the layer being porous

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H01L21/02203

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/02203the layer being porous

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Patents Grantslast 30 patents

Information Patent Grant
Methods for filling a gap feature on a substrate surface and relate...
- Patent number 12,119,220
- Issue date Oct 15, 2024
- ASM IP Holding B.V.
- Leo Salmi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure comprising a buried porous layer for RF app...
- Patent number 12,119,258
- Issue date Oct 15, 2024
- Soitec
- Emmanuel Augendre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices and semiconductor dev...
- Patent number 12,040,381
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Yi Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric layer, interconnection structure using the same, and man...
- Patent number 12,014,919
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Chen Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Porogen bonded gap filling material in semiconductor manufacturing
- Patent number 11,984,316
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Jiun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor film composition, method for manufacturing semiconduc...
- Patent number 11,965,109
- Issue date Apr 23, 2024
- Mitsui Chemicals, Inc.
- Yasuhisa Kayaba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Percolation doping of inorganic-organic frameworks for multiple dev...
- Patent number 11,915,926
- Issue date Feb 27, 2024
- International Business Machines Corporation
- Leonidas Ernesto Ocola
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Alkoxysilacyclic or acyloxysilacyclic compounds and methods for dep...
- Patent number 11,884,689
- Issue date Jan 30, 2024
- Robert Gordon Ridgeway
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device with a porous portion, wafer composite and met...
- Patent number 11,881,397
- Issue date Jan 23, 2024
- Infineon Technologies AG
- Iris Moder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inner spacers for gate-all-around semiconductor devices
- Patent number 11,855,214
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co. LTD
- Yu-Yun Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,837,515
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yin-Jie Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nano multilayer carbon-rich low-k spacer
- Patent number 11,791,398
- Issue date Oct 17, 2023
- International Business Machines Corporation
- Donald Canaperi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming high carbon content flowable dielectric film with low proce...
- Patent number 11,756,786
- Issue date Sep 12, 2023
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with tilted insulating layers and method for f...
- Patent number 11,728,299
- Issue date Aug 15, 2023
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Immersion cooling with water-based fluid using nano-structured coating
- Patent number 11,692,271
- Issue date Jul 4, 2023
- The Board of Trustees of the University of Illinois
- Nenad Miljkovic
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Porogen bonded gap filling material in semiconductor manufacturing
- Patent number 11,658,120
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Jiun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for porosifying a material and semiconductor structure
- Patent number 11,651,954
- Issue date May 16, 2023
- Cambridge Enterprise Ltd
- Tongtong Zhu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
System and method of forming a porous low-k structure
- Patent number 11,637,010
- Issue date Apr 25, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Jiun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices and semiconductor dev...
- Patent number 11,621,343
- Issue date Apr 4, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Yi Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with porous insulating...
- Patent number 11,616,022
- Issue date Mar 28, 2023
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for filling a gap feature on a substrate surface and relate...
- Patent number 11,527,403
- Issue date Dec 13, 2022
- ASM IP Holding B.V.
- Leo Salmi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resonant LC tank package and method of manufacture
- Patent number 11,521,793
- Issue date Dec 6, 2022
- Intel Corporation
- Saravana Maruthamuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a porous portion, wafer composite and met...
- Patent number 11,476,111
- Issue date Oct 18, 2022
- Infineon Technologies AG
- Iris Moder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a porous metal oxide film and a semicon...
- Patent number 11,474,063
- Issue date Oct 18, 2022
- Murata Manufacturing Co., Ltd.
- Hiroshi Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with partially embedded insulation region a...
- Patent number 11,469,136
- Issue date Oct 11, 2022
- STMicroelectronics S.r.l.
- Simone Dario Mariani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with tilted insulating layers and method for f...
- Patent number 11,469,195
- Issue date Oct 11, 2022
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with porous insulating layers and method for f...
- Patent number 11,424,187
- Issue date Aug 23, 2022
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure formation
- Patent number 11,404,267
- Issue date Aug 2, 2022
- Micron Technology, Inc.
- Santanu Sarkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus, processing system, and method of etchi...
- Patent number 11,361,945
- Issue date Jun 14, 2022
- Tokyo Electron Limited
- Shigeru Tahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor material having tunable permittivity and tunable ther...
