the layer connector connecting bonding areas being not aligned with respect to each other

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H01L2224/32105

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/32105the layer connector connecting bonding areas being not aligned with respect to each other

Industries

Patents Grantslast 30 patents

Information Patent Grant
Display device including connection pad part and electronic compone...
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- Issue date Aug 6, 2024
- Samsung Display Co., Ltd.
- Jungyun Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of pre-channeled materials for anisotropic conductors
- Patent number 12,051,670
- Issue date Jul 30, 2024
- Micron Technology, Inc.
- Mark E. Tuttle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
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- Issue date Sep 26, 2023
- Kioxia Corporation
- Genki Sawada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic-component-embedded substrate and method of making the same
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- Issue date Aug 22, 2023
- Shinko Electric Industries Co., Ltd.
- Yoichi Nishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bond tips and related apparatus and methods
- Patent number 11,705,425
- Issue date Jul 18, 2023
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame-based semiconductor package
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- Issue date Oct 11, 2022
- Infineon Technologies AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,348,900
- Issue date May 31, 2022
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including fan-out lines
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- Issue date May 24, 2022
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- Chun-Hsien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with reduced thermal resistance
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- Issue date Feb 15, 2022
- Nissan Motor Co., Ltd.
- Kenta Emori
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device having a device fixed on a substrate with an a...
- Patent number 11,233,029
- Issue date Jan 25, 2022
- Mitsubishi Electric Corporation
- Kazuo Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of pre-channeled materials for anisotropic conductors
- Patent number 11,139,262
- Issue date Oct 5, 2021
- Micron Technology, Inc.
- Mark E. Tuttle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bond tips and related apparatus and methods
- Patent number 11,024,595
- Issue date Jun 1, 2021
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 10,910,523
- Issue date Feb 2, 2021
- Genesis Photonics Inc.
- Cheng-Wei Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip parts and method for manufacturing the same, circuit assembly...
- Patent number 10,867,945
- Issue date Dec 15, 2020
- Rohm Co., Ltd.
- Hiroki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and mounting structure of the same
- Patent number 10,790,258
- Issue date Sep 29, 2020
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 10,747,038
- Issue date Aug 18, 2020
- Samsung Display Co., Ltd.
- Hae-Kwan Seo
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor device with plated lead frame
- Patent number 10,748,787
- Issue date Aug 18, 2020
- Infineon Technologies AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 10,727,202
- Issue date Jul 28, 2020
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 10,663,816
- Issue date May 26, 2020
- LG Display Co., Ltd.
- WonJun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit module and method of forming same
- Patent number 10,636,768
- Issue date Apr 28, 2020
- Starkey Laboratories, Inc.
- Sayed Kaysarbin Rahim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Scalable package architecture and associated techniques and configu...
- Patent number 10,580,758
- Issue date Mar 3, 2020
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip parts and method for manufacturing the same, circuit assembly...
- Patent number 10,468,362
- Issue date Nov 5, 2019
- Rohm Co., Ltd.
- Hiroki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach methods and semiconductor devices manufactured based on...
- Patent number 10,396,015
- Issue date Aug 27, 2019
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer stacking for integrated circuit manufacturing
- Patent number 10,361,140
- Issue date Jul 23, 2019
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
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- Issue date Jun 4, 2019
- LG Display Co., Ltd.
- WonJun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D-joining of microelectronic components with conductively self-adj...
- Patent number 10,297,570
- Issue date May 21, 2019
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 10,297,568
- Issue date May 21, 2019
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and mounting structure of the same
- Patent number 10,192,845
- Issue date Jan 29, 2019
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,170,394
- Issue date Jan 1, 2019
- Fuji Electric Co., Ltd.
- Kousuke Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier and method thereof
- Patent number 10,163,820
- Issue date Dec 25, 2018
- Infineon Technologies AG
- Frank Pueschner
