the layer connector connecting to a bonding area protruding from the surface of the item

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H01L2224/32168

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/32168the layer connector connecting to a bonding area protruding from the surface of the item

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing element chip and method of manufacturing el...
- Patent number 9,698,052
- Issue date Jul 4, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Atsushi Harikai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Miniaturized SMD diode package and process for producing the same
- Patent number 9,691,736
- Issue date Jun 27, 2017
- SFI ELECTRONICS TECHNOLOGY INC.
- Ching-Hohn Lien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Miniaturized SMD diode package and process for producing the same
- Patent number 9,691,735
- Issue date Jun 27, 2017
- SFI Electronics Technology Inc.
- Ching-Hohn Lien
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING ELEMENT CHIP AND METHOD OF MANUFACTURING EL...
- Publication number 20170098590
- Publication date Apr 6, 2017
- Panasonic Intellectual Propery Management Co., Ltd
- ATSUSHI HARIKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MINIATURIZED SMD DIODE PACKAGE AND PROCESS FOR PRODUCING THE SAME
- Publication number 20160035697
- Publication date Feb 4, 2016
- SFI Electronics Technology Inc.
- Ching-Hohn LIEN
- H01 - BASIC ELECTRIC ELEMENTS