- Patent number 11,355,340
- Issue date Jun 7, 2022
- IQE PLC
- Richard Hammond
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240387255
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POROUS LAYER AND METHOD FOR FABRICATING T...
- Publication number 20240387166
- Publication date Nov 21, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POROUS LAYER AND METHOD FOR FABRICATING T...
- Publication number 20240387165
- Publication date Nov 21, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEV...
- Publication number 20240322011
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Yi PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC LAYER, INTERCONNECTION STRUCTURE USING THE SAME, AND MAN...
- Publication number 20240297038
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Chen HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING POROUS SEMICONDUCTOR MATERIAL ADJACE...
- Publication number 20240250120
- Publication date Jul 25, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Shesh Mani PANDEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALKOXYSILACYCLIC OR ACYLOXYSILACYCLIC COMPOUNDS AND METHODS FOR DEP...
- Publication number 20240182499
- Publication date Jun 6, 2024
- VERSUM MATERIALS US, LLC
- ROBERT GORDON RIDGEWAY
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR OBTAINING AN INTEGRATED DEVICE COMPRISING USING AN ETCHI...
- Publication number 20240178183
- Publication date May 30, 2024
- Murata Manufacturing Co., Ltd.
- Florent LALLEMAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A POROUS PORTION, WAFER COMPOSITE AND MET...
- Publication number 20240153759
- Publication date May 9, 2024
- INFINEON TECHNOLOGIES AG
- Iris MODER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INNER SPACERS FOR GATE-ALL-AROUND SEMICONDUCTOR DEVICES
- Publication number 20240136438
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Yun Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240055521
- Publication date Feb 15, 2024
- NANYA TECHNOLOGY CORPORATION
- Hung-Chi TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20230386947
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yin-Jie Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20230352588
- Publication date Nov 2, 2023
- NANYA TECHNOLOGY CORPORATION
- Hung-Chi TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMMERSION COOLING WITH WATER-BASED FLUID USING NANO-STRUCTURED COATING
- Publication number 20230332293
- Publication date Oct 19, 2023
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- Nenad Miljkovic
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEV...
- Publication number 20230307522
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Yi PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Porogen Bonded Gap Filling Material In Semiconductor Manufacturing
- Publication number 20230299003
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Jiun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20230268225
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System And Method Of Forming A Porous Low-K Structure
- Publication number 20230260781
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Jiun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYERED STRUCTURE
- Publication number 20230245884
- Publication date Aug 3, 2023
- IQE plc
- Richard HAMMOND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND ETCHING DEVICE
- Publication number 20230223270
- Publication date Jul 13, 2023
- TOKYO ELECTRON LIMITED
- Takehiko ORII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FILLING A GAP FEATURE ON A SUBSTRATE SURFACE AND RELATE...
- Publication number 20230170207
- Publication date Jun 1, 2023
- ASM IP HOLDING B.V.
- Leo Salmi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION ON METALS USING POROUS LOW-K MATERIALS
- Publication number 20230154757
- Publication date May 18, 2023
- International Business Machines Corporation
- Krystelle Lionti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR POROSIFYING A MATERIAL AND SEMICONDUCTOR STRUCTURE
- Publication number 20230096352
- Publication date Mar 30, 2023
- CAMBRIDGE ENTERPRISE LTD
- Tongtong ZHU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PERCOLATION DOPING OF INORGANIC - ORGANIC FRAMEWORKS FOR MULTIPLE D...
- Publication number 20230097847
- Publication date Mar 30, 2023
- International Business Machines Corporation
- Leonidas Ernesto Ocola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220399202
- Publication date Dec 15, 2022
- United Microelectronics Corp.
- Jingyu Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A POROUS PORTION, WAFER COMPOSITE AND MET...
- Publication number 20220359194
- Publication date Nov 10, 2022
- INFINEON TECHNOLOGIES AG
- Iris MODER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE COMPRISING AN UNDERGROUND POROUS LAYER, FOR...
- Publication number 20220359272
- Publication date Nov 10, 2022
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Emmanuel Augendre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH TILTED INSULATING LAYERS AND METHOD FOR F...
- Publication number 20220278025
- Publication date Sep 1, 2022
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POROUS RF SWITCH FOR REDUCED CROSSTALK
- Publication number 20220254631
- Publication date Aug 11, 2022
- IQE plc
- Richard Hammond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Precursors and Flowable CVD Methods for Making Low-K Films to Fill...
- Publication number 20220157601
- Publication date May 19, 2022
- VERSUM MATERIALS US, LLC
- Jianheng Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

the layer being porous

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods for filling a gap feature on a substrate surface and relate...

