the layer connector connecting to a bond pad of the item

Industry

CPC
H01L2224/32227

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/32227the layer connector connecting to a bond pad of the item

Industries

Patents Grantslast 30 patents

Information Patent Grant
Light-emitting device, manufacturing method thereof and display mod...
- Patent number 12,107,080
- Issue date Oct 1, 2024
- Epistar Corporation
- Min-Hsun Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure and manufacturing method therefor
- Patent number 12,100,923
- Issue date Sep 24, 2024
- Resonac Corporation
- Kunihiko Akai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid nanosilver/liquid metal ink composition and uses thereof
- Patent number 12,096,554
- Issue date Sep 17, 2024
- Xerox Corporation
- Naveen Chopra
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Bonding structure production method and bonding structure
- Patent number 12,094,850
- Issue date Sep 17, 2024
- Osaka University
- Katsuaki Suganuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion soldering with contaminant protection
- Patent number 12,087,723
- Issue date Sep 10, 2024
- Infineon Technologies Austria AG
- Victor Verdugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 12,080,662
- Issue date Sep 3, 2024
- Samsung Display Co., Ltd.
- Eui Jeong Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,074,152
- Issue date Aug 27, 2024
- Samsung Display Co., Ltd.
- Dae Hyuk Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device using semiconductor light-emitting element and manuf...
- Patent number 12,074,147
- Issue date Aug 27, 2024
- LG Electronics Inc.
- Changseo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method of the same
- Patent number 12,062,742
- Issue date Aug 13, 2024
- Unimicron Technology Corp.
- Hao-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and semiconductor device
- Patent number 12,051,662
- Issue date Jul 30, 2024
- Rohm Co., Ltd.
- Masatoshi Aketa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for fabricating silicon die stacks for electron...
- Patent number 12,027,489
- Issue date Jul 2, 2024
- Ukyo Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and display device using the same
- Patent number 12,021,056
- Issue date Jun 25, 2024
- LG Display Co., Ltd.
- Chang Hyun Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration and bonding of micro-devices into system substrate
- Patent number 12,014,999
- Issue date Jun 18, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of transferring electronic element usi...
- Patent number 12,009,339
- Issue date Jun 11, 2024
- Seoul National University R&DB Foundation
- Yongtaek Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating paste-based conductive device and manufacturing method t...
- Patent number 12,009,334
- Issue date Jun 11, 2024
- Shenzhen Guangshe Zhaoming Technology Co., LTD
- Jianwei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded integrated device packages
- Patent number 12,002,838
- Issue date Jun 4, 2024
- Analog Devices, Inc.
- Vikram Venkatadri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,002,730
- Issue date Jun 4, 2024
- Mitsubishi Electric Corporation
- Ikumi Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a chip carrier with a pad offset feature
- Patent number 11,984,392
- Issue date May 14, 2024
- Infineon Technologies AG
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated package including device dies connected via interconne...
- Patent number 11,978,714
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite substrate and method for manufacturing same, and circuit...
- Patent number 11,973,002
- Issue date Apr 30, 2024
- DENKA COMPANY LIMITED
- Atsushi Sakai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Radio frequency packages containing substrates with coefficient of...
- Patent number 11,929,310
- Issue date Mar 12, 2024
- NXP USA, INC.
- Lu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attached leveling control by metal stopper bumps
- Patent number 11,923,331
- Issue date Mar 5, 2024
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-film packaging structure and chip-on-film packaging method
- Patent number 11,916,008
- Issue date Feb 27, 2024
- WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Yicheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including a plurality of lines to apply driving volt...
- Patent number 11,901,346
- Issue date Feb 13, 2024
- Samsung Display Co., Ltd.
- Ji Hye Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus including a display panel with multiple pads
- Patent number 11,894,294
- Issue date Feb 6, 2024
- Samsung Display Co., Ltd.
- Hanho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, electric device including the same
- Patent number 11,877,485
- Issue date Jan 16, 2024
- Samsung Display Co., Ltd.
- Chung-seok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,855,014
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of transferring electronic element usi...
- Patent number 11,848,303
- Issue date Dec 19, 2023
- Seoul National University R&DB Foundation
- Yongtaek Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrate and electronic device
- Patent number 11,830,833
- Issue date Nov 28, 2023
- INNOLUX CORPORATION
- Chueh Yuan Nien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including adhesive film with conductive ball
- Patent number 11,824,034
- Issue date Nov 21, 2023
- Samsung Display Co., Ltd.
- Joo-nyung Jang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLIP-CHIP MOUNTING STRUCTURE AND FLIP-CHIP MOUNTING METHOD
- Publication number 20240387444
- Publication date Nov 21, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- TAKAHIRO KUMAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240379485
- Publication date Nov 14, 2024
- Fuji Electric Co., Ltd.
- Shinichi MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLER AND SEMICONDUCTOR DEVICE
- Publication number 20240379499
- Publication date Nov 14, 2024
- Fuji Electric Co., Ltd.
- Daiki SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR FABRICATING SILICON DIE STACKS FOR ELECTRON...
- Publication number 20240371819
- Publication date Nov 7, 2024
- NANO-X IMAGING LTD.
- Ukyo JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE
- Publication number 20240339421
- Publication date Oct 10, 2024
- ROHM CO., LTD.
- Masatoshi AKETA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Devices with Displays and Conductive Traces
- Publication number 20240332319
- Publication date Oct 3, 2024
- Apple Inc.
- Gihoon Choo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240321809
- Publication date Sep 26, 2024
- STMicroelectronics International N.V.
- Romain COFFY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE DETECTION METHOD, PRESSURE DETECTION METHOD OF BONDING DEV...
- Publication number 20240313153
- Publication date Sep 19, 2024
- SAMSUNG DISPLAY CO., LTD.
- Futoshi YOSHIDA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME
- Publication number 20240312945
- Publication date Sep 19, 2024
- LG Display Co., Ltd.
- Chang Hyun SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
- Publication number 20240297133
- Publication date Sep 5, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED LEAD PACKAGE FOR HIGH VOLTAGE DEVICES
- Publication number 20240290676
- Publication date Aug 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240282664
- Publication date Aug 22, 2024
- Mitsubishi Electric Corporation
- Hidetoshi ISHIBASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20240282685
- Publication date Aug 22, 2024
- LG Innotek Co., Ltd.
- Jae Hun JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282744
- Publication date Aug 22, 2024
- Fuji Electric Co., Ltd.
- Takafumi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED PACKAGE INCLUDING DEVICE DIES CONNECTED VIA INTERCONNE...
- Publication number 20240258261
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INVERTER POWER MODULE
- Publication number 20240258196
- Publication date Aug 1, 2024
- AMOSENSE CO., LTD.
- Kyungwhan WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND WIRING MEMBER
- Publication number 20240243093
- Publication date Jul 18, 2024
- Fuji Electric Co., Ltd.
- Koji OSAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE FOR STRESS ISOLATION
- Publication number 20240222310
- Publication date Jul 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Gregory OSTROWICKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGING METHOD AND SENSOR PACKAGE
- Publication number 20240222308
- Publication date Jul 4, 2024
- PIXART IMAGING Inc.
- SAI-MUN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20240213165
- Publication date Jun 27, 2024
- PowerX Semiconductor Corporation
- Jing-Yao CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL SHEET MATERIAL, LAYERED BODY, INSULATED CIRCUIT BOARD, AND ME...
- Publication number 20240178115
- Publication date May 30, 2024
- MITSUBISHI MATERIALS CORPORATION
- Marina Sakamaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PACKAGE WITH SOLDER MASK
- Publication number 20240170438
- Publication date May 23, 2024
- NXP USA, Inc.
- Aznita Abdul Aziz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE
- Publication number 20240162163
- Publication date May 16, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS
- Publication number 20240162183
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING ARRANGEMENT
- Publication number 20240155766
- Publication date May 9, 2024
- ROBERT BOSCH GmbH
- Guenter Gera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240147620
- Publication date May 2, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jin Uk LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS
- Publication number 20240145420
- Publication date May 2, 2024
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND PROCESS FOR IMPLEMENTING SILICON CARBIDE (SIC) SURFACE M...
- Publication number 20240105390
- Publication date Mar 28, 2024
- Wolfspeed, Inc.
- Kok Meng KAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT WITH HIGH COPLANARITY AND METHOD OF MANUFACTUR...
- Publication number 20240105670
- Publication date Mar 28, 2024
- CYNTEC CO., LTD.
- Chi-Hung Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT-EMBEDDED PACKAGING STRUCTURE
- Publication number 20240096838
- Publication date Mar 21, 2024
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Chu-Chin HU
- H01 - BASIC ELECTRIC ELEMENTS

the layer connector connecting to a bond pad of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Light-emitting device, manufacturing method thereof and display mod...

Connection structure and manufacturing method therefor

Hybrid nanosilver/liquid metal ink composition and uses thereof

Bonding structure production method and bonding structure

Diffusion soldering with contaminant protection

Display device and method of manufacturing the same

Display device

Display device using semiconductor light-emitting element and manuf...

Package structure and manufacturing method of the same

Electronic component and semiconductor device

Systems and methods for fabricating silicon die stacks for electron...

Electronic device and display device using the same

Integration and bonding of micro-devices into system substrate

Electronic device and method of transferring electronic element usi...

Insulating paste-based conductive device and manufacturing method t...

Shielded integrated device packages

Semiconductor module

Semiconductor package having a chip carrier with a pad offset feature

Encapsulated package including device dies connected via interconne...

Composite substrate and method for manufacturing same, and circuit...

Radio frequency packages containing substrates with coefficient of...

Die attached leveling control by metal stopper bumps

Chip-on-film packaging structure and chip-on-film packaging method

Display device including a plurality of lines to apply driving volt...

Display apparatus including a display panel with multiple pads

Electronic component, electric device including the same

Semiconductor device and method

Electronic device and method of transferring electronic element usi...

Electronic substrate and electronic device

Display device including adhesive film with conductive ball

Patents Applicationslast 30 patents

FLIP-CHIP MOUNTING STRUCTURE AND FLIP-CHIP MOUNTING METHOD

SEMICONDUCTOR DEVICE

COOLER AND SEMICONDUCTOR DEVICE

SYSTEMS AND METHODS FOR FABRICATING SILICON DIE STACKS FOR ELECTRON...

ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE

Electronic Devices with Displays and Conductive Traces

ELECTRONIC DEVICE

PRESSURE DETECTION METHOD, PRESSURE DETECTION METHOD OF BONDING DEV...

ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME

INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

SHIELDED LEAD PACKAGE FOR HIGH VOLTAGE DEVICES

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

CIRCUIT BOARD

SEMICONDUCTOR DEVICE

ENCAPSULATED PACKAGE INCLUDING DEVICE DIES CONNECTED VIA INTERCONNE...

INVERTER POWER MODULE

SEMICONDUCTOR MODULE AND WIRING MEMBER

SEMICONDUCTOR PACKAGE FOR STRESS ISOLATION

SENSOR PACKAGING METHOD AND SENSOR PACKAGE

POWER MODULE

METAL SHEET MATERIAL, LAYERED BODY, INSULATED CIRCUIT BOARD, AND ME...

PACKAGE WITH SOLDER MASK

INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE

DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS

CONNECTING ARRANGEMENT

PRINTED CIRCUIT BOARD

LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS

DEVICE AND PROCESS FOR IMPLEMENTING SILICON CARBIDE (SIC) SURFACE M...

ELECTRONIC COMPONENT WITH HIGH COPLANARITY AND METHOD OF MANUFACTUR...

COMPONENT-EMBEDDED PACKAGING STRUCTURE