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
USE OF PRE-CHANNELED MATERIALS FOR ANISOTROPIC CONDUCTORS
- Publication number 20240387441
- Publication date Nov 21, 2024
- Micron Technology, Inc.
- Mark E. Tuttle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES, AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME
- Publication number 20240347498
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Daesik MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20220216177
- Publication date Jul 7, 2022
- JUNGYUN JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220189905
- Publication date Jun 16, 2022
- KIOXIA Corporation
- Genki SAWADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME-BASED SEMICONDUCTOR PACKAGE
- Publication number 20220068773
- Publication date Mar 3, 2022
- INFINEON TECHNOLOGIES AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20210280567
- Publication date Sep 9, 2021
- InnoLux Corporation
- Chun-Hsien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BOND TIPS AND RELATED APPARATUS AND METHODS
- Publication number 20210233887
- Publication date Jul 29, 2021
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210183823
- Publication date Jun 17, 2021
- NISSAN MOTOR CO., LTD.
- Kenta EMORI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Use of Pre-Channeled Materials for Anisotropic Conductors
- Publication number 20200258859
- Publication date Aug 13, 2020
- Micron Technology, Inc.
- Mark E. Tuttle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PARTS AND METHOD FOR MANUFACTURING THE SAME, CIRCUIT ASSEMBLY...
- Publication number 20200013737
- Publication date Jan 9, 2020
- Rohm Co., Ltd.
- Hiroki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Attach Methods and Semiconductor Devices Manufactured based on...
- Publication number 20190348347
- Publication date Nov 14, 2019
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STACKING FOR INTEGRATED CIRCUIT MANUFACTURING
- Publication number 20190326190
- Publication date Oct 24, 2019
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Massively parallel transfer of microLED devices
- Publication number 20180190614
- Publication date Jul 5, 2018
- Ananda H. Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesive with Self-Connecting Interconnects
- Publication number 20180130766
- Publication date May 10, 2018
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PARTS AND METHOD FOR MANUFACTURING THE SAME, CIRCUIT ASSEMBLY...
- Publication number 20180108628
- Publication date Apr 19, 2018
- Rohm Co., Ltd.
- Hiroki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Plated Lead Frame
- Publication number 20180061671
- Publication date Mar 1, 2018
- INFINEON TECHNOLOGIES AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP CARRIER AND METHOD THEREOF
- Publication number 20180040573
- Publication date Feb 8, 2018
- INFINEON TECHNOLOGIES AG
- FRANK PUESCHNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCALABLE PACKAGE ARCHITECTURE AND ASSOCIATED TECHNIQUES AND CONFIGU...
- Publication number 20180005997
- Publication date Jan 4, 2018
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20170372907
- Publication date Dec 28, 2017
- Renesas Electronics Corporation
- Tomoya Kashiwazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING PACKAGE STRUCTURE WITH AN EMBEDDED ELECTRONIC...
- Publication number 20170352615
- Publication date Dec 7, 2017
- Siliconware Precision Industries Co., Ltd.
- Shih-Chao Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D-JOINING OF MICROELECTRONIC COMPONENTS WITH CONDUCTIVELY SELF-ADJ...
- Publication number 20170069595
- Publication date Mar 9, 2017
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20170062388
- Publication date Mar 2, 2017
- MEDIATEK INC.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Display Device and Method of Manufacturing the Same
- Publication number 20160377905
- Publication date Dec 29, 2016
- LG Display Co., Ltd.
- WonJun CHOI
- G02 - OPTICS
Information Patent Application
Semiconductor Device and Manufacturing Method Thereof
- Publication number 20140252576
- Publication date Sep 11, 2014
- Hitachi, Ltd
- Hisashi Tanie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED STRESS TSV AND INTERPOSER STRUCTURES
- Publication number 20140217607
- Publication date Aug 7, 2014
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS AND A METHOD FOR MANUFACTURING AN INTEGRATED CI...
- Publication number 20140061878
- Publication date Mar 6, 2014
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED STRESS TSV AND INTERPOSER STRUCTURES
- Publication number 20130328186
- Publication date Dec 12, 2013
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCRETE SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD
- Publication number 20130320551
- Publication date Dec 5, 2013
- NXP B.V.
- Tim BOETTCHER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BONDING MATERIAL, METHOD OF MANUFACTURING THE SAME, AND...
- Publication number 20130313309
- Publication date Nov 28, 2013
- Masayuki KITAJIMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING DEVICE CHIP SCALE PACKAGE
- Publication number 20130292716
- Publication date Nov 7, 2013
- Koninklijke Philips N.V.
- Daniel Alexander Steigerwald
- H01 - BASIC ELECTRIC ELEMENTS

the layer connector connecting bonding areas being not aligned with respect to each other

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device including connection pad part and electronic compone...

Use of pre-channeled materials for anisotropic conductors

Semiconductor device and method of manufacturing the same

Electronic-component-embedded substrate and method of making the same

Thermocompression bond tips and related apparatus and methods

Lead frame-based semiconductor package

Package structure

Display device including fan-out lines

Semiconductor device with reduced thermal resistance

Semiconductor device having a device fixed on a substrate with an a...

Use of pre-channeled materials for anisotropic conductors

Thermocompression bond tips and related apparatus and methods

Light emitting device

Chip parts and method for manufacturing the same, circuit assembly...

Electronic device and mounting structure of the same

Display device

Semiconductor device with plated lead frame

Package structure

Display device and method of manufacturing the same

Integrated circuit module and method of forming same

Scalable package architecture and associated techniques and configu...

Chip parts and method for manufacturing the same, circuit assembly...

Die attach methods and semiconductor devices manufactured based on...

Wafer stacking for integrated circuit manufacturing

Display device and method of manufacturing the same

3D-joining of microelectronic components with conductively self-adj...

Systems and methods for bonding semiconductor elements

Electronic device and mounting structure of the same

Semiconductor device

Chip carrier and method thereof

Patents Applicationslast 30 patents

USE OF PRE-CHANNELED MATERIALS FOR ANISOTROPIC CONDUCTORS

MEMORY DEVICES, AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

LEAD FRAME-BASED SEMICONDUCTOR PACKAGE

DISPLAY DEVICE

THERMOCOMPRESSION BOND TIPS AND RELATED APPARATUS AND METHODS

SEMICONDUCTOR DEVICE

Use of Pre-Channeled Materials for Anisotropic Conductors

CHIP PARTS AND METHOD FOR MANUFACTURING THE SAME, CIRCUIT ASSEMBLY...

Die Attach Methods and Semiconductor Devices Manufactured based on...

WAFER STACKING FOR INTEGRATED CIRCUIT MANUFACTURING

Massively parallel transfer of microLED devices

Adhesive with Self-Connecting Interconnects

CHIP PARTS AND METHOD FOR MANUFACTURING THE SAME, CIRCUIT ASSEMBLY...

Semiconductor Device with Plated Lead Frame

CHIP CARRIER AND METHOD THEREOF

SCALABLE PACKAGE ARCHITECTURE AND ASSOCIATED TECHNIQUES AND CONFIGU...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

METHOD OF FABRICATING PACKAGE STRUCTURE WITH AN EMBEDDED ELECTRONIC...

3D-JOINING OF MICROELECTRONIC COMPONENTS WITH CONDUCTIVELY SELF-ADJ...

PACKAGE STRUCTURE

Display Device and Method of Manufacturing the Same

Semiconductor Device and Manufacturing Method Thereof

REDUCED STRESS TSV AND INTERPOSER STRUCTURES

INTEGRATED CIRCUITS AND A METHOD FOR MANUFACTURING AN INTEGRATED CI...

REDUCED STRESS TSV AND INTERPOSER STRUCTURES

DISCRETE SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD

CONDUCTIVE BONDING MATERIAL, METHOD OF MANUFACTURING THE SAME, AND...

LIGHT EMITTING DEVICE CHIP SCALE PACKAGE