the layer connector connecting to a bonding area protruding from the surface of the item

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CPC
H01L2224/32258

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/32258the layer connector connecting to a bonding area protruding from the surface of the item

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor module
- Patent number 12,131,980
- Issue date Oct 29, 2024
- Fuji Electric Co., Ltd.
- Toru Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded packaging for wide band gap semiconductor devices
- Patent number 12,087,677
- Issue date Sep 10, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Maria Clemens Ypil Quinones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a semiconductor arrangement
- Patent number 11,955,450
- Issue date Apr 9, 2024
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal structures adapted to electronic device heights in integrat...
- Patent number 11,749,579
- Issue date Sep 5, 2023
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement and method for producing the same
- Patent number 11,688,712
- Issue date Jun 27, 2023
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive bonding composition and method of use
- Patent number 11,648,750
- Issue date May 16, 2023
- Immunolight, LLC
- Zakaryae Fathi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Dual-side cooling semiconductor packages and related methods
- Patent number 11,646,249
- Issue date May 9, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame-based semiconductor package
- Patent number 11,469,161
- Issue date Oct 11, 2022
- Infineon Technologies AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder alloy and junction structure using same
- Patent number 11,135,683
- Issue date Oct 5, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hidetoshi Kitaura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing an optoelectronic component, and optoelectroni...
- Patent number 11,121,287
- Issue date Sep 14, 2021
- OSRAM OLED GmbH
- Ivar Tangring
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,069,538
- Issue date Jul 20, 2021
- Shindengen Electric Manufacturing Co., Ltd.
- Soichiro Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal inverse opal substrate with integrated jet cooling in electro...
- Patent number 11,004,769
- Issue date May 11, 2021
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,832,922
- Issue date Nov 10, 2020
- Rohm Co., Ltd.
- Seigo Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,333
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,332
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and power conversion system including same
- Patent number 10,727,173
- Issue date Jul 28, 2020
- Hyundai Motor Company
- Jun Hee Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,707,111
- Issue date Jul 7, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing encapsulated semiconductor device package...
- Patent number 10,630,246
- Issue date Apr 21, 2020
- NXP USA, INC.
- David F. Abdo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device
- Patent number 10,553,559
- Issue date Feb 4, 2020
- Mitsubishi Electric Corporation
- Noriyuki Besshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module
- Patent number 10,510,636
- Issue date Dec 17, 2019
- Shindengen Electric Manufacturing Co., Ltd.
- Kosuke Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 10,490,488
- Issue date Nov 26, 2019
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,366,905
- Issue date Jul 30, 2019
- Rohm Co., Ltd.
- Seigo Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 10,325,835
- Issue date Jun 18, 2019
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,269,609
- Issue date Apr 23, 2019
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attachment for packaged semiconductor device
- Patent number 10,217,698
- Issue date Feb 26, 2019
- NXP USA, INC.
- Akhilesh K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,991,220
- Issue date Jun 5, 2018
- Fuji Electric Co., Ltd.
- Yoko Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 9,892,952
- Issue date Feb 13, 2018
- Semiconductor Components Industries, LLC
- Darrell Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame structure for light emitting diode
- Patent number 9,852,967
- Issue date Dec 26, 2017
- ECOCERA OPTRONICS CO., LTD.
- Yu-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,773,767
- Issue date Sep 26, 2017
- Fuji Electric Co., Ltd.
- Yoko Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and method for manufacturing electronic component
- Patent number 9,646,948
- Issue date May 9, 2017
- Sumida Corporation
- Yasuo Shimanuki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312896
- Publication date Sep 19, 2024
- ROHM CO., LTD.
- Natsuya YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING DEVICE AND HEAT DISSIPATION COVER THEREOF
- Publication number 20240213112
- Publication date Jun 27, 2024
- Global Unichip Corporation
- Sheng-Fan YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Power Semiconductor Device
- Publication number 20240096842
- Publication date Mar 21, 2024
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE FOR ASYMMETRIC TRANSIENT VOLTAGE SUPPRESSOR
- Publication number 20240096763
- Publication date Mar 21, 2024
- Littelfuse Semiconductor (Wuxi) Co., Ltd
- Lucas Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE PATTERN
- Publication number 20230352404
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fu-Chiang KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20230335472
- Publication date Oct 19, 2023
- Hitachi Energy Switzerland AG
- Juergen SCHUDERER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PCB FOR TOPSIDE POWER DELIVERY
- Publication number 20230317706
- Publication date Oct 5, 2023
- Intel Corporation
- Kyle ARRINGTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A SEMICONDUCTOR ARRANGEMENT
- Publication number 20230275059
- Publication date Aug 31, 2023
- INFINEON TECHNOLOGIES AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDE COOLING SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20230238307
- Publication date Jul 27, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
- Publication number 20230191747
- Publication date Jun 22, 2023
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL STRUCTURES ADAPTED TO ELECTRONIC DEVICE HEIGHTS IN INTEGRAT...
- Publication number 20220278016
- Publication date Sep 1, 2022
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDE COOLING SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20220208653
- Publication date Jun 30, 2022
- Semiconductor Components Industries, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME-BASED SEMICONDUCTOR PACKAGE
- Publication number 20220068773
- Publication date Mar 3, 2022
- INFINEON TECHNOLOGIES AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20220028761
- Publication date Jan 27, 2022
- Fuji Electric Co., Ltd.
- Toru YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION DEVICES HAVING THERMAL INTERFACE MATERIAL CONTAINM...
- Publication number 20210249326
- Publication date Aug 12, 2021
- Intel Corporation
- Aastha Uppal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INVERSE OPAL SUBSTRATE WITH INTEGRATED JET COOLING IN ELECTRO...
- Publication number 20210013126
- Publication date Jan 14, 2021
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Structure for Supporting Thin Semiconductor Chips with a...
- Publication number 20200395334
- Publication date Dec 17, 2020
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing an Optoelectronic Component, and Optoelectroni...
- Publication number 20200152838
- Publication date May 14, 2020
- OSRAM OLED GmbH
- Ivar TANGRING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
- Publication number 20190326202
- Publication date Oct 24, 2019
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180366346
- Publication date Dec 20, 2018
- Rohm Co., Ltd.
- Seigo MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGING STRUCTURE
- Publication number 20180233477
- Publication date Aug 16, 2018
- Industrial Technology Research Institute
- Jing-Yao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE
- Publication number 20180197838
- Publication date Jul 12, 2018
- MITSUBISHI ELECTRIC CORPORATION
- Noriyuki BESSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL FLAT NO-LEAD SEMICONDUCTOR PACKAGES AND METHODS OF MANU...
- Publication number 20180174881
- Publication date Jun 21, 2018
- Semiconductor Components Industries, LLC
- Darrell D. TRUHITTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
- Publication number 20180138109
- Publication date May 17, 2018
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACHMENT FOR PACKAGED SEMICONDUCTOR DEVICE
- Publication number 20170098597
- Publication date Apr 6, 2017
- NXP USA, Inc.
- AKHILESH K. SINGH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FOR MOUNTING ELECTRONIC COMPONENT AND ADHESIVE FILM FOR MO...
- Publication number 20160272854
- Publication date Sep 22, 2016
- Sekisui Chemical Co., Ltd
- Sayaka WAKIOKA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF CONNECTING A SUBSTRATE AND CHIP ASSEMBLY
- Publication number 20160126165
- Publication date May 5, 2016
- INFINEON TECHNOLOGIES AG
- Paul FRANK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming an interconnection and arrangement for a direct i...
- Publication number 20160126216
- Publication date May 5, 2016
- INFINEON TECHNOLOGIES AG
- Alexander HEINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150380393
- Publication date Dec 31, 2015
- Fuji Electric Co., Ltd.
- Yoko NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150380374
- Publication date Dec 31, 2015
- Fuji Electric Co., Ltd.
- Yoko NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS

