the layer connector being disposed on at least two separate bonding areas

Industry

CPC
H01L2224/29028

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29028the layer connector being disposed on at least two separate bonding areas

Industries

Patents Grantslast 30 patents

Information Patent Grant
Display device and method of providing the same
- Patent number 11,950,467
- Issue date Apr 2, 2024
- Samsung Display Co., Ltd.
- Byoungyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus including a display panel with multiple pads
- Patent number 11,894,294
- Issue date Feb 6, 2024
- Samsung Display Co., Ltd.
- Hanho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming thereof
- Patent number 11,854,969
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and display device using the same
- Patent number 11,683,963
- Issue date Jun 20, 2023
- SAMSUNG DISPLAY CO., LTD.
- Chungseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-to-wafer bonding structure and semiconductor package using the...
- Patent number 11,658,141
- Issue date May 23, 2023
- Samsung Electronics Co., Ltd.
- Jiseok Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite semiconductor component having projecting elements projec...
- Patent number 11,527,521
- Issue date Dec 13, 2022
- OSRAM OLED GmbH
- Lutz Hoeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,437,332
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming thereof
- Patent number 11,410,927
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanowire bonding interconnect for fine-pitch microelectronics
- Patent number 11,387,202
- Issue date Jul 12, 2022
- Invensas LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-to-wafer bonding structure and semiconductor package using the...
- Patent number 11,289,438
- Issue date Mar 29, 2022
- Samsung Electronics Co., Ltd.
- Jiseok Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and display device
- Patent number 11,239,202
- Issue date Feb 1, 2022
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Jing Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages and methods of manufacturing the same
- Patent number 11,011,491
- Issue date May 18, 2021
- Advanced Semiconductor Engineering, Inc.
- Shun-Tsat Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with underfill control features, and associat...
- Patent number 10,784,224
- Issue date Sep 22, 2020
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode with pads on side surface thereof, light emitt...
- Patent number 10,763,413
- Issue date Sep 1, 2020
- BOE Technology Group Co., Ltd.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated multi-color light-emitting pixel arrays based devices by...
- Patent number 10,636,838
- Issue date Apr 28, 2020
- Shaoher Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film
- Patent number 10,424,538
- Issue date Sep 24, 2019
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with underfill control features, and associat...
- Patent number 10,424,553
- Issue date Sep 24, 2019
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated multi-color light-emitting pixel arrays based devices by...
- Patent number 10,325,894
- Issue date Jun 18, 2019
- Shaoher Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D-joining of microelectronic components with conductively self-adj...
- Patent number 10,297,570
- Issue date May 21, 2019
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and display device using the same
- Patent number 10,217,807
- Issue date Feb 26, 2019
- Samsung Display Co., Ltd.
- Chungseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for routing die signals using external interco...
- Patent number 9,871,012
- Issue date Jan 16, 2018
- QUALCOMM Incorporated
- Vaishnav Srinivas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D-joining of microelectronic components with conductively self-adj...
- Patent number 9,871,014
- Issue date Jan 16, 2018
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive material, electronic device including anisot...
- Patent number 9,831,211
- Issue date Nov 28, 2017
- Samsung Electronics Co., Ltd.
- Kunmo Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding metallic contact areas with solution of a sacrif...
- Patent number 9,640,510
- Issue date May 2, 2017
- EV Group E. Thallner GmbH
- Bernhard Rebhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die backside standoff structures for semiconductor devices
- Patent number 8,722,528
- Issue date May 13, 2014
- Fairchild Semiconductor Corporation
- Michael Gruenhagen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip, and semiconductor package and system each inclu...
- Patent number 8,519,470
- Issue date Aug 27, 2013
- Samsung Electronics Co., Ltd.
- Sun-won Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-to-chip multi-signaling communication system with common condu...
- Patent number 8,426,980
- Issue date Apr 23, 2013
- National Chiao Tung University
- Chau-Chin Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die backside standoff structures for semiconductor devices
- Patent number 8,314,473
- Issue date Nov 20, 2012
- Fairchild Semiconductor Corporation
- Michael Gruenhagen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device using semiconductor chip
- Patent number 7,002,185
- Issue date Feb 21, 2006
- Rohm Co., Ltd.
- Shinji Isokawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240096903
- Publication date Mar 21, 2024
- SAMSUNG DISPLAY CO., LTD.
- Veidhes BASRUR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE INCLUDING BONDING MEMBER CONNECTING BETWEEN LIGHT EM...
- Publication number 20240079365
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Seungryong HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS
- Publication number 20240030210
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Juyeon Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO LIGHT EMITTING DIODE DISPLAY PANEL, MANUFACTURING METHOD THER...
- Publication number 20240030393
- Publication date Jan 25, 2024
- Shenzhen china Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Xueru MEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230411282
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE AND DISPLAY APPARATUS HAVING THE SAME
- Publication number 20230387095
- Publication date Nov 30, 2023
- Samsung Electronics Co., Ltd.
- Jaeseok Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...
- Publication number 20230387051
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE INCLUDING SAME
- Publication number 20230290751
- Publication date Sep 14, 2023
- SAMSUNG DISPLAY CO., LTD.
- Joo Nyung JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230246143
- Publication date Aug 3, 2023
- Samsung Electronics Co., Ltd.
- Seungryong HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOWIRE BONDING INTERCONNECT FOR FINE-PITCH MICROELECTRONICS
- Publication number 20230105341
- Publication date Apr 6, 2023
- Invensas LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Display Panel, Display Device, and Manufacturing Method of Display...
- Publication number 20230012152
- Publication date Jan 12, 2023
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Ping Wen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DISPLAY DEVICE AND METHOD OF PROVIDING THE SAME
- Publication number 20220392989
- Publication date Dec 8, 2022
- BYOUNGYONG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING PACKAGE STRUCTURE
- Publication number 20220367392
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THEREOF
- Publication number 20220367351
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THEREOF
- Publication number 20220367352
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Structures of Integrated Circuit Devices and Method Forming...
- Publication number 20220238466
- Publication date Jul 28, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THEREOF
- Publication number 20220165665
- Publication date May 26, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220139851
- Publication date May 5, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-TO-WAFER BONDING STRUCTURE AND SEMICONDUCTOR PACKAGE USING THE...
- Publication number 20210104482
- Publication date Apr 8, 2021
- Samsung Electronics Co., Ltd.
- Jiseok Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20210074669
- Publication date Mar 11, 2021
- Advanced Semiconductor Engineering, Inc.
- Shun-Tsat TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composite Semiconductor Component and Method for Producing a Compos...
- Publication number 20200411493
- Publication date Dec 31, 2020
- OSRAM OLED GmbH
- Lutz Hoeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOWIRE BONDING INTERCONNECT FOR FINE-PITCH MICROELECTRONICS
- Publication number 20200279821
- Publication date Sep 3, 2020
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH UNDERFILL CONTROL FEATURES, AND ASSOCIAT...
- Publication number 20190371755
- Publication date Dec 5, 2019
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE USING THE SAME
- Publication number 20190148478
- Publication date May 16, 2019
- SAMSUNG DISPLAY CO., LTD.
- Chungseok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION COMPONENT, CONNECTOR, MANUFACTURING METHOD FOR THE SAME...
- Publication number 20180331170
- Publication date Nov 15, 2018
- WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., L TD
- Kui XU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Adhesive with Self-Connecting Interconnects
- Publication number 20180130766
- Publication date May 10, 2018
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH UNDERFILL CONTROL FEATURES, AND ASSOCIAT...
- Publication number 20180122762
- Publication date May 3, 2018
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE USING THE SAME
- Publication number 20170352716
- Publication date Dec 7, 2017
- SAMSUNG DISPLAY CO., LTD.
- Chungseok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE INCLUDING AN ANISOTROPIC CONDUCTIVE FILM, AND MANUFA...
- Publication number 20170338198
- Publication date Nov 23, 2017
- SAMSUNG DISPLAY CO., LTD.
- Eui Yun JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D-JOINING OF MICROELECTRONIC COMPONENTS WITH CONDUCTIVELY SELF-ADJ...
- Publication number 20170069595
- Publication date Mar 9, 2017
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS

the layer connector being disposed on at least two separate bonding areas

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device and method of providing the same

