the layer connector connecting to a bonding area disposed in a recess of the surface of the item

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/32237the layer connector connecting to a bonding area disposed in a recess of the surface of the item

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Patents Grantslast 30 patents

Information Patent Grant
Display device using semiconductor light-emitting elements and manu...
- Patent number 12,080,689
- Issue date Sep 3, 2024
- LG Electronics Inc.
- Dohee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective transfer of micro devices
- Patent number 12,075,565
- Issue date Aug 27, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film in substrate for releasing z stack-up constraint
- Patent number 12,027,496
- Issue date Jul 2, 2024
- Intel Corporation
- Jianfeng Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and display device using the same
- Patent number 12,021,056
- Issue date Jun 25, 2024
- LG Display Co., Ltd.
- Chang Hyun Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device package
- Patent number 11,837,570
- Issue date Dec 5, 2023
- SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
- June O Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate, package structure and method of manufacturing th...
- Patent number 11,830,796
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device and electronic device
- Patent number 11,817,467
- Issue date Nov 14, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yoshihiro Makita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding structures and semiconductor devices including the same
- Patent number 11,804,462
- Issue date Oct 31, 2023
- Samsung Electronics Co., Ltd.
- Kunmo Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 11,778,842
- Issue date Oct 3, 2023
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Module with substrate recess for conductive-bonding component
- Patent number 11,776,871
- Issue date Oct 3, 2023
- Semiconductor Components Industries, LLC
- Leo Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,545
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,547
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,546
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,728,302
- Issue date Aug 15, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,728,306
- Issue date Aug 15, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display pixels with integrated pipeline
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- Issue date Jul 11, 2023
- Tectus Corporation
- Paul Scott Martin
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Information Patent Grant
Semiconductor package with heat dissipation member
- Patent number 11,670,565
- Issue date Jun 6, 2023
- Samsung Electronics Co., Ltd.
- Hyo-Chang Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate having electronic component embedded therein
- Patent number 11,495,546
- Issue date Nov 8, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Je Sang Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,476,216
- Issue date Oct 18, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 11,380,862
- Issue date Jul 5, 2022
- Apple Inc.
- Andreas Bibi
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Light emitting device package
- Patent number 11,373,973
- Issue date Jun 28, 2022
- SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
- June O Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,322,438
- Issue date May 3, 2022
- Winbond Electronics Corp.
- Yen-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed hybrid bonding structures and methods of forming the same
- Patent number 11,183,477
- Issue date Nov 23, 2021
- Intel Corporation
- Shawna Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and method for manufacturing power module
- Patent number 11,114,355
- Issue date Sep 7, 2021
- Murata Manufacturing Co., Ltd.
- Takahiro Hayakawa
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Composite ceramic multilayer substrate, heat generating element-mou...
- Patent number 11,107,741
- Issue date Aug 31, 2021
- Murata Manufacturing Co., Ltd.
- Tomoki Kato
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 10,964,900
- Issue date Mar 30, 2021
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip parts and method for manufacturing the same, circuit assembly...
- Patent number 10,867,945
- Issue date Dec 15, 2020
- Rohm Co., Ltd.
- Hiroki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and process
- Patent number 10,867,835
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 10,854,527
- Issue date Dec 1, 2020
- Advanced Semiconductor Engineering, Inc.
- Wen-Long Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability wafer level semiconductor packaging
- Patent number 10,790,208
- Issue date Sep 29, 2020
- Semiconductor Components Industries, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE
- Publication number 20240395654
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240387492
- Publication date Nov 21, 2024
- LG ELECTRONICS INC.
- Dohan KIM
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20240381531
- Publication date Nov 14, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240321823
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Donguk Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME
- Publication number 20240312945
- Publication date Sep 19, 2024
- LG Display Co., Ltd.
- Chang Hyun SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOCUMENT STRUCTURE FORMATION
- Publication number 20240105669
- Publication date Mar 28, 2024
- INFINEON TECHNOLOGIES AG
- Jens Pohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240055385
- Publication date Feb 15, 2024
- WISTRON NEWEB CORPORATION
- KUO-HUA HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CHIP PACKAGE AND POWER MODULE
- Publication number 20240047302
- Publication date Feb 8, 2024
- Ganstronic INC.
- Cheng-Chuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND ELECTRONIC DEVICE
- Publication number 20240038796
- Publication date Feb 1, 2024
- Sony Semiconductor Solutions Corporation
- Yoshihiro MAKITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE WITH SUBSTRATE RECESS FOR CONDUCTIVE-BONDING COMPONENT
- Publication number 20240030093
- Publication date Jan 25, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Leo GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20240008298
- Publication date Jan 4, 2024
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
MOUNTING BOARD AND CIRCUIT BOARD
- Publication number 20230395766
- Publication date Dec 7, 2023
- TDK Corporation
- Tomohisa MITOSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI CAGE FOR MICROSTRIP ROUTING VIA DUAL LAYER UNDERFILL CONCEPT
- Publication number 20230395524
- Publication date Dec 7, 2023
- Intel Corporation
- Eng Huat GOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20230369274
- Publication date Nov 16, 2023
- Taiwan Semiconduction Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH A BUMP PAD INTERCONNECT COMPRIS...
- Publication number 20230352390
- Publication date Nov 2, 2023
- QUALCOMM Incorporated
- Chin-Kwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Display Device
- Publication number 20230121603
- Publication date Apr 20, 2023
- LG Display Co., Ltd.
- Hoiyong KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT RECOGNITION MODULE AND ELECTRONIC DEVICE COMPRISING SAME
- Publication number 20230005893
- Publication date Jan 5, 2023
- LG Innotek Co., Ltd.
- Seung Ho JEON
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT SUBSTRATE, PACKAGE STRUCTURE AND METHOD OF MANUFACTURING TH...
- Publication number 20220310499
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20220293876
- Publication date Sep 15, 2022
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
MODULE WITH SUBSTRATE RECESS FOR CONDUCTIVE-BONDING COMPONENT
- Publication number 20220189848
- Publication date Jun 16, 2022
- Semiconductor Components Industries, LLC
- Leo GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE UNDERFILL FORMATION FOR AN INTEGRATED CIRCUIT ASS...
- Publication number 20220181289
- Publication date Jun 9, 2022
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220139856
- Publication date May 5, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220139857
- Publication date May 5, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRETCHABLE ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220104343
- Publication date Mar 31, 2022
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Ji-Young OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM IN SUBSTRATE FOR RELEASING Z STACK-UP CONSTRAINT
- Publication number 20220093568
- Publication date Mar 24, 2022
- Intel Corporation
- Jianfeng HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING STRUCTURES AND SEMICONDUCTOR DEVICES INCLUDING THE SAME
- Publication number 20220077100
- Publication date Mar 10, 2022
- Samsung Electronics Co., Ltd.
- Kunmo CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220077051
- Publication date Mar 10, 2022
- WINBOND ELECTRONICS CORP.
- Yen-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIXED HYBRID BONDING STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20220020716
- Publication date Jan 20, 2022
- Intel Corporation
- Shawna Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME
- Publication number 20210398933
- Publication date Dec 23, 2021
- LG Display Co., Ltd.
- Chang Hyun SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND ELECTRONIC DEVICE
- Publication number 20210391367
- Publication date Dec 16, 2021
- Sony Semiconductor Solutions Corporation
- Yoshihiro MAKITA
- H01 - BASIC ELECTRIC ELEMENTS

the layer connector connecting to a bonding area disposed in a recess of the surface of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device using semiconductor light-emitting elements and manu...

Selective transfer of micro devices

Film in substrate for releasing z stack-up constraint

Electronic device and display device using the same

Light emitting device package

Circuit substrate, package structure and method of manufacturing th...

Solid-state imaging device and electronic device

Hybrid bonding structures and semiconductor devices including the same

Light emitting diode display with redundancy scheme

Module with substrate recess for conductive-bonding component

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Display pixels with integrated pipeline

Semiconductor package with heat dissipation member

Substrate having electronic component embedded therein

Selective micro device transfer to receiver substrate

Light emitting diode display with redundancy scheme

Light emitting device package

Package structure and manufacturing method thereof

Mixed hybrid bonding structures and methods of forming the same

Power module and method for manufacturing power module

Composite ceramic multilayer substrate, heat generating element-mou...

Light emitting diode display with redundancy scheme

Chip parts and method for manufacturing the same, circuit assembly...

Semiconductor packaging structure and process

Semiconductor device package and method of manufacturing the same

High reliability wafer level semiconductor packaging

Patents Applicationslast 30 patents

STACKED SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE

DISPLAY DEVICE

SELECTIVE TRANSFER OF MICRO DEVICES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME

DOCUMENT STRUCTURE FORMATION

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

POWER CHIP PACKAGE AND POWER MODULE

SOLID-STATE IMAGING DEVICE AND ELECTRONIC DEVICE

MODULE WITH SUBSTRATE RECESS FOR CONDUCTIVE-BONDING COMPONENT

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

MOUNTING BOARD AND CIRCUIT BOARD

EMI CAGE FOR MICROSTRIP ROUTING VIA DUAL LAYER UNDERFILL CONCEPT

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

PACKAGE COMPRISING A SUBSTRATE WITH A BUMP PAD INTERCONNECT COMPRIS...

Display Device

FINGERPRINT RECOGNITION MODULE AND ELECTRONIC DEVICE COMPRISING SAME

CIRCUIT SUBSTRATE, PACKAGE STRUCTURE AND METHOD OF MANUFACTURING TH...

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

MODULE WITH SUBSTRATE RECESS FOR CONDUCTIVE-BONDING COMPONENT

THROUGH-SUBSTRATE UNDERFILL FORMATION FOR AN INTEGRATED CIRCUIT ASS...

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

STRETCHABLE ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

FILM IN SUBSTRATE FOR RELEASING Z STACK-UP CONSTRAINT

HYBRID BONDING STRUCTURES AND SEMICONDUCTOR DEVICES INCLUDING THE SAME

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

MIXED HYBRID BONDING STRUCTURES AND METHODS OF FORMING THE SAME

ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME

SOLID-STATE IMAGING DEVICE AND ELECTRONIC DEVICE