the layer connector being smaller than the bonding area

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CPC
H01L2224/32014

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/32014the layer connector being smaller than the bonding area

Industries

Patents Grantslast 30 patents

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Gas sensor packages
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Memory devices with controllers under memory packages and associate...
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Package structure
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- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
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- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE ASSEMBLY SUBSTRATES WITH TUNNELED INTERCONNECT...
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LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
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POWER MODULE AND RELATED METHODS
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- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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- H01 - BASIC ELECTRIC ELEMENTS

the layer connector being smaller than the bonding area

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device including connection pad part and electronic compone...

Light emitting diode display with redundancy scheme

Fault tolerant memory systems and components with interconnected an...

Memory devices with controllers under memory packages and associate...

Semiconductor package

Power module and related methods

Semiconductor device and method for manufacturing the same

Method for fabricating package structure having encapsulate sensing...

Light emitting diode display with redundancy scheme

Package structure

Fault tolerant memory systems and components with interconnected an...

Method of manufacturing a semiconductor device

Light emitting diode display with redundancy scheme

Semiconductor package

Package structure and method for fabricating the same

Semiconductor device and method of manufacturing the same

Semiconductor chip, semiconductor device, and electronic device

Semiconductor device including a pad and a wiring line arranged for...

Electronic device

Gas sensor packages

Memory devices with controllers under memory packages and associate...

Package structure

Thermal and stress isolation for precision circuit

On-bonder automatic overhang die optimization tool for wire bonding...

Molding system with movable mold tool

Vibrator device, oscillator, electronic device, and vehicle

Memory packages and related semiconductor packages

Wafer bonding methods and wafer-bonded structures

Antenna-in-package structures with broadside and end-fire radiations

Light emitting diode display with redundancy scheme

Patents Applicationslast 30 patents

Method for Packaging Stacking Flip Chip

SEMICONDUCTOR DEVICE ASSEMBLY SUBSTRATES WITH TUNNELED INTERCONNECT...

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

FAULT TOLERANT MEMORY SYSTEMS AND COMPONENTS WITH INTERCONNECTED AN...

SEMICONDUCTOR DEVICE

POWER MODULE AND RELATED METHODS

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor Package

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THEREOF

POWER MODULE AND RELATED METHODS

FAULT TOLERANT MEMORY SYSTEMS AND COMPONENTS WITH INTERCONNECTED AN...

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

Semiconductor Package

METHOD FOR FABRICATING PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER...

Semiconductor Package

THERMAL AND STRESS ISOLATION FOR PRECISION CIRCUIT

ELECTRONIC DEVICE

FAULT TOLERANT MEMORY SYSTEMS AND COMPONENTS WITH INTERCONNECTED AN...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

ON-BONDER AUTOMATIC OVERHANG DIE OPTIMIZATION TOOL FOR WIRE BONDING...

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

WAFER BONDING METHODS AND WAFER-BONDED STRUCTURES

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

ANTENNA-IN-PACKAGE STRUCTURES WITH BROADSIDE AND END-FIRE RADIATIONS

PACKAGE STRUCTURE

ELECTRONIC COMPONENT AND MANUFACTURING METHOD FOR ELECTRONIC COMPONENT