the layer connector connecting to a bonding area protruding from the surface

Industry

CPC
H01L2224/32148

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/32148the layer connector connecting to a bonding area protruding from the surface

Industries

Patents Grantslast 30 patents

Information Patent Grant
Display device with alternating fan-out lines
- Patent number 12,022,699
- Issue date Jun 25, 2024
- Samsung Display Co., Ltd.
- Tae Jong Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of forming a joint assembly
- Patent number 12,009,335
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus
- Patent number 11,995,277
- Issue date May 28, 2024
- Samsung Display Co., Ltd.
- Kiwook Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Profiled thermode
- Patent number 11,910,533
- Issue date Feb 20, 2024
- Pragmatic Printing Ltd
- Neil Davies
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device including adhesive film with conductive ball
- Patent number 11,824,034
- Issue date Nov 21, 2023
- Samsung Display Co., Ltd.
- Joo-nyung Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus
- Patent number 11,720,213
- Issue date Aug 8, 2023
- Samsung Display Co., Ltd.
- Kiwook Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Anisotropic conductive film and display device using the same
- Patent number 11,683,963
- Issue date Jun 20, 2023
- SAMSUNG DISPLAY CO., LTD.
- Chungseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite semiconductor component having projecting elements projec...
- Patent number 11,527,521
- Issue date Dec 13, 2022
- OSRAM OLED GmbH
- Lutz Hoeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,380,692
- Issue date Jul 5, 2022
- SK Hynix Inc.
- Ki Hong Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Display apparatus
- Patent number 11,360,621
- Issue date Jun 14, 2022
- Samsung Display Co., Ltd.
- Kiwook Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Structure and method of forming a joint assembly
- Patent number 11,355,468
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus with thin pad-area insulator and method of manufa...
- Patent number 11,152,440
- Issue date Oct 19, 2021
- Samsung Display Co., Ltd.
- Yujin Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked device, stacked structure, and method of manufacturing stac...
- Patent number 11,011,499
- Issue date May 18, 2021
- FUJIFILM Corporation
- Yoshinori Hotta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus
- Patent number 10,990,233
- Issue date Apr 27, 2021
- Samsung Display Co., Ltd.
- Kiwook Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display devices and methods for forming the same
- Patent number 10,985,150
- Issue date Apr 20, 2021
- Innolux Corporation
- Yuan-Lin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure, 3DIC structure and method of fabricating t...
- Patent number 10,886,245
- Issue date Jan 5, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding package components through plating
- Patent number 10,840,212
- Issue date Nov 17, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded-bridge substrate connectors and methods of assembling same
- Patent number 10,727,197
- Issue date Jul 28, 2020
- Intel IP Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of forming a joint assembly
- Patent number 10,643,965
- Issue date May 5, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus
- Patent number 10,615,242
- Issue date Apr 7, 2020
- Samsung Display Co., Ltd.
- Kiwook Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display devices and methods for forming the same
- Patent number 10,593,657
- Issue date Mar 17, 2020
- Innolux Corporation
- Yuan-Lin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,566,335
- Issue date Feb 18, 2020
- SK Hynix Inc.
- Ki Hong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and display device using the same
- Patent number 10,217,807
- Issue date Feb 26, 2019
- Samsung Display Co., Ltd.
- Chungseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET semiconductor structure having hybrid substrate and method o...
- Patent number 10,163,731
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Cheng Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method for connecting two wafers
- Patent number 10,134,707
- Issue date Nov 20, 2018
- Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung E.V.
- Kai Zoschke
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor package having stacked chips and a heat dissipation p...
- Patent number 9,875,992
- Issue date Jan 23, 2018
- Samsung Electronics Co., Ltd.
- Junyeong Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor laser structure
- Patent number 9,653,382
- Issue date May 16, 2017
- Industrial Technology Research Institute
- Jui-Ying Lin
- G02 - OPTICS
Information Patent Grant
Method and apparatus for a seal ring structure
- Patent number 9,650,243
- Issue date May 16, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ying Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sealing structure for a bonded wafer and method of forming the seal...
- Patent number 9,653,312
- Issue date May 16, 2017
- Semiconductor Manufacturing International (Shanghai) Corporation
- Yuankun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical coupling module
- Patent number 9,613,886
- Issue date Apr 4, 2017
- Industrial Technology Research Institute
- Jui-Ying Lin
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
MEMORY DEVICES, AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME
- Publication number 20240347498
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Daesik MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321831
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Insup SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method of Forming a Joint Assembly
- Publication number 20240282743
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240096725
- Publication date Mar 21, 2024
- Amkor Technology Singapore Holding Pte. Ltd
- Dae Young PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240038745
- Publication date Feb 1, 2024
- WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Zhou ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS
- Publication number 20230350524
- Publication date Nov 2, 2023
- SAMSUNG DISPLAY CO., LTD.
- Kiwook KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230092639
- Publication date Mar 23, 2023
- Rohm Co., Ltd.
- Satoshi Kageyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIT PIXEL FOR LED DISPLAY AND LED DISPLAY APPARATUS HAVING THE SAME
- Publication number 20220336427
- Publication date Oct 20, 2022
- Seoul Viosys Co., Ltd.
- Jong Min JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS
- Publication number 20220308698
- Publication date Sep 29, 2022
- SAMSUNG DISPLAY CO., LTD.
- Kiwook KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Structure and Method of Forming a Joint Assembly
- Publication number 20220302069
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20210399077
- Publication date Dec 23, 2021
- SAMSUNG DISPLAY CO., LTD.
- TAE JONG EOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY STRUCTURE AND MANUFACTRUING METHOD THEREOF
- Publication number 20210335980
- Publication date Oct 28, 2021
- WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Jinxue WENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROFILED THERMODE
- Publication number 20210307225
- Publication date Sep 30, 2021
- PRAGMATIC PRINTING LTD.
- Neil DAVIES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20210288015
- Publication date Sep 16, 2021
- SAMSUNG DISPLAY CO., LTD.
- Joo-nyung JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS
- Publication number 20210240301
- Publication date Aug 5, 2021
- SAMSUNG DISPLAY CO., LTD.
- Kiwook KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR FABRICATING AN ELECTRONIC DEVICE
- Publication number 20210125957
- Publication date Apr 29, 2021
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Jean BRUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composite Semiconductor Component and Method for Producing a Compos...
- Publication number 20200411493
- Publication date Dec 31, 2020
- OSRAM OLED GmbH
- Lutz Hoeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200411618
- Publication date Dec 31, 2020
- SAMSUNG DISPLAY CO., LTD.
- Yujin JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, 3DIC STRUCTURE AND METHOD OF FABRICATING T...
- Publication number 20200381379
- Publication date Dec 3, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED-BRIDGE SUBSTRATE CONNECTORS AND METHODS OF ASSEMBLING SAME
- Publication number 20200328182
- Publication date Oct 15, 2020
- Intel IP Corporation
- Bernd WAIDHAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS
- Publication number 20200235192
- Publication date Jul 23, 2020
- SAMSUNG DISPLAY CO., LTD.
- Kiwook KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Device for Attaching Two Elements Such as a Chip, an Interposer and...
- Publication number 20200198962
- Publication date Jun 25, 2020
- TRONIC'S MICROSYSTEMS
- Valérie Volant
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DISPLAY DEVICES AND METHODS FOR FORMING THE SAME
- Publication number 20200176430
- Publication date Jun 4, 2020
- InnoLux Corporation
- Yuan-Lin WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE STRUCTURES WITH COMPONENT ON SUBSTRATE POST
- Publication number 20200176286
- Publication date Jun 4, 2020
- X-Celeprint Limited
- Robert R. Rotzoll
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200152642
- Publication date May 14, 2020
- SK HYNIX INC.
- Ki Hong LEE
- G11 - INFORMATION STORAGE
Information Patent Application
Structure and Method of Forming a Joint Assembly
- Publication number 20200006276
- Publication date Jan 2, 2020
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DEVICE, STACKED STRUCTURE, AND METHOD OF MANUFACTURING STAC...
- Publication number 20190363068
- Publication date Nov 28, 2019
- FUJIFILM CORPORATION
- Yoshinori HOTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE USING THE SAME
- Publication number 20190148478
- Publication date May 16, 2019
- SAMSUNG DISPLAY CO., LTD.
- Chungseok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180358365
- Publication date Dec 13, 2018
- SK HYNIX INC.
- Ki Hong LEE
- G11 - INFORMATION STORAGE
Information Patent Application
FINFET SEMICONDUCTOR STRUCTURE HAVING HYBRID SUBSTRATE AND METHOD O...
- Publication number 20180301384
- Publication date Oct 18, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Cheng Ching
- H01 - BASIC ELECTRIC ELEMENTS

