrate, laminate, substrate selection prog...

Systems and methods for depositing low-k dielectric films

Plasma generating device, substrate processing apparatus, and metho...

Gate structures in transistor devices and methods of forming same

Substrate processing method, substrate processing apparatus using t...

Method of manufacturing semiconductor device, substrate processing...

Methods of forming material layer, semiconductor devices, and metho...

Fill structures with air gaps

Method and apparatus for controlling stress variation in a material...

Cyclic plasma processing

RF devices with nanotube particles for enhanced performance and met...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE HAVING CONTACT PLUG

Fin Field-Effect Transistor Device Having Contact Plugs with Re-Ent...

BENZYL COMPOUND PASSIVATION FOR SELECTIVE DEPOSITION AND SELECTIVE...

SIN GAP FILL VIA NUCLEATION INHIBITION

SEMICONDUCTOR CLEANING USING PLASMA-FREE PRECURSORS

PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PR...

OXIDATION ENHANCED DOPING

SELECTIVE THIN FILM FORMATION METHOD AND METHOD OF MANUFACTURING SE...

CONFORMAL DEPOSITION OF SILICON CARBIDE FILMS

METHOD OF APPLYING A DIELECTRIC COATING ON A COMPONENT OF AN ELECTR...

DOPING FREE CONNECTION STRUCTURES AND METHODS

SUBSTRATE PROCESSING METHOD

GAS INJECTOR ASSEMBLY

CRYSTALLOGRAPHIC- AND OXYNITRIDE-BASED SURFACE

INSERTING INHIBITION LAYER FOR INDUCING ANTIFERROELECTRICITY TO FER...

AUXILIARY PRECURSOR, THIN-FILM PRECURSOR COMPOSITION, METHOD OF FOR...

Barrier-Free Approach for Forming Contact Plugs

Different Isolation Liners for Different Type FinFETs and Associate...

RESONANT ANTENNA FOR PHYSICAL VAPOR DEPOSITION APPLICATIONS

INNER SPACERS FOR GATE-ALL-AROUND SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

THREE-DIMENSIONAL MEMORY DEVICE WORDLINES WITH REDUCED BLOCKING LAY...

FIN FIELD-EFFECT TRANSISTOR DEVICE AND METHOD OF FORMING THE SAME

LOW-STRESS PASSIVATION LAYER

METHOD FOR FABRICATING A FERROELECTRIC DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...

METHOD AND TOOL FOR FILM DEPOSITION

METHOD OF PRODUCING RAW MATERIAL SOLUTION, METHOD OF FILM-FORMING A...

Particle Reduction in Physical Vapor Deposition of Amorphous Silicon