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the layer connector connecting to a bonding area protruding from the surface of the item
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CPC
H01L2224/32198
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/32198
the layer connector connecting to a bonding area protruding from the surface of the item
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last 30 patents
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Patent Application
Semiconductor Device and Method of Forming SIP Module Over Film Layer
Publication number
20180269195
Publication date
Sep 20, 2018
STATS ChipPAC Pte Ltd.
OhHan Kim
H01 - BASIC ELECTRIC ELEMENTS