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the layer being characterised by the precursor material for deposition
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Methods and systems for forming a layer comprising aluminum, titani...
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12,362,171
Issue date
Jul 15, 2025
ASM IP Holding B.V.
Lifu Chen
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Deposition of oxides and nitrides
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12,359,315
Issue date
Jul 15, 2025
ASM IP Holding B.V.
Henri Jussila
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Scandium precursor for SC2O3 or SC2S3 atomic layer deposition
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12,344,627
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Jul 1, 2025
Intel Corporation
Patricio E. Romero
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Sidewall passivation for plasma etching
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12,334,354
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Jun 17, 2025
Applied Materials, Inc.
Zhonghua Yao
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Method of manufacturing semiconductor device, substrate processing...
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12,334,334
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Jun 17, 2025
Kokusai Electric Corporation
Yoshitomo Hashimoto
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Methods and apparatus for selective etch stop capping and selective...
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12,334,394
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Jun 17, 2025
Applied Materials, Inc.
Suketu Parikh
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Method of processing substrate, method of manufacturing semiconduct...
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12,331,393
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Jun 17, 2025
Kokusai Electric Corporation
Kimihiko Nakatani
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Methods to reduce UNCD film roughness
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12,327,733
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Jun 10, 2025
Applied Materials, Inc.
Vicknesh Sahmuganathan
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Semiconductor devices and methods
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12,322,647
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Jun 3, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Yu-Kai Lin
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Semiconductor structure having high breakdown voltage etch-stop layer
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12,315,812
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May 27, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Joung-Wei Liou
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Deposition of semiconductor integration films
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12,300,491
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May 13, 2025
Applied Materials, Inc.
Lakmal Charidu Kalutarage
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Methods for stabilization of self-assembled monolayers (SAMs) using...
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12,290,835
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May 6, 2025
Tokyo Electron Limited
Omid Zandi
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Tunability of dopant concentration in thin hafnium oxide films
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12,261,037
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Mar 25, 2025
Applied Materials, Inc.
Golnaz Karbasian
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Treatments to improve device performance
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12,249,511
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Mar 11, 2025
Applied Materials, Inc.
Steven C. H. Hung
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Methods for depositing gap filling fluid
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12,211,742
Issue date
Jan 28, 2025
ASM IP Holding B.V.
Timothee Blanquart
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Flowable chemical vapor deposition of metal oxides
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12,211,736
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Jan 28, 2025
Applied Materials, Inc.
Hurshvardhan Srivastava
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Deposition of organic films
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12,205,820
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Jan 21, 2025
ASM IP Holding B.V.
Eva E. Tois
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Carbon gap fill processes
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12,198,928
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Jan 14, 2025
Applied Materials, Inc.
Abhijeet S. Bagal
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Dual RF for controllable film deposition
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12,191,115
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Jan 7, 2025
Applied Materials, Inc.
Venkata Sharat Chandra Parimi
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Method for manufacturing semiconductor device, and film-forming device
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12,173,401
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Dec 24, 2024
Tokyo Electron Limited
Zeyuan Ni
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Method of manufacturing gate structure and method of manufacturing...
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12,170,280
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Dec 17, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Ji-Cheng Chen
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Methods for forming a semiconductor device structure and related se...
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12,166,099
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Dec 10, 2024
ASM IP Holding B.V.
Chiyu Zhu
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Pre-deposition treatment for FET technology and devices formed thereby
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12,142,531
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Nov 12, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Cheng-Yen Tsai
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PEALD nitride films
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12,119,221
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Oct 15, 2024
Applied Materials, Inc.
Hanhong Chen
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Methods for filling a gap feature on a substrate surface and relate...
Patent number
12,119,220
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Oct 15, 2024
ASM IP Holding B.V.
Leo Salmi
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Deposition method and an apparatus for depositing a silicon-contain...
Patent number
12,107,005
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Oct 1, 2024
ASM IP Holding B.V.
Zecheng Liu
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Selective blocking of metal surfaces using bifunctional self-assemb...
Patent number
12,094,766
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Sep 17, 2024
Applied Materials, Inc.
Michael L. McSwiney
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Method for sealing a seam, semiconductor structure, and method for...
Patent number
12,094,768
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Sep 17, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Yu-Lien Huang
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Methods for forming a metal silicate film on a substrate in a react...
Patent number
12,094,936
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Sep 17, 2024
ASM IP Holding B.V.
Fu Tang
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Tin oxide films in semiconductor device manufacturing
Patent number
12,094,711
Issue date
Sep 17, 2024
Lam Research Corporation
Jengyi Yu
H01 - BASIC ELECTRIC ELEMENTS
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THIN FILM MODIFICATION COMPOSITION, METHOD OF FORMING THIN FILM USI...
Publication number
20250218767
Publication date
Jul 3, 2025
Soulbrain Co., LTD
Seung Hyun LEE
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METHODS FOR DEPOSITING GAP FILLING FLUIDS AND RELATED SYSTEMS AND D...
Publication number
20250201628
Publication date
Jun 19, 2025
ASM IP HOLDING B.V.
Timothee Blanquart
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TUNABILITY OF DOPANT CONCENTRATION IN THIN HAFNIUM OXIDE FILMS
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20250191908
Publication date
Jun 12, 2025
Applied Materials, Inc.
Golnaz Karbasian
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STEP COVERAGE IMPROVER, METHOD OF FORMING THIN FILM USING STEP COVE...
