the layer connector connecting one bonding area to at least two respective bonding areas

Industry

CPC
H01L2224/32106

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/32106the layer connector connecting one bonding area to at least two respective bonding areas

Industries

Patents Grantslast 30 patents

Information Patent Grant
Thermocompression bond tips and related apparatus and methods
- Patent number 11,705,425
- Issue date Jul 18, 2023
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package with bridge layer
- Patent number 11,476,125
- Issue date Oct 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with reduced thermal resistance
- Patent number 11,251,162
- Issue date Feb 15, 2022
- Nissan Motor Co., Ltd.
- Kenta Emori
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Display panel and display device
- Patent number 11,239,202
- Issue date Feb 1, 2022
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Jing Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a device fixed on a substrate with an a...
- Patent number 11,233,029
- Issue date Jan 25, 2022
- Mitsubishi Electric Corporation
- Kazuo Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bond tips and related apparatus and methods
- Patent number 11,024,595
- Issue date Jun 1, 2021
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory and manufacturing method thereof
- Patent number 11,011,505
- Issue date May 18, 2021
- TOSHIBA MEMORY CORPORATION
- Poho Tam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 10,910,523
- Issue date Feb 2, 2021
- Genesis Photonics Inc.
- Cheng-Wei Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package assembly and method for forming the same
- Patent number 10,903,198
- Issue date Jan 26, 2021
- Mediatek Inc.
- Chia-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and mounting structure of the same
- Patent number 10,790,258
- Issue date Sep 29, 2020
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 10,747,038
- Issue date Aug 18, 2020
- Samsung Display Co., Ltd.
- Hae-Kwan Seo
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Methods for making multi-die package with bridge layer
- Patent number 10,643,861
- Issue date May 5, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit module and method of forming same
- Patent number 10,636,768
- Issue date Apr 28, 2020
- Starkey Laboratories, Inc.
- Sayed Kaysarbin Rahim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Multi-layer leadless semiconductor package and method of manufactur...
- Patent number 10,573,590
- Issue date Feb 25, 2020
- UTAC HEADQUARTERS PTE. LTD.
- Antonio Bambalan Dimaano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package assembly and method for forming the same
- Patent number 10,497,689
- Issue date Dec 3, 2019
- Mediatek Inc.
- Chia-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach methods and semiconductor devices manufactured based on...
- Patent number 10,396,015
- Issue date Aug 27, 2019
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer stacking for integrated circuit manufacturing
- Patent number 10,361,140
- Issue date Jul 23, 2019
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,325,120
- Issue date Jun 18, 2019
- NXP B.V.
- Thomas Suwald
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 10,297,568
- Issue date May 21, 2019
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and mounting structure of the same
- Patent number 10,192,845
- Issue date Jan 29, 2019
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,170,394
- Issue date Jan 1, 2019
- Fuji Electric Co., Ltd.
- Kousuke Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating package structure with an embedded electronic...
- Patent number 10,002,825
- Issue date Jun 19, 2018
- Siliconware Precision Industries Co., Ltd.
- Shih-Chao Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and mounting structure of the same
- Patent number 9,941,233
- Issue date Apr 10, 2018
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated millimeter-wave chip package
- Patent number 9,941,226
- Issue date Apr 10, 2018
- Industrial Technology Research Institute
- Cheng-Hua Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assemblies with rigid layers used for protection...
- Patent number 9,824,974
- Issue date Nov 21, 2017
- Invensas Corporation
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate
- Patent number 9,818,681
- Issue date Nov 14, 2017
- Shinko Electric Industries Co., Ltd.
- Yoshihiro Machida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 9,805,937
- Issue date Oct 31, 2017
- Renesas Electronics Corporation
- Tomoya Kashiwazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with an embedded electronic component and method...
- Patent number 9,716,060
- Issue date Jul 25, 2017
- Siliconware Precision Industries Co., Ltd.
- Shih-Chao Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure with polymeric layer and manufactur...
- Patent number 9,711,474
- Issue date Jul 18, 2017
- Taiwan Semiconductor Manufacturing Company Ltd.
- Gia-Her Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package with bridge layer and method for making the same
- Patent number 9,640,521
- Issue date May 2, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE INCLUDING THE SAME
- Publication number 20230039914
- Publication date Feb 9, 2023
- Samsung Electronics Co., Ltd.
- Juyoun CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PASSIVE DEVICE DIES AND METHODS OF FORMING AND PLACEMENT...
- Publication number 20220415813
- Publication date Dec 29, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Shang-Lun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BOND TIPS AND RELATED APPARATUS AND METHODS
- Publication number 20210233887
- Publication date Jul 29, 2021
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210183823
- Publication date Jun 17, 2021
- NISSAN MOTOR CO., LTD.
- Kenta EMORI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Methods for Making Multi-Die Package With Bridge Layer
- Publication number 20200266074
- Publication date Aug 20, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY AND MANUFACTURING METHOD THEREOF
- Publication number 20200083204
- Publication date Mar 12, 2020
- Toshiba Memory Corporation
- Poho TAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY AND METHOD FOR FORMING THE SAME
- Publication number 20200075572
- Publication date Mar 5, 2020
- MEDIATEK INC.
- Chia-Cheng CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Attach Methods and Semiconductor Devices Manufactured based on...
- Publication number 20190348347
- Publication date Nov 14, 2019
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STACKING FOR INTEGRATED CIRCUIT MANUFACTURING
- Publication number 20190326190
- Publication date Oct 24, 2019
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20170372907
- Publication date Dec 28, 2017
- Renesas Electronics Corporation
- Tomoya Kashiwazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING PACKAGE STRUCTURE WITH AN EMBEDDED ELECTRONIC...
- Publication number 20170352615
- Publication date Dec 7, 2017
- Siliconware Precision Industries Co., Ltd.
- Shih-Chao Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY COMPONENTS WITH CORNER ADHESIVE FOR WARPAGE RED...
- Publication number 20170287873
- Publication date Oct 5, 2017
- Santosh Sankarasubramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF
- Publication number 20140170849
- Publication date Jun 19, 2014
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Chia-Pao SHU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED CIRCUITS AND A METHOD FOR MANUFACTURING AN INTEGRATED CI...
- Publication number 20140061878
- Publication date Mar 6, 2014
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20140061669
- Publication date Mar 6, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SUPPORT STRUCTURE AND METH...
- Publication number 20130249073
- Publication date Sep 26, 2013
- Hsin Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE
- Publication number 20120292787
- Publication date Nov 22, 2012
- Hynix Semiconductor Inc.
- Jong Hyun NAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND ELECTRONIC DEVICE
- Publication number 20120106116
- Publication date May 3, 2012
- AISIN AW CO., LTD.
- Hitoshi NAKAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-TO-CHIP MULTI-SIGNALING COMMUNICATION SYSTEM WITH COMMON CONDU...
- Publication number 20120091596
- Publication date Apr 19, 2012
- Chau-Chin SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF
- Publication number 20120086126
- Publication date Apr 12, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Pao SHU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF
- Publication number 20120086127
- Publication date Apr 12, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Pao SHU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR CHIP, AND SEMICONDUCTOR PACKAGE AND SYSTEM EACH INCLU...
- Publication number 20110283034
- Publication date Nov 17, 2011
- Samsung Electronics Co., Ltd.
- Sun-won KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device using semiconductor chip
- Publication number 20050242424
- Publication date Nov 3, 2005
- Rohm Co., Ltd.
- Shinji Isokawa
- H01 - BASIC ELECTRIC ELEMENTS

