the layer connector being disposed in a recess of the surface

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/32111the layer connector being disposed in a recess of the surface

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Patents Grantslast 30 patents

Information Patent Grant
Reliable semiconductor packages
- Patent number 12,211,863
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- UTAC HEADQUARTERS PTE. LTD.
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Information Patent Grant
Semiconductor module comprising a housing
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- Siemens Aktiengesellschaft
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Information Patent Grant
Display structure and preparation method thereof, and display appar...
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- Yingwei Liu
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Information Patent Grant
High reliability wafer level semiconductor packaging
- Patent number 10,790,208
- Issue date Sep 29, 2020
- Semiconductor Components Industries, LLC
- Yu-Te Hsieh
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Information Patent Grant
Semiconductor device with plated lead frame
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- Issue date Aug 18, 2020
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- Carsten von Koblinski
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Information Patent Grant
Integrated circuit module and method of forming same
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- Starkey Laboratories, Inc.
- Sayed Kaysarbin Rahim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Via and trench filling using injection molded soldering
- Patent number 10,383,572
- Issue date Aug 20, 2019
- International Business Machines Corporation
- John U. Knickerbocker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High reliability wafer level semiconductor packaging
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- Issue date May 14, 2019
- Semiconductor Components Industries, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via and trench filling using injection molded soldering
- Patent number 10,258,279
- Issue date Apr 16, 2019
- International Business Machines Corporation
- John U. Knickerbocker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via and trench filling using injection molded soldering
- Patent number 10,130,302
- Issue date Nov 20, 2018
- International Business Machines Corporation
- John U. Knickerbocker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High reliability wafer level semiconductor packaging
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- Issue date Jan 2, 2018
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with plated lead frame, and method for manufac...
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- Issue date Dec 19, 2017
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Information Patent Grant
Via and trench filling using injection molded soldering
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- Issue date Sep 26, 2017
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Information Patent Grant
Semiconductor packages and methods for producing the same
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- Issue date Apr 21, 2015
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- Udo Ausserlechner
- G01 - MEASURING TESTING
Information Patent Grant
Microelectronic chip, component containing such a chip and manufact...
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- Laurent Gay
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Information Patent Grant
Stacked semiconductor package
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- Issue date Mar 19, 2013
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- Jong Hyun Nam
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Information Patent Grant
LED package structure
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- Issue date Feb 19, 2013
- Ambit Microsystems (Zhongshan) Ltd.
- Jun Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE
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- Chun Fu KUO
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Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
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- Publication date May 18, 2023
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- Ryotaro TSURUOKA
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Information Patent Application
SEMICONDUCTOR MODULE COMPRISING A HOUSING
- Publication number 20230111324
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DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME
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SEMICONDUCTOR DEVICE PACKAGES HAVING STACKED SEMICONDUCTOR DICE
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SEMICONDUCTOR DEVICE PACKAGES HAVING STACKED SEMICONDUCTOR DICE
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Chip Module, Use of Chip Module, Test Arrangement and Test Method
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Information Patent Application
RELIABLE SEMICONDUCTOR PACKAGES
- Publication number 20210366963
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- UTAC Headquarters Pte. Ltd.
- Il Kwon SHIM
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Information Patent Application
Display Structure and Preparation Method thereof, and Display Appar...
- Publication number 20210043619
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- BOE TECHNOLOGY GROUP CO., LTD.
- Yingwei LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING
- Publication number 20190229025
- Publication date Jul 25, 2019
- Semiconductor Components Industries, LLC
- Yu-Te HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA AND TRENCH FILLING USING INJECTION MOLDED SOLDERING
- Publication number 20180344245
- Publication date Dec 6, 2018
- International Business Machines Corporation
- John U. Knickerbocker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Massively parallel transfer of microLED devices
- Publication number 20180190614
- Publication date Jul 5, 2018
- Ananda H. Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING
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- Semiconductor Components Industries, LLC
- Yu-Te HSIEH
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Semiconductor Device with Plated Lead Frame
- Publication number 20180061671
- Publication date Mar 1, 2018
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- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA AND TRENCH FILLING USING INJECTION MOLDED SOLDERING
- Publication number 20180005982
- Publication date Jan 4, 2018
- International Business Machines Corporation
- John U. Knickerbocker
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Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
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- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
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Information Patent Application
HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING
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Information Patent Application
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- Jong Hyun NAM
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Information Patent Application
MICROELECTRONIC CHIP, COMPONENT CONTAINING SUCH A CHIP AND MANUFACT...
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED PACKAGE STRUCTURE
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- Publication date Oct 18, 2012
- HON HAI Precision Industry CO., LTD.
- JUN YANG
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Semiconductor Packages and Methods For Producing The Same
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- INFINEON TECHNOLOGIES AG
- Udo Ausserlechner
- G01 - MEASURING TESTING

the layer connector being disposed in a recess of the surface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Reliable semiconductor packages

Semiconductor module comprising a housing

Display structure and preparation method thereof, and display appar...

High reliability wafer level semiconductor packaging

Semiconductor device with plated lead frame

Integrated circuit module and method of forming same

Via and trench filling using injection molded soldering

High reliability wafer level semiconductor packaging

Via and trench filling using injection molded soldering

Via and trench filling using injection molded soldering

High reliability wafer level semiconductor packaging

Semiconductor device with plated lead frame, and method for manufac...

Via and trench filling using injection molded soldering

Semiconductor packages and methods for producing the same

Microelectronic chip, component containing such a chip and manufact...

Stacked semiconductor package

LED package structure

Patents Applicationslast 30 patents

PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR MODULE COMPRISING A HOUSING

DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR DEVICE PACKAGES HAVING STACKED SEMICONDUCTOR DICE

SEMICONDUCTOR DEVICE PACKAGES HAVING STACKED SEMICONDUCTOR DICE

Chip Module, Use of Chip Module, Test Arrangement and Test Method

RELIABLE SEMICONDUCTOR PACKAGES

Display Structure and Preparation Method thereof, and Display Appar...

HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING

VIA AND TRENCH FILLING USING INJECTION MOLDED SOLDERING

Massively parallel transfer of microLED devices

HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING

Semiconductor Device with Plated Lead Frame

VIA AND TRENCH FILLING USING INJECTION MOLDED SOLDERING

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING

Method of Manufacturing Semiconductor Device and Semiconductor Device

STACKED SEMICONDUCTOR PACKAGE

MICROELECTRONIC CHIP, COMPONENT CONTAINING SUCH A CHIP AND MANUFACT...

LED PACKAGE STRUCTURE

Semiconductor Packages and Methods For Producing The Same