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20250188598
Publication date
Jun 12, 2025
Soulbrain Co., LTD
Seung Hyun LEE
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METHODS AND APPARATUS UTILIZING INDIUM-BASED PRECURSORS FOR INTEGRA...
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20250157808
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May 15, 2025
Intel Corporation
Charles Mokhtarzadeh
H01 - BASIC ELECTRIC ELEMENTS
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THIN-FILM FORMING COMPOSITION INCLUDING ALUMINUM COMPOUND, METHOD O...
Publication number
20250157809
Publication date
May 15, 2025
Samsung Electronics Co., Ltd.
Daeun Kim
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HYDROGEN BARRIERS AND RELATED STRUCTURES, SYSTEMS, AND METHODS
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20250132149
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Apr 24, 2025
ASM IP HOLDING B.V.
Aditya Chauhan
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PRECURSOR FOR FORMING YTTRIUM- OR SCANDIUM-CONTAINING THIN FILM, ME...
Publication number
20250122619
Publication date
Apr 17, 2025
SK TRI CHEM CO., LTD.
Han Sol OH
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DEPOSITION OF ORGANIC FILMS
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20250118562
Publication date
Apr 10, 2025
ASM IP HOLDING B.V.
Eva E. Tois
B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
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FILM DEPOSITING COMPOSITION INCLUDING GROUP 4 METAL ELEMENT-CONTAIN...
Publication number
20250109496
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Apr 3, 2025
UP CHEMICAL CO., LTD.
Byung Kwan KIM
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HAFNIUM-CONTAINING STRUCTURES AND RELATED METHODS AND SYSTEMS
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20250079155
Publication date
Mar 6, 2025
ASM IP HOLDING B.V.
Fatemeh Davodi
H01 - BASIC ELECTRIC ELEMENTS
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DEPOSITION OF ORGANIC MATERIAL
Publication number
20250079161
Publication date
Mar 6, 2025
ASM IP HOLDING B.V.
Adam Vianna
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METHODS FOR FORMING A SEMICONDUCTOR DEVICE STRUCTURE AND RELATED SE...
Publication number
20250081588
Publication date
Mar 6, 2025
ASM IP HOLDING B.V.
Chiyu Zhu
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NITROGEN-BASED OXYGEN-FREE DIPOLES, RELATED DEVICES, RELATED SYSTEM...
Publication number
20250079156
Publication date
Mar 6, 2025
ASM IP HOLDING B.V.
Giuseppe Alessio Verni
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METHODS OF IMPROVING METAL OXIDE DEPOSITION WITH NITROGEN OXIDE AND...
Publication number
20250079157
Publication date
Mar 6, 2025
Entegris, Inc.
Rong Zhao
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SELECTIVE DEPOSITION OF OXIDE MATERIAL AND A DEPOSITION ASSEMBLY
Publication number
20250069883
Publication date
Feb 27, 2025
ASM IP HOLDING B.V.
Vincent Vandalon
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Atomic Layer Deposition of Passivation Layer
Publication number
20250046603
Publication date
Feb 6, 2025
TOKYO ELECTRON LIMITED
Du Zhang
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SUBSTRATE PROCESSING METHOD
Publication number
20250029829
Publication date
Jan 23, 2025
ASM IP HOLDING B.V.
SungBae Kim
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HALOGEN-FREE MOLYBDENUM-CONTAINING PRECURSORS FOR DEPOSITION OF MOL...
Publication number
20240425536
Publication date
Dec 26, 2024
Applied Materials, Inc.
Feng Q. Liu
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DENSIFIED SEAM-FREE SILICON-CONTAINING MATERIAL GAP FILL PROCESSES
Publication number
20240420950
Publication date
Dec 19, 2024
Applied Materials, Inc.
Xiang Ji
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Semiconductor Device and Method of Forming the Same
Publication number
20240387686
Publication date
Nov 21, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Hsin-Hua Lee
H01 - BASIC ELECTRIC ELEMENTS
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DEVICE AND METHOD OF FORMING THE SAME
Publication number
20240387255
Publication date
Nov 21, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu-Lien Huang
H01 - BASIC ELECTRIC ELEMENTS
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METHOD FOR FORMING SEMICONDUCTOR DEVICE HAVING CRYSTALLINE SEMICOND...
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20240387169
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Nov 21, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yen-Chieh Huang
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METHODS FOR REDUCING SCRATCH DEFECTS IN CHEMICAL MECHANICAL PLANARI...
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20240387187
Publication date
Nov 21, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Wan-Chun Pan
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SEMICONDUCTOR STRUCTURE HAVING SEAM SEALED
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20240379419
Publication date
Nov 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Lien HUANG
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INTERCONNECT SYSTEM WITH IMPROVED LOW-K DIELECTRICS
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20240363336
Publication date
Oct 31, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Joung-Wei Liou
H01 - BASIC ELECTRIC ELEMENTS
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C-AXIS ORIENTED IZO MATERIAL FILM AND MANUFACTURING METHOD THEREFOR
Publication number
20240360550
Publication date
Oct 31, 2024
IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)
Jin Seong PARK
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SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
Publication number
20240355926
Publication date
Oct 24, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Kuan-Ting Chen
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METHOD FOR DEPOSITING AMORPHOUS CARBON FILM
Publication number
20240347335
Publication date
Oct 17, 2024
TES CO., LTD.
Kwang-Ki Kim
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SEGMENTED FORMATION OF GATE INTERFACE
Publication number
20240339318
Publication date
Oct 10, 2024
Applied Materials, Inc.
Steven C. H. HUNG
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...