the layer connector connecting one bonding area to at least two respective bonding areas

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Thermocompression bond tips and related apparatus and methods

Multi-die package with bridge layer

Semiconductor device with reduced thermal resistance

Display panel and display device

Semiconductor device having a device fixed on a substrate with an a...

Thermocompression bond tips and related apparatus and methods

Semiconductor memory and manufacturing method thereof

Light emitting device

Semiconductor package assembly and method for forming the same

Electronic device and mounting structure of the same

Display device

Methods for making multi-die package with bridge layer

Integrated circuit module and method of forming same

Multi-layer leadless semiconductor package and method of manufactur...

Semiconductor package assembly and method for forming the same

Die attach methods and semiconductor devices manufactured based on...

Wafer stacking for integrated circuit manufacturing

Electronic device

Systems and methods for bonding semiconductor elements

Electronic device and mounting structure of the same

Semiconductor device

Method of fabricating package structure with an embedded electronic...

Electronic device and mounting structure of the same

Integrated millimeter-wave chip package

Integrated circuit assemblies with rigid layers used for protection...

Wiring substrate

Method of manufacturing semiconductor device and semiconductor device

Package structure with an embedded electronic component and method...

Semiconductor package structure with polymeric layer and manufactur...

Multi-die package with bridge layer and method for making the same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE INCLUDING THE SAME

INTEGRATED PASSIVE DEVICE DIES AND METHODS OF FORMING AND PLACEMENT...

THERMOCOMPRESSION BOND TIPS AND RELATED APPARATUS AND METHODS

SEMICONDUCTOR DEVICE

Methods for Making Multi-Die Package With Bridge Layer

SEMICONDUCTOR MEMORY AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE ASSEMBLY AND METHOD FOR FORMING THE SAME

Die Attach Methods and Semiconductor Devices Manufactured based on...

WAFER STACKING FOR INTEGRATED CIRCUIT MANUFACTURING

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

METHOD OF FABRICATING PACKAGE STRUCTURE WITH AN EMBEDDED ELECTRONIC...

ELECTRONIC ASSEMBLY COMPONENTS WITH CORNER ADHESIVE FOR WARPAGE RED...

PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF

INTEGRATED CIRCUITS AND A METHOD FOR MANUFACTURING AN INTEGRATED CI...

CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SUPPORT STRUCTURE AND METH...

STACKED SEMICONDUCTOR PACKAGE

ELECTRONIC COMPONENT AND ELECTRONIC DEVICE

CHIP-TO-CHIP MULTI-SIGNALING COMMUNICATION SYSTEM WITH COMMON CONDU...

PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF

PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF

SEMICONDUCTOR CHIP, AND SEMICONDUCTOR PACKAGE AND SYSTEM EACH INCLU...

Semiconductor device using semiconductor chip