the layer connector connecting to a bonding area protruding from the surface of the item

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CPC
H01L2224/32268

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/32268the layer connector connecting to a bonding area protruding from the surface of the item

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Flexible electronic structure including a support element
- Patent number 12,237,289
- Issue date Feb 25, 2025
- PRAGMATIC SEMICONDUCTOR LIMITED
- Brian Cobb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded-bridge substrate connectors and methods of assembling same
- Patent number 10,727,197
- Issue date Jul 28, 2020
- Intel IP Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for a seal ring structure
- Patent number 9,650,243
- Issue date May 16, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ying Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and fabrication method thereof
- Patent number 9,343,401
- Issue date May 17, 2016
- Siliconware Precision Industries Co., Ltd.
- Chi-Liang Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to integrate different function devices fabricated by differ...
- Patent number 9,337,182
- Issue date May 10, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for a seal ring structure
- Patent number 9,287,188
- Issue date Mar 15, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ying Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED MILLIMETER WAVE ANTENNA ESD PROTECTION
- Publication number 20240363556
- Publication date Oct 31, 2024
- Intel Corporation
- Harald Gossner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE, SEMICONDUCTOR PACKAGE, AND FABRICATING METHOD THEREOF
- Publication number 20240021558
- Publication date Jan 18, 2024
- Powertech Technology Inc.
- Shang-Yu CHANG-CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE ELECTRONIC STRUCTURE
- Publication number 20220246500
- Publication date Aug 4, 2022
- PRAGMATIC PRINTING LTD.
- Brian COBB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED-BRIDGE SUBSTRATE CONNECTORS AND METHODS OF ASSEMBLING SAME
- Publication number 20200328182
- Publication date Oct 15, 2020
- Intel IP Corporation
- Bernd WAIDHAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED-BRIDGE SUBSTRATE CONNECTORS AND METHODS OF ASSEMBLING SAME
- Publication number 20180277512
- Publication date Sep 27, 2018
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for a Seal Ring Structure
- Publication number 20140217557
- Publication date Aug 7, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ying Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD TO INTEGRATE DIFFERENT FUNCTION DEVICES FABRICATED BY DIFFER...
- Publication number 20140183611
- Publication date Jul 3, 2014
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS

the layer connector connecting to a bonding area protruding from the surface of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Flexible electronic structure including a support element

Embedded-bridge substrate connectors and methods of assembling same

Method and apparatus for a seal ring structure

Semiconductor package and fabrication method thereof

Method to integrate different function devices fabricated by differ...

Method and apparatus for a seal ring structure

Patents Applicationslast 30 patents

INTEGRATED MILLIMETER WAVE ANTENNA ESD PROTECTION

CHIP STRUCTURE, SEMICONDUCTOR PACKAGE, AND FABRICATING METHOD THEREOF

FLEXIBLE ELECTRONIC STRUCTURE

EMBEDDED-BRIDGE SUBSTRATE CONNECTORS AND METHODS OF ASSEMBLING SAME

EMBEDDED-BRIDGE SUBSTRATE CONNECTORS AND METHODS OF ASSEMBLING SAME

Method and Apparatus for a Seal Ring Structure

METHOD TO INTEGRATE DIFFERENT FUNCTION DEVICES FABRICATED BY DIFFER...