Semiconductor structure comprising a buried porous layer for RF app...

Method of manufacturing semiconductor devices and semiconductor dev...

Dielectric layer, interconnection structure using the same, and man...

Porogen bonded gap filling material in semiconductor manufacturing

Semiconductor film composition, method for manufacturing semiconduc...

Percolation doping of inorganic-organic frameworks for multiple dev...

Alkoxysilacyclic or acyloxysilacyclic compounds and methods for dep...

Semiconductor device with a porous portion, wafer composite and met...

Inner spacers for gate-all-around semiconductor devices

Semiconductor device and method

Nano multilayer carbon-rich low-k spacer

Forming high carbon content flowable dielectric film with low proce...

Semiconductor device with tilted insulating layers and method for f...

Immersion cooling with water-based fluid using nano-structured coating

Porogen bonded gap filling material in semiconductor manufacturing

Method for porosifying a material and semiconductor structure

System and method of forming a porous low-k structure

Method of manufacturing semiconductor devices and semiconductor dev...

Method for fabricating semiconductor device with porous insulating...

Methods for filling a gap feature on a substrate surface and relate...

Resonant LC tank package and method of manufacture

Semiconductor device with a porous portion, wafer composite and met...

Semiconductor device having a porous metal oxide film and a semicon...

Semiconductor structure with partially embedded insulation region a...

Semiconductor device with tilted insulating layers and method for f...

Semiconductor device with porous insulating layers and method for f...

Semiconductor structure formation

Plasma processing apparatus, processing system, and method of etchi...

Semiconductor material having tunable permittivity and tunable ther...

Patents Applicationslast 30 patents

DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE WITH POROUS LAYER AND METHOD FOR FABRICATING T...

SEMICONDUCTOR DEVICE WITH POROUS LAYER AND METHOD FOR FABRICATING T...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEV...

DIELECTRIC LAYER, INTERCONNECTION STRUCTURE USING THE SAME, AND MAN...

SEMICONDUCTOR DEVICE INCLUDING POROUS SEMICONDUCTOR MATERIAL ADJACE...

ALKOXYSILACYCLIC OR ACYLOXYSILACYCLIC COMPOUNDS AND METHODS FOR DEP...

METHOD FOR OBTAINING AN INTEGRATED DEVICE COMPRISING USING AN ETCHI...

SEMICONDUCTOR DEVICE WITH A POROUS PORTION, WAFER COMPOSITE AND MET...

INNER SPACERS FOR GATE-ALL-AROUND SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

IMMERSION COOLING WITH WATER-BASED FLUID USING NANO-STRUCTURED COATING

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEV...

Porogen Bonded Gap Filling Material In Semiconductor Manufacturing

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

System And Method Of Forming A Porous Low-K Structure

LAYERED STRUCTURE

ETCHING METHOD AND ETCHING DEVICE

METHODS FOR FILLING A GAP FEATURE ON A SUBSTRATE SURFACE AND RELATE...

SELECTIVE DEPOSITION ON METALS USING POROUS LOW-K MATERIALS

METHOD FOR POROSIFYING A MATERIAL AND SEMICONDUCTOR STRUCTURE

PERCOLATION DOPING OF INORGANIC - ORGANIC FRAMEWORKS FOR MULTIPLE D...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH A POROUS PORTION, WAFER COMPOSITE AND MET...

SEMICONDUCTOR STRUCTURE COMPRISING AN UNDERGROUND POROUS LAYER, FOR...

SEMICONDUCTOR DEVICE WITH TILTED INSULATING LAYERS AND METHOD FOR F...

POROUS RF SWITCH FOR REDUCED CROSSTALK

Precursors and Flowable CVD Methods for Making Low-K Films to Fill...