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the layer connector being offset with respect to the bonding area
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/29027
the layer connector being offset with respect to the bonding area
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Patents Grants
last 30 patents
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Patent Grant
Bonding structures of integrated circuit devices and method forming...
Patent number
12,132,016
Issue date
Oct 29, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Chen-Yu Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding structures of integrated circuit devices and method forming...
Patent number
11,990,430
Issue date
May 21, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Chen-Yu Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Nanowire bonding interconnect for fine-pitch microelectronics
Patent number
11,387,202
Issue date
Jul 12, 2022
Invensas LLC
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D-joining of microelectronic components with conductively self-adj...
Patent number
10,297,570
Issue date
May 21, 2019
Invensas Corporation
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with metal film and method for manufacturing s...
Patent number
10,157,865
Issue date
Dec 18, 2018
Mitsubishi Electric Corporation
Yosuke Nakata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for coating conductive substrate with adhesive
Patent number
10,056,534
Issue date
Aug 21, 2018
G-SMATT CO., LTD.
Hak Ryul Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D-joining of microelectronic components with conductively self-adj...
Patent number
9,871,014
Issue date
Jan 16, 2018
Invensas Corporation
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of stack-type semiconductor device
Patent number
7,405,138
Issue date
Jul 29, 2008
Oki Electric Industry Co., Ltd.
Shinji Ohuchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device, manufacturing method of semiconductor device,...
Patent number
7,019,397
Issue date
Mar 28, 2006
Oki Electric Industry Co., Ltd.
Shinji Ohuchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device using semiconductor chip
Patent number
7,002,185
Issue date
Feb 21, 2006
Rohm Co., Ltd.
Shinji Isokawa
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...
Publication number
20240371804
Publication date
Nov 7, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Yu Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIODE LAYER STACK FLIP-CHIP MOUNTED TO A LEADFRAME BY USE OF A COPP...
Publication number
20240162125
Publication date
May 16, 2024
Infineon Technologies Austria AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING STRUCTURE HAVING ORGANIC INTERPOSER LAYER AND METHOD FOR...
Publication number
20240063029
Publication date
Feb 22, 2024
SJ Semiconductor(Jiangyin) Corporation
Chengchung LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...
Publication number
20230387051
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Yu Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NANOWIRE BONDING INTERCONNECT FOR FINE-PITCH MICROELECTRONICS
Publication number
20230105341
Publication date
Apr 6, 2023
Invensas LLC
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Bonding Structures of Integrated Circuit Devices and Method Forming...
Publication number
20220238466
Publication date
Jul 28, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Yu Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NANOWIRE BONDING INTERCONNECT FOR FINE-PITCH MICROELECTRONICS
Publication number
20200279821
Publication date
Sep 3, 2020
Invensas Corporation
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Adhesive with Self-Connecting Interconnects
Publication number
20180130766
Publication date
May 10, 2018
Invensas Corporation
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D-JOINING OF MICROELECTRONIC COMPONENTS WITH CONDUCTIVELY SELF-ADJ...
Publication number
20170069595
Publication date
Mar 9, 2017
Invensas Corporation
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR COATING CONDUCTIVE SUBSTRATE WITH ADHESIVE
Publication number
20160284958
Publication date
Sep 29, 2016
G-SMATT CO., LTD.
Hak Ryul SHIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20160005703
Publication date
Jan 7, 2016
Mitsubishi Electric Corporation
Yosuke NAKATA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Manufacturing method of stack-type semiconductor device
Publication number
20060046436
Publication date
Mar 2, 2006
Shinji Ohuchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device using semiconductor chip
Publication number
20050242424
Publication date
Nov 3, 2005
Rohm Co., Ltd.
Shinji Isokawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device, manufacturing method of semiconductor device,...
Publication number
20020047199
Publication date
Apr 25, 2002
Shinji Ohuchi
H01 - BASIC ELECTRIC ELEMENTS