the layer connector being disposed on a redistribution layer on the semiconductor or solid-state body

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H01L2224/29024

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29024the layer connector being disposed on a redistribution layer on the semiconductor or solid-state body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Package structure comprising thermally conductive layer around the...
- Patent number 12,033,963
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic system having increased coupling by using horizontal and...
- Patent number 10,861,842
- Issue date Dec 8, 2020
- STMicroelectronics S.r.l.
- Alberto Pagani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic system having increased coupling by using horizontal and...
- Patent number 10,453,833
- Issue date Oct 22, 2019
- STMicroelectonics S.R.L.
- Alberto Pagani
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Electronic system having increased coupling by using horizontal and...
- Patent number 10,319,708
- Issue date Jun 11, 2019
- STMicroelectronics S.r.l.
- Alberto Pagani
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Electronic system having increased coupling by using horizontal and...
- Patent number 9,881,911
- Issue date Jan 30, 2018
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 8,748,225
- Issue date Jun 10, 2014
- Fuji Electric Co., Ltd.
- Kyohei Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layered chip package and method of manufacturing same
- Patent number 8,653,639
- Issue date Feb 18, 2014
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,598,688
- Issue date Dec 3, 2013
- Fuji Electric Co., Ltd.
- Kyohei Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite layered chip package
- Patent number 8,426,979
- Issue date Apr 23, 2013
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layered chip package and method of manufacturing same
- Patent number 8,358,015
- Issue date Jan 22, 2013
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240321786
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
- Publication number 20240145332
- Publication date May 2, 2024
- Hitachi Energy Ltd
- Niko PAVLICEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240071999
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tseng Hsing Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230061876
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...
- Publication number 20180130784
- Publication date May 10, 2018
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...
- Publication number 20180102353
- Publication date Apr 12, 2018
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...
- Publication number 20130241025
- Publication date Sep 19, 2013
- STMicroelectronics S.r. I.
- Alberto PAGANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20130237016
- Publication date Sep 12, 2013
- Fuji Electric Co., Ltd.
- Kyohei FUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE LAYERED CHIP PACKAGE
- Publication number 20130020723
- Publication date Jan 24, 2013
- SAE MAGNETICS (H. K) LTD.
- Yoshitaka SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20120313260
- Publication date Dec 13, 2012
- HEADWAY TECHNOLOGIES, INC.
- Yoshitaka SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20120313224
- Publication date Dec 13, 2012
- Fuji Electric Co., Ltd.
- Kyohei FUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20120313259
- Publication date Dec 13, 2012
- SAE Magnetics (H.K.) Ltd.
- Yoshitaka SASAKI
- H01 - BASIC ELECTRIC ELEMENTS

the layer connector being disposed on a redistribution layer on the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package structure comprising thermally conductive layer around the...

Electronic system having increased coupling by using horizontal and...

Electronic system having increased coupling by using horizontal and...

Electronic system having increased coupling by using horizontal and...

Electronic system having increased coupling by using horizontal and...

Semiconductor device manufacturing method

Layered chip package and method of manufacturing same

Semiconductor device

Composite layered chip package

Layered chip package and method of manufacturing same

Patents Applicationslast 30 patents

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...

ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...

ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

COMPOSITE LAYERED CHIP PACKAGE

LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME