the layer connector connecting between different semiconductor or solid-state bodies

Industry

CPC
H01L2224/32135

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/32135the layer connector connecting between different semiconductor or solid-state bodies

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with integrated heat distribution and manufact...
- Patent number 11,901,343
- Issue date Feb 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive coupling in a direct-bonded interface for microelectroni...
- Patent number 11,495,579
- Issue date Nov 8, 2022
- Invensas LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus and electronic device
- Patent number 11,226,522
- Issue date Jan 18, 2022
- Samsung Display Co., Ltd.
- Sukho Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including routing dies and methods of formin...
- Patent number 11,177,201
- Issue date Nov 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with integrated heat distribution and manufact...
- Patent number 10,985,146
- Issue date Apr 20, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding package components through plating
- Patent number 10,840,212
- Issue date Nov 17, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive coupling in a direct-bonded interface for microelectroni...
- Patent number 10,811,388
- Issue date Oct 20, 2020
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrathin layer for forming a capacitive interface between joined i...
- Patent number 10,600,760
- Issue date Mar 24, 2020
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus and electronic device
- Patent number 10,488,720
- Issue date Nov 26, 2019
- Samsung Display Co., Ltd.
- Sukho Choi
- G02 - OPTICS
Information Patent Grant
Bonding package components through plating
- Patent number 10,483,230
- Issue date Nov 19, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with integrated heat distribution and manufact...
- Patent number 10,410,999
- Issue date Sep 10, 2019
- Amkor Technology, Inc.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrathin layer for forming a capacitive interface between joined i...
- Patent number 10,032,751
- Issue date Jul 24, 2018
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked-die including a die in a package substrate
- Patent number 10,008,475
- Issue date Jun 26, 2018
- Intel Corporation
- Chia-Pin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding substrates
- Patent number 9,929,124
- Issue date Mar 27, 2018
- EV Group E. Thallner GmbH
- Jurgen Burggraf
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor module
- Patent number 9,704,828
- Issue date Jul 11, 2017
- Shindengen Electric Manufacturing Co., Ltd.
- Kosuke Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding package components through plating
- Patent number 9,691,738
- Issue date Jun 27, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device connected by anisotropic conductive adhesive film
- Patent number 9,437,346
- Issue date Sep 6, 2016
- Cheil Industries, Inc.
- Kyoung Hun Shin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Multi-chip packaging structure and method
- Patent number 9,129,947
- Issue date Sep 8, 2015
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for reducing inductance in through-die vias of an electr...
- Patent number 9,099,475
- Issue date Aug 4, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Michael B. McShane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced interconnect substrate with embedded semiconduct...
- Patent number 9,087,847
- Issue date Jul 21, 2015
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip wafer level package and methods thereof
- Patent number 8,729,714
- Issue date May 20, 2014
- Intel Mobile Communications GmbH
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming stacked die package using redistributed chip pack...
- Patent number 8,669,140
- Issue date Mar 11, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Kesvakumar V. C. Muniandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density chip stacked package, package-on-package and method of...
- Patent number 8,664,757
- Issue date Mar 4, 2014
- Samsung Electronics Co., Ltd.
- Yun-Rae Cho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH INTEGRATED HEAT DISTRIBUTION AND MANUFACT...
- Publication number 20240290761
- Publication date Aug 29, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE COUPLING IN A DIRECT-BONDED INTERFACE FOR MICROELECTRONI...
- Publication number 20230040454
- Publication date Feb 9, 2023
- Invensas LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTEGRATED HEAT DISTRIBUTION AND MANUFACT...
- Publication number 20210257346
- Publication date Aug 19, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE COUPLING IN A DIRECT-BONDED INTERFACE FOR MICROELECTRONI...
- Publication number 20210035954
- Publication date Feb 4, 2021
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS AND ELECTRONIC DEVICE
- Publication number 20200050043
- Publication date Feb 13, 2020
- SAMSUNG DISPLAY CO., LTD.
- Sukho CHOI
- G02 - OPTICS
Information Patent Application
Bonding Package Components Through Plating
- Publication number 20200020662
- Publication date Jan 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTEGRATED HEAT DISTRIBUTION AND MANUFACT...
- Publication number 20200006300
- Publication date Jan 2, 2020
- Amkor Technology, Inc.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE COUPLING IN A DIRECT-BONDED INTERFACE FOR MICROELECTRONI...
- Publication number 20190115323
- Publication date Apr 18, 2019
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultrathin Layer for Forming a Capacitive Interface Between Joined I...
- Publication number 20180366446
- Publication date Dec 20, 2018
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS AND ELECTRONIC DEVICE
- Publication number 20170256583
- Publication date Sep 7, 2017
- SAMSUNG DISPLAY CO., LTD.
- Sukho CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitive Coupling of Integrated Circuit Die Components
- Publication number 20170092620
- Publication date Mar 30, 2017
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING-TAPE-INTEGRATED ADHESIVE SHEET, SEMICONDUCTOR DEVICE, MULTIL...
- Publication number 20140205816
- Publication date Jul 24, 2014
- SUMITOMO BAKELITE CO., LTD.
- Kenzo Maejima
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FLIP-CHIP WAFER LEVEL PACKAGE AND METHODS THEREOF
- Publication number 20140206142
- Publication date Jul 24, 2014
- Thorsten MEYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE CONNECTED BY ANISOTROPIC CONDUCTIVE ADHESIVE FILM
- Publication number 20140097548
- Publication date Apr 10, 2014
- Kyoung Hun SHIN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
STACKED-DIE PACKAGE INCLUDING DIE IN PACKAGE SUBSTRATE
- Publication number 20140084441
- Publication date Mar 27, 2014
- Chia-Pin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGING STRUCTURE AND METHOD
- Publication number 20140070390
- Publication date Mar 13, 2014
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR REDUCING INDUCTANCE IN THROUGH-DIE VIAS OF AN ELECTR...
- Publication number 20140071652
- Publication date Mar 13, 2014
- FREESCALE SEMICONDUCTOR, INC.
- MICHAEL B. MCSHANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED INTERCONNECT SUBSTRATE WITH EMBEDDED SEMICONDUCT...
- Publication number 20140048949
- Publication date Feb 20, 2014
- Bridge Semiconductor Corporation
- Charles W.C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY CHIP STACKED PACKAGE, PACKAGE-ON-PACKAGE AND METHOD OF...
- Publication number 20120007227
- Publication date Jan 12, 2012
- Samsung Electronics Co., Ltd.
- Yun-Rae CHO
- H01 - BASIC ELECTRIC ELEMENTS