the layer connector connecting to a bonding area protruding from the surface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device with alternating fan-out lines

Structure and method of forming a joint assembly

Display apparatus

Profiled thermode

Display device including adhesive film with conductive ball

Display apparatus

Anisotropic conductive film and display device using the same

Composite semiconductor component having projecting elements projec...

Semiconductor device and manufacturing method thereof

Display apparatus

Structure and method of forming a joint assembly

Display apparatus with thin pad-area insulator and method of manufa...

Stacked device, stacked structure, and method of manufacturing stac...

Display apparatus

Display devices and methods for forming the same

Semiconductor structure, 3DIC structure and method of fabricating t...

Bonding package components through plating

Embedded-bridge substrate connectors and methods of assembling same

Structure and method of forming a joint assembly

Display apparatus

Display devices and methods for forming the same

Semiconductor device and manufacturing method thereof

Anisotropic conductive film and display device using the same

FinFET semiconductor structure having hybrid substrate and method o...

Bonding method for connecting two wafers

Semiconductor package having stacked chips and a heat dissipation p...

Semiconductor laser structure

Method and apparatus for a seal ring structure

Sealing structure for a bonded wafer and method of forming the seal...

Optical coupling module

Patents Applicationslast 30 patents

MEMORY DEVICES, AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME

SEMICONDUCTOR PACKAGE

Structure and Method of Forming a Joint Assembly

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

DISPLAY DEVICE

DISPLAY APPARATUS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

UNIT PIXEL FOR LED DISPLAY AND LED DISPLAY APPARATUS HAVING THE SAME

DISPLAY APPARATUS

Structure and Method of Forming a Joint Assembly

DISPLAY DEVICE

DISPLAY STRUCTURE AND MANUFACTRUING METHOD THEREOF

PROFILED THERMODE

DISPLAY DEVICE

DISPLAY APPARATUS

METHOD FOR FABRICATING AN ELECTRONIC DEVICE

Composite Semiconductor Component and Method for Producing a Compos...

DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR STRUCTURE, 3DIC STRUCTURE AND METHOD OF FABRICATING T...

EMBEDDED-BRIDGE SUBSTRATE CONNECTORS AND METHODS OF ASSEMBLING SAME

DISPLAY APPARATUS

Device for Attaching Two Elements Such as a Chip, an Interposer and...

DISPLAY DEVICES AND METHODS FOR FORMING THE SAME

MODULE STRUCTURES WITH COMPONENT ON SUBSTRATE POST

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Structure and Method of Forming a Joint Assembly

STACKED DEVICE, STACKED STRUCTURE, AND METHOD OF MANUFACTURING STAC...

ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE USING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

FINFET SEMICONDUCTOR STRUCTURE HAVING HYBRID SUBSTRATE AND METHOD O...