the layer connector connecting to a bonding area protruding from the surface of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor module

Molded packaging for wide band gap semiconductor devices

Method for producing a semiconductor arrangement

Thermal structures adapted to electronic device heights in integrat...

Semiconductor arrangement and method for producing the same

Adhesive bonding composition and method of use

Dual-side cooling semiconductor packages and related methods

Lead frame-based semiconductor package

Solder alloy and junction structure using same

Method for producing an optoelectronic component, and optoelectroni...

Semiconductor device and method of manufacturing semiconductor device

Metal inverse opal substrate with integrated jet cooling in electro...

Semiconductor device

Wafer level flat no-lead semiconductor packages and methods of manu...

Wafer level flat no-lead semiconductor packages and methods of manu...

Power module and power conversion system including same

Wafer level flat no-lead semiconductor packages and methods of manu...

Methods of manufacturing encapsulated semiconductor device package...

Power semiconductor device

Electronic module

Semiconductor devices and methods of making the same

Semiconductor device

Semiconductor devices and methods of making the same

Wafer level flat no-lead semiconductor packages and methods of manu...

Die attachment for packaged semiconductor device

Semiconductor device

Wafer level flat no-lead semiconductor packages and methods of manu...

Lead frame structure for light emitting diode

Semiconductor device

Electronic component and method for manufacturing electronic component

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGING DEVICE AND HEAT DISSIPATION COVER THEREOF

Method for Fabricating a Power Semiconductor Device

PACKAGE STRUCTURE FOR ASYMMETRIC TRANSIENT VOLTAGE SUPPRESSOR

INTERCONNECT STRUCTURE PATTERN

POWER SEMICONDUCTOR MODULE

METAL PCB FOR TOPSIDE POWER DELIVERY

METHOD FOR PRODUCING A SEMICONDUCTOR ARRANGEMENT

DUAL-SIDE COOLING SEMICONDUCTOR PACKAGES AND RELATED METHODS

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

THERMAL STRUCTURES ADAPTED TO ELECTRONIC DEVICE HEIGHTS IN INTEGRAT...

DUAL-SIDE COOLING SEMICONDUCTOR PACKAGES AND RELATED METHODS

LEAD FRAME-BASED SEMICONDUCTOR PACKAGE

SEMICONDUCTOR MODULE

HEAT DISSIPATION DEVICES HAVING THERMAL INTERFACE MATERIAL CONTAINM...

METAL INVERSE OPAL SUBSTRATE WITH INTEGRATED JET COOLING IN ELECTRO...

Method and Structure for Supporting Thin Semiconductor Chips with a...

Method for Producing an Optoelectronic Component, and Optoelectroni...

SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME

SEMICONDUCTOR DEVICE

ELECTRONIC PACKAGING STRUCTURE

POWER SEMICONDUCTOR DEVICE

WAFER LEVEL FLAT NO-LEAD SEMICONDUCTOR PACKAGES AND METHODS OF MANU...

SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME

DIE ATTACHMENT FOR PACKAGED SEMICONDUCTOR DEVICE

ADHESIVE FOR MOUNTING ELECTRONIC COMPONENT AND ADHESIVE FILM FOR MO...

METHOD OF CONNECTING A SUBSTRATE AND CHIP ASSEMBLY

Method of forming an interconnection and arrangement for a direct i...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE