the layer connector being at least partially embedded in the surface

Industry

CPC
H01L2224/32112

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/32112the layer connector being at least partially embedded in the surface

Industries

Patents Grantslast 30 patents

Information Patent Grant
Display panel and manufacturing method for same
- Patent number 11,776,943
- Issue date Oct 3, 2023
- Samsung Display Co., Ltd.
- Hyun A Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including fan-out lines
- Patent number 11,342,319
- Issue date May 24, 2022
- Innolux Corporation
- Chun-Hsien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability wafer level semiconductor packaging
- Patent number 10,790,208
- Issue date Sep 29, 2020
- Semiconductor Components Industries, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability wafer level semiconductor packaging
- Patent number 10,290,556
- Issue date May 14, 2019
- Semiconductor Components Industries, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability wafer level semiconductor packaging
- Patent number 9,859,180
- Issue date Jan 2, 2018
- Semiconductor Components Industries, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor gas sensor
- Patent number 8,592,875
- Issue date Nov 26, 2013
- Micronas GmbH
- Christoph Wilbertz
- G01 - MEASURING TESTING
Information Patent Grant
Light-emitting semiconductor component
- Patent number 6,900,476
- Issue date May 31, 2005
- Osram Opto Semiconductors GmbH
- Klaus Steubel
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230154882
- Publication date May 18, 2023
- Fuji Electric Co., Ltd.
- Ryotaro TSURUOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND MANUFACTURING METHOD FOR SAME
- Publication number 20220013517
- Publication date Jan 13, 2022
- SAMSUNG DISPLAY CO., LTD.
- HYUN A LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20210280567
- Publication date Sep 9, 2021
- InnoLux Corporation
- Chun-Hsien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING
- Publication number 20190229025
- Publication date Jul 25, 2019
- Semiconductor Components Industries, LLC
- Yu-Te HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING
- Publication number 20180082913
- Publication date Mar 22, 2018
- Semiconductor Components Industries, LLC
- Yu-Te HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING
- Publication number 20170236761
- Publication date Aug 17, 2017
- Semiconductor Components Industries, LLC
- Yu-Te HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR GAS SENSOR
- Publication number 20130126947
- Publication date May 23, 2013
- Micronas GmbH
- Christoph WILBERTZ
- G01 - MEASURING TESTING
Information Patent Application
Light-emitting semiconductor component
- Publication number 20050017252
- Publication date Jan 27, 2005
- Osram Opto Semiconductors GmbH
- Klaus Streubel
- H01 - BASIC ELECTRIC ELEMENTS

the layer connector being at least partially embedded in the surface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display panel and manufacturing method for same

Display device including fan-out lines

High reliability wafer level semiconductor packaging

High reliability wafer level semiconductor packaging

High reliability wafer level semiconductor packaging

Semiconductor gas sensor

Light-emitting semiconductor component

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

DISPLAY PANEL AND MANUFACTURING METHOD FOR SAME

DISPLAY DEVICE

HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING

HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING

HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING

SEMICONDUCTOR GAS SENSOR

Light-emitting semiconductor component