the layer connector being supplied to the parts to be connected in the bonding apparatus

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/831the layer connector being supplied to the parts to be connected in the bonding apparatus

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing display device using semiconductor light em...
- Patent number 12,328,979
- Issue date Jun 10, 2025
- LG Electronics Inc.
- Mihee Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 12,322,705
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposit levelling
- Patent number 12,319,049
- Issue date Jun 3, 2025
- ASMPT SMT SINGAPORE PTE. LTD.
- Mark Alfred Whitmore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attached leveling control by metal stopper bumps
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- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
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- Issue date May 20, 2025
- Tokyo Electron Limited
- Tetsuya Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing display device and apparatus for manufactu...
- Patent number 12,308,259
- Issue date May 20, 2025
- Samsung Display Co., Ltd.
- Dong Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including semiconductor chip having power tran...
- Patent number 12,308,356
- Issue date May 20, 2025
- Renesas Electronics Corporation
- Toshiyuki Hata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method and molding press machine
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- Issue date May 20, 2025
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- Kiyohiro Uchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device, manufacturing method thereof and display mod...
- Patent number 12,300,772
- Issue date May 13, 2025
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- Min-Hsun Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device having connection unit
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- Issue date May 13, 2025
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- Myongsoo Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method for package structure
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- Issue date May 13, 2025
- University of Electronic Science and Technology of China
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a bonded semiconductor structure
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- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
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- Issue date May 6, 2025
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- Chen-Hua Yu
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Information Patent Grant
Method for packaging stacking flip chip
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- Issue date May 6, 2025
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- Honglei Ran
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Information Patent Grant
Semiconductor device and method for manufacturing the same
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- Motoharu Haga
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Information Patent Grant
Method of manufacturing laminate
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- Isao Ichikawa
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Information Patent Grant
Methods of operating die attach systems
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- Issue date Apr 29, 2025
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- Alain De Bock
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Information Patent Grant
Semiconductor packages
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- Bilge Bayrakci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
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- Issue date Apr 22, 2025
- United Microelectronics Corp.
- Yu Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive member, display device, and manufacturing method of displa...
- Patent number 12,272,667
- Issue date Apr 8, 2025
- Samsung Display Co., Ltd.
- Jung Hoon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding method
- Patent number 12,266,623
- Issue date Apr 1, 2025
- SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD
- Yunzhi Ling
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Information Patent Grant
Full-color LED display using ultra-thin LED element and method for...
- Patent number 12,266,740
- Issue date Apr 1, 2025
- Kookmin University Industry Academy Cooperation Foundation
- Young Rag Do
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Information Patent Grant
Package process and package structure
- Patent number 12,266,632
- Issue date Apr 1, 2025
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- Chi-Chih Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with multi-layer contact and system
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- Alexander Heinrich
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Information Patent Grant
Display device and method of manufacturing the same
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Information Patent Grant
Packaged electronic device with film isolated power stack
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- Tianyi Luo
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Information Patent Grant
Integrated circuit package and method of forming same
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- Issue date Mar 4, 2025
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- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
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- Issue date Mar 4, 2025
- Samsung Display Co., Ltd.
- Byoungyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with bridge chiplets
- Patent number 12,238,872
- Issue date Feb 25, 2025
- Advanced Micro Devices, Inc.
- Robert N. McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro LED display and manufacturing method therefor
- Patent number 12,218,295
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Byunghoon Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE
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- Publication date Jun 12, 2025
- TRON FUTURE TECH INC.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250183224
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- JIN-WOO PARK
- H01 - BASIC ELECTRIC ELEMENTS
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MICRO LED ARRAY ELECTRONIC DEVICE AND ITS TRANSFER METHOD
- Publication number 20250176343
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- Seoul National University R&DB Foundation
- Yong Taek HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20250176105
- Publication date May 29, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20250167159
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER TRANSFER OF MICROELECTRONIC DEVICE AND ASSOCIATED CONDUCTIVE PAD
- Publication number 20250167170
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- COHERENT LASERSYSTEMS GMBH & CO. KG
- Muhammad FATAHILAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Integration of Passive Devices
- Publication number 20250167176
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- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH
- Publication number 20250157985
- Publication date May 15, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20250157975
- Publication date May 15, 2025
- NITTO DENKO CORPORATION
- Tsubasa OMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250149518
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Yejin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Semiconductor Package w...
- Publication number 20250151421
- Publication date May 8, 2025
- UTAC Headquarters Pte. Ltd.
- Jeffrey Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
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POSITION ALIGNMENT DEVICE, POSITION ALIGNMENT METHOD, BONDING DEVIC...
- Publication number 20250149498
- Publication date May 8, 2025
- CANON MACHINERY INC.
- Shinya KAWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENGINEERING EPI STACKS FOR EXTREME WAFER THINNING
- Publication number 20250132163
- Publication date Apr 24, 2025
- Applied Materials, Inc.
- Raghuveer Satya MAKALA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND A METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20250132220
- Publication date Apr 24, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Dong Hyeon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR FLIP CHIP PACKAGING
- Publication number 20250132288
- Publication date Apr 24, 2025
- YIN-JUI SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR ASSEMBLIES
- Publication number 20250132289
- Publication date Apr 24, 2025
- NEXPERIA B.V.
- Antonio B. Dimaano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250132214
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE SEMICONDUCTORS PACKAGES
- Publication number 20250126909
- Publication date Apr 17, 2025
- UTAC Headquarters Pte. Ltd.
- Il Kwon SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging electronic device with liquid thermal interface material
- Publication number 20250118618
- Publication date Apr 10, 2025
- Marvell Asia Pte Ltd.
- Janak Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-CAVITY EPOXY PLACEMENT FOR PACKAGE RELIABILITY
- Publication number 20250112198
- Publication date Apr 3, 2025
- Intel Corporation
- Pratyasha Mohapatra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE CONNECTIONS FOR INTERCONNECT BRIDGES AND REL...
- Publication number 20250112165
- Publication date Apr 3, 2025
- Intel Corporation
- Brandon Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF THERMAL MANAGEMENT DIES
- Publication number 20250112196
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- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE HAVING HEAT DISSIPATION STRUCTURE AND MANUFACTURING ME...
- Publication number 20250105087
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Chunyan RUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOTSPOT-FREE SEMICONDUCTOR DEVICE CHIPS
- Publication number 20250105089
- Publication date Mar 27, 2025
- Diamond Foundry Inc.
- Jeroen Van Duren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250107298
- Publication date Mar 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Hsin-Ying HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURI...
- Publication number 20250096183
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- Renesas Electronics America Inc.
- Martin Ashley VAGUES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST PACKAGE WARPAGE SOLUTION
- Publication number 20250096009
- Publication date Mar 20, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAM LAMINATE ISOLATION SUBSTRATE
- Publication number 20250096034
- Publication date Mar 20, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Chang-Yen KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SURFACE MODIFICATION FOR WAFER BONDING
- Publication number 20250087628
- Publication date Mar 13, 2025
- TOKYO ELECTRON LIMITED
- Soo Doo CHAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20250087549
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- Amkor Technology Singapore Holding Pte. Ltd.
- Yu Jin JEON
- H01 - BASIC ELECTRIC ELEMENTS

the layer connector being supplied to the parts to be connected in the bonding apparatus

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing display device using semiconductor light em...

Chip package and manufacturing method thereof

Deposit levelling

Die attached leveling control by metal stopper bumps

Bonding apparatus and bonding method

Method for manufacturing display device and apparatus for manufactu...

Semiconductor device including semiconductor chip having power tran...

Semiconductor device manufacturing method and molding press machine

Light-emitting device, manufacturing method thereof and display mod...

Display device having connection unit

Fabrication method for package structure

Method of forming a bonded semiconductor structure

Semiconductor packages and methods of forming same

Method for packaging stacking flip chip

Semiconductor device and method for manufacturing the same

Method of manufacturing laminate

Methods of operating die attach systems

Semiconductor packages

Method for manufacturing semiconductor device

Adhesive member, display device, and manufacturing method of displa...

Substrate bonding method

Full-color LED display using ultra-thin LED element and method for...

Package process and package structure

Electronic device with multi-layer contact and system

Display device and method of manufacturing the same

Packaged electronic device with film isolated power stack

Integrated circuit package and method of forming same

Display device and method of manufacturing the same

Circuit board with bridge chiplets

Micro LED display and manufacturing method therefor

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

MICRO LED ARRAY ELECTRONIC DEVICE AND ITS TRANSFER METHOD

SELECTIVE TRANSFER OF MICRO DEVICES

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

LASER TRANSFER OF MICROELECTRONIC DEVICE AND ASSOCIATED CONDUCTIVE PAD

Wafer Level Integration of Passive Devices

SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

Semiconductor Device and Method of Making a Semiconductor Package w...

POSITION ALIGNMENT DEVICE, POSITION ALIGNMENT METHOD, BONDING DEVIC...

ENGINEERING EPI STACKS FOR EXTREME WAFER THINNING

ELECTRONIC DEVICES AND A METHODS OF MANUFACTURING ELECTRONIC DEVICES

PROCESS FOR FLIP CHIP PACKAGING

METHOD OF MANUFACTURING SEMICONDUCTOR ASSEMBLIES

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

RELIABLE SEMICONDUCTORS PACKAGES

Packaging electronic device with liquid thermal interface material

IN-CAVITY EPOXY PLACEMENT FOR PACKAGE RELIABILITY

ANISOTROPIC CONDUCTIVE CONNECTIONS FOR INTERCONNECT BRIDGES AND REL...

SELECTIVE TRANSFER OF THERMAL MANAGEMENT DIES

CHIP PACKAGE HAVING HEAT DISSIPATION STRUCTURE AND MANUFACTURING ME...

HOTSPOT-FREE SEMICONDUCTOR DEVICE CHIPS

PACKAGE STRUCTURE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURI...

LOW COST PACKAGE WARPAGE SOLUTION

DAM LAMINATE ISOLATION SUBSTRATE

METHOD OF SURFACE MODIFICATION FOR WAFER BONDING

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES