the layer connector connecting to a bonding area disposed in a recess of the surface of the item

Industry

CPC
H01L2224/32257

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/32257the layer connector connecting to a bonding area disposed in a recess of the surface of the item

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip package including lead frame and manufacturing m...
- Patent number 12,113,008
- Issue date Oct 8, 2024
- Diodes Incorporated
- Shiau-Shi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage monolithic LED chip
- Patent number 11,916,165
- Issue date Feb 27, 2024
- CreeLED, Inc.
- Kevin W. Haberern
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage monolithic LED chip with improved reliability
- Patent number 11,843,083
- Issue date Dec 12, 2023
- CreeLED, Inc.
- Bradley E. Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D flex-foil package
- Patent number 11,764,122
- Issue date Sep 19, 2023
- Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Robert Faul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage monolithic LED chip with improved reliability
- Patent number 11,588,083
- Issue date Feb 21, 2023
- CreeLED, Inc.
- Bradley E. Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module, method of manufacturing connector, and method of...
- Patent number 11,437,340
- Issue date Sep 6, 2022
- Shindengen Electric Manufacturing Co., Ltd.
- Kosuke Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die integrated circuit packages and methods of manufacturing...
- Patent number 11,328,984
- Issue date May 10, 2022
- Texas Instruments Incorporated
- You Chye How
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,289,407
- Issue date Mar 29, 2022
- Vanguard International Semiconductor Corporation
- Chih-Yen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 11,075,091
- Issue date Jul 27, 2021
- Shindengen Electric Manufacturing Co., Ltd.
- Soichiro Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,037,868
- Issue date Jun 15, 2021
- Advanced Semiconductor Engineering, Inc.
- Hui Hua Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack frame for electrical connections and the method to fabricate...
- Patent number 11,031,255
- Issue date Jun 8, 2021
- Cyntec Co., Ltd.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage monolithic LED chip with improved reliability
- Patent number 10,957,830
- Issue date Mar 23, 2021
- Cree, Inc.
- Bradley E Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and process
- Patent number 10,867,835
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact optically efficient solid state light source with integrate...
- Patent number 10,842,016
- Issue date Nov 17, 2020
- Cree, Inc.
- Chandan Bhat
- F21 - LIGHTING
Information Patent Grant
High voltage monolithic LED chip
- Patent number 10,797,201
- Issue date Oct 6, 2020
- Cree, Inc.
- Kevin W. Haberern
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage monolithic LED chip with improved reliability
- Patent number 10,734,558
- Issue date Aug 4, 2020
- Cree Huizhou Solid State Lighting Company Limited
- Bradley E Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and power conversion system including same
- Patent number 10,727,173
- Issue date Jul 28, 2020
- Hyundai Motor Company
- Jun Hee Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic unit
- Patent number 10,714,461
- Issue date Jul 14, 2020
- Vishay Semiconductor GmbH
- Christoph Paul Gebauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and the method to fabricate thereof
- Patent number 10,636,735
- Issue date Apr 28, 2020
- Cyntec Co., Ltd.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 10,615,105
- Issue date Apr 7, 2020
- Advanced Semiconductor Engineering, Inc.
- Hui Hua Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack frame for electrical connections and the method to fabricate...
- Patent number 10,593,561
- Issue date Mar 17, 2020
- Cyntec Co., Ltd.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminate package of chip on carrier and in cavity
- Patent number 10,522,433
- Issue date Dec 31, 2019
- Infineon Technologies AG
- Juergen Hoegerl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 10,490,486
- Issue date Nov 26, 2019
- Renesas Electronics Corporation
- Hajime Hasebe
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Compact LED package with reflectivity layer
- Patent number 10,424,702
- Issue date Sep 24, 2019
- Cree, Inc.
- Jesse Reiherzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device having surface-modified luminophores
- Patent number 10,312,420
- Issue date Jun 4, 2019
- Seoul Semiconducter Co., Ltd.
- Chung Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 10,269,753
- Issue date Apr 23, 2019
- Toyota Jidosha Kabushiki Kaisha
- Akinori Sakakibara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage monolithic LED chip with improved reliability
- Patent number 10,243,121
- Issue date Mar 26, 2019
- Cree, Inc.
- Bradley E Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attachment for packaged semiconductor device
- Patent number 10,217,698
- Issue date Feb 26, 2019
- NXP USA, INC.
- Akhilesh K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned floating mirror for contact vias
- Patent number 10,186,644
- Issue date Jan 22, 2019
- Cree, Inc.
- Eric Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with metal film and method for manufacturing s...
- Patent number 10,157,865
- Issue date Dec 18, 2018
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE THERMAL INTERFACE AND METHOD
- Publication number 20240332116
- Publication date Oct 3, 2024
- Intel Corporation
- Chun Keang Ooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240321808
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Kazuki MATSUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING DEVICE AND HEAT DISSIPATION COVER THEREOF
- Publication number 20240213112
- Publication date Jun 27, 2024
- Global Unichip Corporation
- Sheng-Fan YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240170360
- Publication date May 23, 2024
- MEDIATEK INC.
- Chun-Yin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH RESIN BLEED CONTROL STRUCTURE AND METHOD...
- Publication number 20240112989
- Publication date Apr 4, 2024
- NXP USA, Inc.
- Trent Uehling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATSINK FOR RING TYPE INTEGRATED CIRCUITS
- Publication number 20240105549
- Publication date Mar 28, 2024
- Cisco Technology, Inc.
- Yongguo CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240047300
- Publication date Feb 8, 2024
- ROHM CO., LTD.
- Xiaopeng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE MONOLITHIC LED CHIP WITH IMPROVED RELIABILITY
- Publication number 20230155087
- Publication date May 18, 2023
- CreeLED, Inc.
- Bradley E. Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20210398883
- Publication date Dec 23, 2021
- Vanguard International Semiconductor Corporation
- Chih-Yen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION DEVICES HAVING THERMAL INTERFACE MATERIAL CONTAINM...
- Publication number 20210249326
- Publication date Aug 12, 2021
- Intel Corporation
- Aastha Uppal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE MONOLITHIC LED CHIP WITH IMPROVED RELIABILITY
- Publication number 20200365782
- Publication date Nov 19, 2020
- Cree, Inc.
- BRADLEY E. WILLIAMS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND COMMUNICATIONS DEVICE
- Publication number 20200294892
- Publication date Sep 17, 2020
- Huawei Technologies Co., Ltd
- Kairong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D FLEX-FOIL PACKAGE
- Publication number 20200279787
- Publication date Sep 3, 2020
- FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG e.V.
- Robert FAUL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200194356
- Publication date Jun 18, 2020
- Advanced Semiconductor Engineering, Inc.
- Hui Hua LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A Stack Frame for Electrical Connections and the Method to Fabricat...
- Publication number 20200176270
- Publication date Jun 4, 2020
- CYNTEC CO., LTD.
- BAU-RU LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE MONOLITHIC LED CHIP WITH IMPROVED RELIABILITY
- Publication number 20190198734
- Publication date Jun 27, 2019
- Cree, Inc.
- BRADLEY E. WILLIAMS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE MONOLITHIC LED CHIP
- Publication number 20190074407
- Publication date Mar 7, 2019
- Cree, Inc.
- KEVIN W. HABERERN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190027427
- Publication date Jan 24, 2019
- RENESAS ELECTRONICS CORPORATION
- Hajime HASEBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR DIE HAVING REDISTRI...
- Publication number 20180366380
- Publication date Dec 20, 2018
- Infineon Technologies Americas Corp.
- Mark Pavier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20180358276
- Publication date Dec 13, 2018
- Advanced Semiconductor Engineering, Inc.
- Chi-Tsung CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stack Frame for Electrical Connections and the Method to Fabricate...
- Publication number 20180233380
- Publication date Aug 16, 2018
- CYNTEC CO., LTD.
- BAU-RU LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20180197833
- Publication date Jul 12, 2018
- Toyota Jidosha Kabushiki Kaisha
- Akinori SAKAKIBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20180068972
- Publication date Mar 8, 2018
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packaging Structure and Process
- Publication number 20170345708
- Publication date Nov 30, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stack Frame for Electrical Connections and the Method to Fabricate...
- Publication number 20170316954
- Publication date Nov 2, 2017
- CYNTEC CO., LTD.
- BAU-RU LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laminate package of chip on carrier and in cavity
- Publication number 20170316994
- Publication date Nov 2, 2017
- INFINEON TECHNOLOGIES AG
- Juergen HOEGERL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE MONOLITHIC LED CHIP
- Publication number 20170309778
- Publication date Oct 26, 2017
- Cree, Inc.
- KEVIN W. HABERERN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20170084569
- Publication date Mar 23, 2017
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK FRAME FOR ELECTRICAL CONNECTIONS AND THE METHOD TO FABRICATE...
- Publication number 20170047229
- Publication date Feb 16, 2017
- CYNTEC CO., LTD.
- BAU-RU LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONTROL DEVICE AND PREPARATION METHOD THEREOF
- Publication number 20140361419
- Publication date Dec 11, 2014
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS

the layer connector connecting to a bonding area disposed in a recess of the surface of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor chip package including lead frame and manufacturing m...

High voltage monolithic LED chip

High voltage monolithic LED chip with improved reliability

3D flex-foil package

High voltage monolithic LED chip with improved reliability

Electronic module, method of manufacturing connector, and method of...

Multi-die integrated circuit packages and methods of manufacturing...

Package structure

Method for manufacturing semiconductor device

Semiconductor device package and method of manufacturing the same

Stack frame for electrical connections and the method to fabricate...

High voltage monolithic LED chip with improved reliability

Semiconductor packaging structure and process

Compact optically efficient solid state light source with integrate...

High voltage monolithic LED chip

High voltage monolithic LED chip with improved reliability

Power module and power conversion system including same

Electronic unit

Package structure and the method to fabricate thereof

Semiconductor device package and method of manufacturing the same

Stack frame for electrical connections and the method to fabricate...

Laminate package of chip on carrier and in cavity

Semiconductor device

Compact LED package with reflectivity layer

Light-emitting device having surface-modified luminophores

Semiconductor device and manufacturing method of semiconductor device

High voltage monolithic LED chip with improved reliability

Die attachment for packaged semiconductor device

Self-aligned floating mirror for contact vias

Semiconductor device with metal film and method for manufacturing s...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE THERMAL INTERFACE AND METHOD

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGING DEVICE AND HEAT DISSIPATION COVER THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH RESIN BLEED CONTROL STRUCTURE AND METHOD...

HEATSINK FOR RING TYPE INTEGRATED CIRCUITS

SEMICONDUCTOR DEVICE

HIGH VOLTAGE MONOLITHIC LED CHIP WITH IMPROVED RELIABILITY

PACKAGE STRUCTURE

HEAT DISSIPATION DEVICES HAVING THERMAL INTERFACE MATERIAL CONTAINM...

HIGH VOLTAGE MONOLITHIC LED CHIP WITH IMPROVED RELIABILITY

PACKAGE STRUCTURE AND COMMUNICATIONS DEVICE

3D FLEX-FOIL PACKAGE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

A Stack Frame for Electrical Connections and the Method to Fabricat...

HIGH VOLTAGE MONOLITHIC LED CHIP WITH IMPROVED RELIABILITY

HIGH VOLTAGE MONOLITHIC LED CHIP

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR DIE HAVING REDISTRI...

SEMICONDUCTOR DEVICE PACKAGE

Stack Frame for Electrical Connections and the Method to Fabricate...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

Semiconductor Packaging Structure and Process

Stack Frame for Electrical Connections and the Method to Fabricate...

Laminate package of chip on carrier and in cavity

HIGH VOLTAGE MONOLITHIC LED CHIP

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

STACK FRAME FOR ELECTRICAL CONNECTIONS AND THE METHOD TO FABRICATE...

POWER CONTROL DEVICE AND PREPARATION METHOD THEREOF