the layer connector connecting between different semiconductor or solid-state bodies

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with integrated heat distribution and manufact...

Capacitive coupling in a direct-bonded interface for microelectroni...

Display apparatus and electronic device

Semiconductor packages including routing dies and methods of formin...

Semiconductor device with integrated heat distribution and manufact...

Bonding package components through plating

Capacitive coupling in a direct-bonded interface for microelectroni...

Ultrathin layer for forming a capacitive interface between joined i...

Display apparatus and electronic device

Bonding package components through plating

Semiconductor device with integrated heat distribution and manufact...

Ultrathin layer for forming a capacitive interface between joined i...

Stacked-die including a die in a package substrate

Method for bonding substrates

Semiconductor module

Bonding package components through plating

Semiconductor device connected by anisotropic conductive adhesive film

Multi-chip packaging structure and method

Techniques for reducing inductance in through-die vias of an electr...

Thermally enhanced interconnect substrate with embedded semiconduct...

Flip-chip wafer level package and methods thereof

Method of forming stacked die package using redistributed chip pack...

High density chip stacked package, package-on-package and method of...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH INTEGRATED HEAT DISTRIBUTION AND MANUFACT...

CAPACITIVE COUPLING IN A DIRECT-BONDED INTERFACE FOR MICROELECTRONI...

SEMICONDUCTOR DEVICE WITH INTEGRATED HEAT DISTRIBUTION AND MANUFACT...

CAPACITIVE COUPLING IN A DIRECT-BONDED INTERFACE FOR MICROELECTRONI...

DISPLAY APPARATUS AND ELECTRONIC DEVICE

Bonding Package Components Through Plating

SEMICONDUCTOR DEVICE WITH INTEGRATED HEAT DISTRIBUTION AND MANUFACT...

CAPACITIVE COUPLING IN A DIRECT-BONDED INTERFACE FOR MICROELECTRONI...

Ultrathin Layer for Forming a Capacitive Interface Between Joined I...

DISPLAY APPARATUS AND ELECTRONIC DEVICE

Capacitive Coupling of Integrated Circuit Die Components

DICING-TAPE-INTEGRATED ADHESIVE SHEET, SEMICONDUCTOR DEVICE, MULTIL...

FLIP-CHIP WAFER LEVEL PACKAGE AND METHODS THEREOF

SEMICONDUCTOR DEVICE CONNECTED BY ANISOTROPIC CONDUCTIVE ADHESIVE FILM

STACKED-DIE PACKAGE INCLUDING DIE IN PACKAGE SUBSTRATE

MULTI-CHIP PACKAGING STRUCTURE AND METHOD

TECHNIQUES FOR REDUCING INDUCTANCE IN THROUGH-DIE VIAS OF AN ELECTR...

THERMALLY ENHANCED INTERCONNECT SUBSTRATE WITH EMBEDDED SEMICONDUCT...

HIGH DENSITY CHIP STACKED PACKAGE, PACKAGE-ON-PACKAGE AND METHOD OF...