Display apparatus including a display panel with multiple pads

Semiconductor structure and method for forming thereof

Anisotropic conductive film and display device using the same

Die-to-wafer bonding structure and semiconductor package using the...

Composite semiconductor component having projecting elements projec...

Package structure and method of manufacturing the same

Semiconductor structure and method for forming thereof

Nanowire bonding interconnect for fine-pitch microelectronics

Die-to-wafer bonding structure and semiconductor package using the...

Display panel and display device

Semiconductor device packages and methods of manufacturing the same

Semiconductor devices with underfill control features, and associat...

Light emitting diode with pads on side surface thereof, light emitt...

Integrated multi-color light-emitting pixel arrays based devices by...

Anisotropic conductive film

Semiconductor devices with underfill control features, and associat...

Integrated multi-color light-emitting pixel arrays based devices by...

3D-joining of microelectronic components with conductively self-adj...

Anisotropic conductive film and display device using the same

Method and apparatus for routing die signals using external interco...

3D-joining of microelectronic components with conductively self-adj...

Anisotropic conductive material, electronic device including anisot...

Method for bonding metallic contact areas with solution of a sacrif...

Die backside standoff structures for semiconductor devices

Semiconductor chip, and semiconductor package and system each inclu...

Chip-to-chip multi-signaling communication system with common condu...

Die backside standoff structures for semiconductor devices

Semiconductor device using semiconductor chip

Patents Applicationslast 30 patents

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

DISPLAY MODULE INCLUDING BONDING MEMBER CONNECTING BETWEEN LIGHT EM...

DISPLAY APPARATUS

MICRO LIGHT EMITTING DIODE DISPLAY PANEL, MANUFACTURING METHOD THER...

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

DISPLAY MODULE AND DISPLAY APPARATUS HAVING THE SAME

BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...

ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE INCLUDING SAME

DISPLAY MODULE AND MANUFACTURING METHOD THEREFOR

NANOWIRE BONDING INTERCONNECT FOR FINE-PITCH MICROELECTRONICS

Display Panel, Display Device, and Manufacturing Method of Display...

DISPLAY DEVICE AND METHOD OF PROVIDING THE SAME

METHOD OF MANUFACTURING PACKAGE STRUCTURE

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THEREOF

Bonding Structures of Integrated Circuit Devices and Method Forming...

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THEREOF

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

DIE-TO-WAFER BONDING STRUCTURE AND SEMICONDUCTOR PACKAGE USING THE...

SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME

Composite Semiconductor Component and Method for Producing a Compos...

NANOWIRE BONDING INTERCONNECT FOR FINE-PITCH MICROELECTRONICS

SEMICONDUCTOR DEVICES WITH UNDERFILL CONTROL FEATURES, AND ASSOCIAT...

ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE USING THE SAME

CONNECTION COMPONENT, CONNECTOR, MANUFACTURING METHOD FOR THE SAME...

Adhesive with Self-Connecting Interconnects

SEMICONDUCTOR DEVICES WITH UNDERFILL CONTROL FEATURES, AND ASSOCIAT...

ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE USING THE SAME

DISPLAY DEVICE INCLUDING AN ANISOTROPIC CONDUCTIVE FILM, AND MANUFA...

3D-JOINING OF MICROELECTRONIC COMPONENTS WITH CONDUCTIVELY SELF-ADJ...